Since joining Dolphin-Design , I have put my activities with PB Associates on the backburner.Now fully dedicated to Dolphin-Design development and success.
Pb-Sas
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Semiconductor-Market Technical, Commercial And Financial Advisor.Pb-SasGrenoble, Fr
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CeoDolphin Design Sas Dec 2018 - PresentMeylan, Rhône-Alpes, France
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PresidentPb Associates - Membre Du Réseau Wikane Jan 2018 - Nov 2018Region Rhone-Alpes, France.
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Vice PresidentIdemia Oct 2015 - Jan 2018Colombes / Paris Area, FranceHead of the company Global Supply-Chain and Q.S.C.R (Quality, Security and CSR).IDEMIA is a World leader in embedded digital securityIDEMIA was created in 2017 by the merger between OBERTHUR TECHNOLOGIES and MORPHO, a branch of SAFRAN. 2015 October – 2018 January -
Vice President, Head Of Operations, Egineering And QualityEricsson Aug 2013 - Sep 2015Geneva Area, SwitzerlandIn charge of all activities related to manufacturing and quality such as:Manufacturing set-up & control, Product & Test engineering, Supply-chain system installation and its daily management , Quality (products, suppliers and management system), Sourcing and procurement, Enablement for design in newest technologies for the newly created Modem Business-Unit of Ericsson.Modem Business Unit (BMOD) was a fabless semiconductor organization specialized in high-End multi-modes MODEM chipsets for the wireless industry. -
Senior Vice President, Head Of Operations And QualitySt-Ericsson Aug 2011 - Aug 2013GenevaAs head of Operation and Quality, reporting to CEO, I managed the following activities:Supply-Chain , Capacity planning and Assets Management, Production planning (order fulfillment and customer service), Production and cost control, Strategic Sourging and Purchasing, Hardware Chipset platform Manufacturing and Supply-Chain, Product and Supplier Quality Assurance, New products Quality & Reliability, Quality Management System. -
Senior Vice President, Head Of R&D Shared ServicesSt-Ericsson Nov 2009 - Jan 2012Geneva Area, SwitzerlandAs head of R&D shared services and reporting to the CEO, I was in charge of:- High performance ARM based CPU sub-systems development- Proprietary high performance DSP and associated tools development- Creation and Management of a company level Methods & Tools department (PLCM, PDM...)- Creation and Management of a centralized Modem HW platform manufacturing and supply-chain services -
Vice President, Head Of IntegrationSt-Ericsson Aug 2007 - Oct 2009Grenoble Area, FranceWithin about 2 years, ST-Microelectronics, NXP wireless and Ericsson-Mobile-Platform divisions have combined their wireless semi-conductor activities and technologies to create, in several steps, ST-Ericsson.During this M&A context and period, I participated to pre-closing negotiations (Manufacturing contracts, Transitional services Agreements and R&D services agreements) and I managed the integration activities that led to the final ST-Ericsson setup. -
Group Vice President, General Manager Display DivisionStmicroelectronics Oct 2004 - Sep 2007Grenoble Area, FranceFull P/L responsibility, Strategy, Product Roadmap, Business Development, R&D, Engineering, Capacity planning and order fulfillment, Financial control, Business management.Global role and organization.The Display Division was in charge of all ST Microelectronics chips for CRT (Cathode Ray Tube) displays and drivers for flat panel displays of various technologies (Plasma, passive-active-smallsize-large size LCD drivers, OLED & ePaper drivers). -
From Marketing Engineer To Business Unit DirectorStmicroelectronics Jan 1991 - Sep 2004Grenoble Area, FranceDuring those great 14 years, I have transitioned from a pure technical to a business and management role (Technical Marketing Engineer, Technical Marketing manager, Marketing and Application laboratory manager and finally Business Unit Director).First activity consisted in defining and launching a new product line for, at that time, emerging color monitor market. Then, I have enlarged my scope of activity by embarking on new emerging product lines for flat panel technologies. Ultimately, I had the full P/L responsibility for my Business Unit and was directly in charge of: Product and go-to-market strategy, product roadmap, R&D, customer satisfaction (quality, Service, Technical performances) -
From Analog Ic Designer To Analog & Mixed-Signal Ic Design LeaderThomson Semi-Conductor, Deutsch Thomson Brandt And Thomson Multimedia Feb 1982 - Dec 1990Lyon/France,Villingen-Schwenningen/Germany & Strasbourg/FranceI started the 9 first years of my professional life as an analog IC designer and became later Design leader and project manager for Mixed Signal chip design. During this designer phase I have worked on many type of chips such as: Color decoding for analog TV, Interface chips for CCD camera, Intermediate-frequency sound-demodulator for TV, High-Voltage video amplifiers (250V), Clock generator chips, VCR signal processing chips, Multi-frequency deflection processor for advanced TV.I hold over 10 patents and participated and presented paper to IEE conferences.This first very technical path was a crucial help for later embarking in my Business, Marketing and Operation roles.
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