➢ Supporting NTB product bring up. Supporting with setup, product debug, yield improvement activities, cost, capacity, quality & other projects. ➢ Project Scheduled and resource management ➢ Demonstrated cross-function teamwork & collaboration. Experienced in using data analysis tools such as JMP & Excel.

➢ Design to Silicon (D2S) defect analysis and yield improvement using big data analysis, OPC evaluation andWeak-point correlation.➢ Design Risk Assessment (DRA) to identify/predict design weakness and systematic yield impact on 14nm.➢ Used design & silicon vol data analysis for systematic in-line defect root cause identification and reduction.➢ Delivered universal pattern defect mapping across designs and drove solutions for the highest impact defectsat early stages.

➢ Ran multiple successful NPIs in 14nm and derivative technologies with focus on BEOL wafer processing.Played a key role in achieving 100% FTPS.➢ Successful product ownership during NPI product bring up. Supported with setup, product debug, yieldimprovement activities, cost, capacity, quality & other projects.➢ Drove a cost saving project involving inline Cp/Cpk improvement resulting in 1% higher line yield.➢ Reduce Cycle times and GDS-In to Si delivery with continuous baseline execution monitoring. Successfullydrove an OPC optimization project to improve cycle time.➢ Demonstrated cross-function teamwork & collaboration.➢ Experienced in using data analysis tools such as JMP, Excel, GF internal data extraction & analysis tool,Microsoft/Google suite of applications.

➢ Familiar with various Failure Analysis Techniques & Tools: Scanning Electron Microscopy (SEM), FocusedIon Beam (FIB), Chemical Mechanical Polishing, Chemical Etching (Wet, Reactive Ion Etch (RIE)).➢ Conduct routine analytical jobs using defined and documented procedures while meeting or exceeding cycletime and quality standards.➢ Operate a wide variety of failure analysis tools to isolate and image manufacturing defects in order to identifyroot cause of failure.➢ Support various failure modes including logic, memory, and Health of the Line (HOL). Developmethodologies to identify complex failure modes on new products and technologies.➢ Actively participate in team projects, experiments and in continuous improvement processes.