Leading a 30 person team to develop the next generation medium energy flagship implanter (Purion M2, both Si & SiC). Instrumental in doubling tool sales every yearfor the past 3 years (from 39 field tools in 2021 to 148 in 2024).New HW & SW features and improvements include both hot mechanical clamp andhot electrostatic chuck, beam angle control, patterned implant, wafer throughput, front- and back-side particle and metal contamination reduction, and renewed SEMI compliance.

Lead teams (20 to 50 people) to develop the Purion H2, H3, H5 flagship highdose implanters. During that time focused on front- and back-side particle reduction on the Purion H (H) as well as on the next generation Purion Dragon (D). Improved 34nm node particle spec from 65% compliance to >90% in 2017 and similar improvement for 32nm node in 2018-2019. Reduced PM time from 130 hrs/mon to 31 hrs/mon (D) & from 9% to <5% (H) in 2020. Reduced CoC by 40% (D) and 10% (H) in 2020.

Lead a 53 person engineering team for continuous improvement and new development of our flagship high dose implanter Optima HDx. Responsible for all the design, verification, and validation at multiple customer sites. Approved all controllable spending ($2.4M/year) of the $11M total budget project, and managed the daily allocation of all resources (people and equipment).

Lead a 15 person team to develop the new advanced process module for our flagship strip platform, able to meet the requirements for 32nm node technology and beyond. Responsible for the $1M budget, business plan, scheduling, resource allocation, all technology development design and verification as well as validation at the first customer sites. The module is capable of running new chemistries including 100% hydrogen and other reducing and oxidizing chemistries. It uses a novel plasma distribution system and high temperature wafer heating. We also enhanced the tool’s self-cleaning & self-detection schemes for premature failure. We developed two in-situ effluent management systems including an ICP plasma source downstream of the process chamber.

Led a team of 6 scientists and 6 engineers and designers to develop new dry strip technologies for current and future tools. I was responsible for the group’s $1.2M annual budget as well as a $1M new product development budget.We developed several plasma sources for a future 450mm wafer dry strip system. Technologies being investigated were downstream microwave (MW), medium pressure MW torch with rastering chuck, and inductively coupled (ICP) RF.

2007: Led a team consisting of 20 HW and SW engineers and scientists to redesign a plasma source over a 6 month period in order to correct several failure modes found at a customer site. The team was divided into four groups: failure investigation, failure detection, controls, and source redesign. Responsible for the allocation of all tools and resources for this project. Heavily interacted with marketing, product support and the customer to resolve the issue and ensure good communication among all groups.2006: Led advanced strip technology development program to minimize substrate damage for the 45nm technology node. Effort included both strip process development and plasma source development. Source technologies included downstream microwave plasma (both lamp- and chuck-based), reactive ion etch (RIE), ICP-RF, and medium pressure plasma torch. 2005: One of three co-managers that led a team to design a low-cost high-volume multi-chamber bulk-strip and UV curing platform (Integra, previously called SORBUS). This platform was Axcelis’ premier strip tool with 400 wafer/hour throughput.Author of three invention disclosures in 2005-6 regarding the design of photoresist dry strip tools.

Headed feasibility group in machine vision. Managed 2 to 5 engineers during each project. Projects included feasibility studies, specification, design, implementation and testing of system hardware and software.Consulted companies to determine their product’s lifetimes and developed platforms for their future products.