▪Directed and oversaw the allocation of over $8 million in SOGA and SFAB grants to support student organizations.▪ Judged the continuation and allocation of the Student Activity Fee, ensuring optimal allocation of Purdue funds.▪ Consulted for the Purdue Student Government Senate and the Office of the Executive Vice President and Treasurer.

● Authored a detailed playbook for Eaton services, optimizing processes for USPS engagements.● Crafted email templates for streamlined site updates and one-line/relay requests from Amazon, enhancing communication efficiency.● Designed an inventory form for meticulous documentation of bolted pressure switch inspections, deliveries, and testing.● Conducted a thorough audit of Amazon Fulfillment Service reports, presenting actionable insights to the project manager ● Led a business process improvement for USPS procedures, reforming business practices for improved operational efficiency.● Hands on training with field service technicians on breaker equipment.

●Founded a student led national chapter with over 170 members focusing on bridging the gap between students and the semiconductor industry.● Led the raising, allocation, and implementation of tens of thousands of club funds into community and university events.● Oversaw and worked with student committees to strategies and create events to further student involvement and awareness of the semiconductor industry● Created a general ledger system for immediate and accurate funds tracking

Performing studies and researching in the roll-to-roll manufacturing process and dissolvable packaging field. Activities include literature reviews, analysis and application of new manufacturing techniques, data measurement, investigation of environmental and material characteristics, yield optimization, and variable manipulation. My contribution in dissolvable packaging is utilized in the published article "Additive Manufacturing Based Dissolvable Chip Packaging for Sustainable E-Waste Reduction".

Purdue Summer Training, Awareness, and Readiness for Semiconductors (STARS) was a new eight-week program that I was a part of in the summer 2023 to develop deep-tech skills like IC design, fabrication, packaging, and semiconductor device and materials characterization. STARS is envisioned as the equivalent of a summer internship. As a member of the manufacturing track, I participated in hands-on activities, research and projects in the Cleanroom.Through my time in the STARS program, I have:●Developed expertise in chip fabrication, semiconductor materials, and device characterization.●Acquired skills in cleanroom safety, lithography, thin film deposition, etching techniques, thermal processes, ion implantation, and chemical mechanical polishing.●Proficient in material characterization techniques including atomic force microscopy, x-ray diffraction, and electron microscopy.●Experienced in device characterization, particularly in measuring and analyzing MOSCAP and MOSFET performance and reliability.●Utilized a combination of online and in-person instruction, interactive discussions, virtual and hands-on training in the vFabLab and cleanroom, and video tutorials.●Developed a deep understanding of the various stages of chip production, materials analysis, and device characterization.

Through an internship with Pepco a subsidiary of Exelon, I learned the inner working of the US electrical grid, its growth, operation, maintenance, and how future problems affect the grid. Participated in market research and assignments surrounding reliability of the Eaton grid system. I also interviewed key Pepco (PHI) and Exelon members and developed a deeper understanding of the dynamics of a corporate office as well as utility company operations.