Developed mechanisms for etch simulator to accurately predict etch profile. Incorporated process changes in etch model to predict sensitivity of process changes on etch profile. Delivered application support to customers. Provided process support to customers.• Developed building blocks for mechanism creations in KLA ProEtch App (for etch process simulation), significantly reducing time and effort of process optimization.• Assisted Intel Inc. developing new etch processes, significantly reducing time / effort of process engineers, achieving desired etch profile and reducing cost (by decreasing metrology and process engineers time).• C&F support to Micron Inc., developing novel etch processes.• Served customers setting up new processes, implementing process changes quicker saving time / cost, and incorporating novel process changes achieving desired etch profile.• Reduced number of process parameters / variables achieving optimized recipe with extensive use of data analysis tools.

Managed entire CMP division (20 people). Developed new CMP processes to meet customer needs. Transferred R&D processes to manufacturing. Ramped up / scaled up production and maintained quality of products e.g. yield, defects etc. Trained engineers / technicians for troubleshooting process issues. Delivered good quality products to customers and implemented cost reduction strategy. Extensive data analysis to solve complex process issues and helped business unit make right decision.• Completed source acceptance tests (SAT) of new high volume CMP tools, improving CMP throughput 4X and saved slurry cost 50%.• Released customer product to production i.e., install, demo, training, and release of final product (CMP tools and recipes) at Samtec, New Albany site.• Saved over $2M in tool purchase, Capex, extensively researching tool vendors, extensive interaction (technical / sales) with vendors, finalizing best vendor, and marathon negotiation on pricing.• Developed new CMP processes and implemented daily monitoring of SPC charts for quick resolution of process issues which significantly reduced scrap and saved cost.

Developed strip / etch processes for TSMC, Samsung, Intel. Hands on experience with Lam strip / etch tools with excellent plasma fundamentals. Supported customers on-site for any process / technical issues.• Fixed photoresist remaining issue post strip and provided End Point Detection solution to TSMC, improving product yield and process throughput.• Developed new recipes for crust / residue removal, improving defect performance and reduced process cost.• Developed dielectric etch and conductor etch processes for customers.

Fabricated test structures (small features; trenches / vias) using patterning / CD shrink approach. Demonstrated CMP feasibility of TSV structure with new WN / W + NiB integration scheme.• Proposed e-test device structure, e-test method, and integration scheme characterizing substrate loss in clean processes.• Integrated new metals / materials in process flow, improving device performance.

Sustained and maintained robust CMP processes. Transferred developed R&D processes and recipes to production in Fishkill, NY. Hands on experience with CMP tools with excellent CMP and colloid science fundamentals.• Developed new slurries for metal and barrier CMP, reducing cost and improving product performance.• Developed new CMP processes for defect reduction, improving defect performance and yield.