Ben Yang

Ben Yang Email and Phone Number

Hardware Engineer - Semiconductor Intern @ IBM
Los Angeles, CA, US
Ben Yang's Location
Los Angeles, California, United States, United States
About Ben Yang

- Enthusiastic, confident, and pro-active engineer- Experienced in R&D, Operations, and Project management- Currently diving into advanced packaging, chiplets, and vertical power delivery

Ben Yang's Current Company Details
IBM

Ibm

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Hardware Engineer - Semiconductor Intern
Los Angeles, CA, US
Ben Yang Work Experience Details
  • Ibm
    Hardware Engineer - Semiconductor Intern
    Ibm
    Los Angeles, Ca, Us
  • Ucla Henry Samueli School Of Engineering And Applied Science
    Graduate Researcher
    Ucla Henry Samueli School Of Engineering And Applied Science Sep 2024 - Present
    Center for Heterogenous Integration & Performance Scaling (CHIPS)- 48V-PoL power delivery - Thermal management of Si-IF through methanol flash cooling- Integrated passive devices
  • Ibm
    Hardware Engineer - Semiconductor Intern
    Ibm May 2024 - Aug 2024
    Albany, New York, United States
    Chip Bond, Assembly, & Testing team - Developed a characterization method for measuring wafer to wafer interfacial fracture strength, IP submitted- Optimized laser dicing parameters by establishing random forest surrogate model, increased mean die strength by 20%
  • Src Research Scholars Program
    Research Scholar (Texas Instruments)
    Src Research Scholars Program Sep 2023 - May 2024
    Los Angeles, California, United States
    Thermal management of Silicon Interconnect Fabric through two phase flash cooling of Methanol @ UCLA CHIPS
  • Ucla Henry Samueli School Of Engineering And Applied Science
    Consultant
    Ucla Henry Samueli School Of Engineering And Applied Science Mar 2024 - Apr 2024
    Los Angeles, California, United States
    Ensuring smooth transition of lab operations, internship pipeline, and figure design responsibilities to next generation of researchers
  • Ucla Henry Samueli School Of Engineering And Applied Science
    Lead Undergraduate Researcher @ The Ferrobotic Group (I2Bl)
    Ucla Henry Samueli School Of Engineering And Applied Science Mar 2023 - Mar 2024
    Los Angeles, California, United States
    1. Potentiostat & Lyophilization PM: - pcb component choice, design, & testing for a mobile microfluidic potentiostat measuring various biomarkers w/ a focus on enzymatic sensors- PVA film research, design & test novel µ-fluidic chip for powder-phase assay integration2. Business Lead:- design, contact, & conduct market research through regional NSF I-Corps (ZAP & Boom)- following the lean startup methodology to craft a business model canvas through NSF I-Corps- design & adapt pitch decks for various technical/lay audiences & occasions through TDG Innovation Fellows- design & strategize hiring pipeline for Ferrobotic Group + manage quarterly recruitment, scaling to a 15 person team- craft grant, proposal, & paper figures for submission, extremely proficient in PowerPoint3. Operations Director: - manage a 5 person team streamlining operations by developing processes & systems that ensure timely delivery of µ-fluidic chips- improved cleaning yield from 30% to 95% by researching, developing, & implementing various novel approaches to the µ-fluidic chip fab pipeline- research & develop new microfluidic chips to fit adapting test & assay characterization procedures- high precision manufacturing of demo µ-fluidic chips for grants & Nature level publication figures- ensuring documentation database is up to date & maintained properly4. General Project Consulting:- developed new testing & connection method for Ferrobotic two-tiered PCB- implemented corresponding acrylic enclosure to protect wire bridge
  • Ucla Henry Samueli School Of Engineering And Applied Science
    Researcher @ Interconnected & Integrated Bioelectronics Lab (I2Bl)
    Ucla Henry Samueli School Of Engineering And Applied Science Mar 2022 - Mar 2023
    United States
    - Leading a team of 7 in rapid prototyping and testing for a ferrobotic digital microfluidic system split across dry & wet labs- Used AutoCAD to iterate on microfluidic chip designs in order to optimize ferrofluid dispensing, disposing, and delivering of serum samples - Optimized chip fabrication by automating laser printer & tweaking 3M 300LSE layout for a 5 fold increase in throughput & 80% less waste - Crafted automation GUI using Processing - reducing manual labor 10 fold - Organized PCB control Arduino code and developed documentation - Redeveloped hydrophobic surface treatment procedure to reduce wasted material from 45% to 5% as well as increasing efficiency 2 fold- Designed 3d figures for publication & grants using Fusion360 and MS Powerpoint - Wrote extensive documentation for wet lab (assay workflow; Nano-drop, vortex, hot plate & ultrasonic cleaner operation), dry lab (Arduino control & PCB automation setup), and project maintenance (3M 300LSE assembly, microfluidic chip design, fabrication, cleaning, & hydrophobic treatment) - Designed DMF chip to validate ELISA assays on our platform, optimized assembly process & chip design to decrease measurement error 50 fold
  • California Nanosystems Institute At Ucla
    Lab Assistant
    California Nanosystems Institute At Ucla Jun 2023 - Mar 2024
    Los Angeles, California, United States
    - Photomask layout & printing using AutoCAD- Daily operations for CNSI cleanroom (equipment upkeep & stocking, pulling chemical waste, resetting & fixing equipment alarms)
  • Tsinghua University
    Research Assistant @ Ren Group
    Tsinghua University Jul 2021 - Sep 2021
    Beijing, China
    - Investigated economical mechanical exfoliation techniques turning tellurium into nm thick layers to use as a high performance thermoelectric - Operated Leica DCM8 digital microscope and AFM in an ISO 6 clean room - Drafted & edited comprehensive literature review of biocompatible sensors focusing on ingestible capsules (cams, sensors, & surgical pills)
  • Tsinghua University
    Engineering Intern @ Actenna Technology
    Tsinghua University Jul 2020 - Sep 2020
    Beijing, China
    - Learning PCB prototyping & designing using Cadence- Practiced 3d modeling skills using Solidworks to design antenna casing - Assembled electromagnetic surface phased array antenna & casing - Worked under 3 senior engineers to calibrate antenna & demonstrate real-world outdoor transmissions in order to satisfy client specifications
  • Massachusetts Institute Of Technology
    Research Assistant @ Terahertz Integrated Electronics Group
    Massachusetts Institute Of Technology Jul 2019 - Aug 2019
    Boston, Massachusetts, United States
    - Designed, coded, and carried out operational parameter tests for a Chip Scale Molecular Clock using Matlab scripts and RF lab equipment - Drafted easily parseable documentation - Published in IEEE Solid-State Circuits, doi: 10.1109/JSSC.2020.3021335
  • Ucla Henry Samueli School Of Engineering And Applied Science
    Research Assistant @ Digital Microwave Lab
    Ucla Henry Samueli School Of Engineering And Applied Science Jul 2018 - Aug 2018
    Los Angeles, Ca
    - Designed and executed Q factor tests for a novel magnetic pendulum antenna using a power supply, signal generator, and an oscilloscope - Developed a novel reflective surface attachment using 3D printed support units on magnetic array elements for oscillation angle measurement - Presented research findings in end-of-term presentation & report

Ben Yang Education Details

Frequently Asked Questions about Ben Yang

What company does Ben Yang work for?

Ben Yang works for Ibm

What is Ben Yang's role at the current company?

Ben Yang's current role is Hardware Engineer - Semiconductor Intern.

What schools did Ben Yang attend?

Ben Yang attended Ucla, University Of California, Los Angeles.

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