Pradeep Manandhar Email & Phone Number

Summary:• An effective advanced technology group manager and innovative technologist with over 15 years of clean room process integration experience in semiconductor industry and National Laboratories.• Highly skilled in various technical aspects of semiconductor micro/nano-fabrication techniques, including optical and electron beam lithography, thin film processes; process integration.• Successfully managed Internal and External programs and projects leading to partnership with commercial and DoD entities playing crucial role in generating funding and constant sources of revenue. • Strong leadership and communication skills in collaborative environments, demonstrated ability in leading, operating, overseeing and directing programs and projects from inception to successful completion.• Proven accomplishment in various aspects of BEOL process flow, metrology and characterization - including process flow design, process optimization, process integration, physical and process characterization etc.• Experience in various software used in computer aided design, data acquisition, data analysis, process optimization (including AutoCAD, L-Edit, Labview, JMP, ImageJ, GenISys etc.)Technical expertise:  Micro- & nano-fabrication:• Nearly 15 years of unique expertise as electron beam lithography chief engineer (JBX6300/9300/9500FS)• Experienced Photolithography engineer (248nm scanner and above)• Physical and chemical vapor deposition (PECVD, LPCVD, ALD, PVD etc.)• Dry and wet etching (RIE, FIB, IBE etc)• Micro-contact printing (CP) and dip-pen nanolithography (DPN) using organic and biological molecules• Electrophoretic & dielectrophoretic assembly of nanoparticles Physical and chemical characterization:• Expertise in Electron Beam Microscopy (SEM, FIB, STEM) for morphological, structural, compositional characterization and TEM sample preparation, with experience in TEM• X-ray techniques (EDS, XRD, XPS) for compositional characterization• Atomic force microscopies (AFM) for morphological, structural and chemical characterization• Ellipsometry, profilometry for topographical characterizationPublication and presentation highlights:• 13 US patents• 11 publications in high-impact journals including Physical Review Letters, Langmuir, Applied Physics Letters, Journal of Physics, IEEE Transaction on Electronic Devices, Nanotechnology and Journal of the Minerals, Metals & Materials Society with over 75 citations• Over 20 presentations in APS, MRS, MMM, SPIE and RONAST (Nepal) conferences

Listed skills include Afm, Thin Films, Nanofabrication, Characterization, and 14 others.