P M Email & Phone Number

United States

• Developed mechanisms for etch simulator to accurately predict etch profile. Incorporated process changes in etch model to predict sensitivity of process changes on etch profile. Delivered application support to.
• Developed building blocks for mechanism creations in KLA ProEtch App (for etch process simulation), significantly reducing time and effort of process optimization.
• Assisted Intel Inc. developing new etch processes, significantly reducing time / effort of process engineers, achieving desired etch profile and reducing cost (by decreasing metrology and process engineers time).
• C&F support to Micron Inc., developing novel etch processes.
• Served customers setting up new processes, implementing process changes quicker saving time / cost, and incorporating novel process changes achieving desired etch profile.
• Reduced number of process parameters / variables achieving optimized recipe with extensive use of data analysis tools.

New Albany, Indiana, United States

• Managed entire CMP division (20 people). Developed new CMP processes to meet customer needs. Transferred R&D processes to manufacturing. Ramped up / scaled up production and maintained quality of products e.g. yield.
• Completed source acceptance tests (SAT) of new high volume CMP tools, improving CMP throughput 4X and saved slurry cost 50%.
• Released customer product to production i.e., install, demo, training, and release of final product (CMP tools and recipes) at Samtec, New Albany site.
• Saved over $2M in tool purchase, Capex, extensively researching tool vendors, extensive interaction (technical / sales) with vendors, finalizing best vendor, and marathon negotiation on pricing.
• Developed new CMP processes and implemented daily monitoring of SPC charts for quick resolution of process issues which significantly reduced scrap and saved cost.

Fremont, California, United States

• Developed strip / etch processes for TSMC, Samsung, Intel. Hands on experience with Lam strip / etch tools with excellent plasma fundamentals. Supported customers on-site for any process / technical issues.
• Fixed photoresist remaining issue post strip and provided End Point Detection solution to TSMC, improving product yield and process throughput.
• Developed new recipes for crust / residue removal, improving defect performance and reduced process cost.
• Developed dielectric etch and conductor etch processes for customers.

San Jose, California, United States

• Fabricated test structures (small features; trenches / vias) using patterning / CD shrink approach. Demonstrated CMP feasibility of TSV structure with new WN / W + NiB integration scheme.
• Proposed e-test device structure, e-test method, and integration scheme characterizing substrate loss in clean processes.
• Integrated new metals / materials in process flow, improving device performance.

Yorktown Heights, New York, United States

• Sustained and maintained robust CMP processes. Transferred developed R&D processes and recipes to production in Fishkill, NY. Hands on experience with CMP tools with excellent CMP and colloid science fundamentals.
• Developed new slurries for metal and barrier CMP, reducing cost and improving product performance.
• Developed new CMP processes for defect reduction, improving defect performance and yield.

Doctor Of Philosophy - Phd, Chemistry

Master'S Degree, Chemical Engineering

Bachelor'S Degree, Chemical Engineering