Ping Ji Email & Phone Number

Burnaby, British Columbia, Canada

Staff Engineer, Process Development EngineeringNew Product Introduction Team Lead- Job Responsibilities:o Member of Icron hardware design team which leading hardware design and implementation for USB extended solution.o Team leader of new product introduction team to manage the NPI launching and HVM sustaining in APAC PCBA manufacturing supplier.o Coordinate the mechanical design between PCB designer and outsourcing mechanical engineer team, validate the 2D CAD drawing and Solidworks 3D stp files.o Hardware schematic DRC, BOM management and parts sourcing.o Lead none-conformance investigation and improvement action.o Technical program adviser for multi-MFG activities.o Python and Cypress SDK programmer to support auto-test-system deployment.- Key Projects:o Auto-test-system deployment at PCBA supplier (2019)o Auto-hot-key program and jig design to support customized CPLD FW upgrade (2020)o Hardware and software design to achieve the USB type C different polarity MFG testing (2020)

Shanghai, China

Supplier Quality Engineering - Job Responsibilities:o Team Center PLM system user, follow up with design team to submit ECO to fix the part outline drawing and upgrade the specificationo Supplier conformance audito APQP launching for new product introductiono Regular supplier process analysis and capability assessment

Shanghai, China

Package Development, Assembly NPI & Operation - Job Responsibilities:o Oracle PLM tool coordinator, expert user of Agile and SAP systemo Lead the ECO activity to construct product BOM (bill of material).o Champion to submit the ECO to upgrade the specification and follow up the acknowledge of implementations from multi-suppliers.o Manage the APAC OSAT assembly and packing engineeringo New product sourcing, package form factor & bill of material finalizationo Lead the new package risk assessment, characterization & qualification plan and executiono Take responsibility for die &IC level packing material fitting analysis/selection/qualificationo Coordinate the RMA and root cause investigationo Schedule control/ qualification management/ LVM ramp up/ yield enhancement engagemento Drive the quality system improvement from contract manufacturero Conduct QOS audit and poke yoke benchmark activityo Lead the review of regular SPC and new machine/tooling statistical analysis report- Key Projects:o Web form data base transition to Agile PLM system (2012)o Agile PLM system migration to Oracle PLM system (2015)o Copper wire bonding overall benchmark and enhancement (2012-2014)o Integration of visual inspection/packing specification (2013)o ASE Malaysia post test startup (2015)o 90/65/40/28nm node ASIC product wire bonding development (2012-2017)- Achievements:o Fusion-quad (integration of QFP and QFN) package development (2012-2013)o Co-work with substrate supplier to minimize the chlorine impact in intermetallic (2014)o Advanced dual-raw QFN package implementation (2015)o 28nm product characterization and high-volume manufacturing (2016)

Shanghai, China

Senior New Product Introduction Engineer - Job Responsibilities:o Manage the engineering/customer sample build in Sandisk SH factory, STATS ChipPAC, EEMSo Select process flow and bill of material to set up the factory product databaseo Lead the new product introduction procedure of Memory Stick Micro Cardo Coordinate the new package design with the Sandisk Milpitas teamo Work as the team member of the memory transition project and coordinate with US design team and TOSHIBA fabrication plantso Make the milestone for new product phase ino Take part in the regular conference call with US NPI team and testing team to cover the qualification schedule and key OEM sample delivery date- Key Projects:o Agile product database successfully phase in (2008)o 32nm NAND Memory Stick card ramp up (2009) o 8-layer stacked microSD card high volume manufacturing (2010)o Initiate the reclaim process flow of down-bin NAND flash (2011)- Achievements:o 32nm node NAND flash with removable/embedded package type launching (2008) - M2, MicroSD, SD, MSPDo 24nm node NAND flash launching (2010) – MicroSD, SD, iNANDo 19nm node NAND flash launching (2012) – MicroSD, SD, iNAND

Shanghai, China

Process Engineer and Product Engineer - Job Responsibilities:o Make wire bond program for PBGA and EDHSBGA on K&S wire bond machineo Manage TFBGA and LFBGA wire bond processo Be accomplished in fulfilling wire bond Qual lot in different package styleo Improve relative process quality and optimize wire bond programo Involve in the product failure analysis and ascertain the cause of failureo Take part in the failure analysis of the relative product and supply 8D report & improvement plan for customer- Key Projects:o Evaluate the 40&46um ball placement accuracy for AB3639eagle bonding machine (2005)o Conduct BSOB (normal bond & reverse bond) for AB339Eagle and Eagle60 bonder (2005)o Assess the long-life capillary for EDHSBGA and realize the mass production (2006)o Gold wire evaluation for MITSUBISHI Q29 and K&S AW99 applied in forward folded loop (2006)o Take part in the conversion program on gold wire changing from 1.0mil to 0.8mil for QFP package style (2007)- Achievements:o Improve the loop style to original loop+BGA5 loop and BGA4+BGA5 loop for same size 2+1 stack die package (2005)o Finish the 99&&99.9% gold wire evaluation (2006)o Accomplish 65nm Low K wafer evaluation (2006)o In charge of the new big map size substrate and leadframe cost down project (2007)

Bachelor Of Science (Bs), Materials Sciences

Program, Accouting I