Ben Yang
AeroLeads people directory · profile

Ben Yang Email & Phone Number

Location: Los Angeles, California, United States 13 work roles 2 schools
LinkedIn matched
✓ Verified July 2026 3 data sources Profile completeness 86%

Contact Signals

LinkedIn Profile matched
3 free lookups remaining · No credit card
Role
Graduate Researcher
Location
Los Angeles, California, United States
Company size

Who is Ben Yang? Overview

A concise factual answer block for searchers comparing this professional profile.

Quick answer

Ben Yang is listed as Graduate Researcher at UCLA Henry Samueli School of Engineering and Applied Science, a with 893 employees, based in Los Angeles, California, United States. AeroLeads shows a matched LinkedIn profile for Ben Yang.

Ben Yang previously worked as Hardware Engineer - Semiconductor Intern at Ibm and Hardware Engineer - Semiconductor Intern at Ibm. Ben Yang holds Master'S Degree, Electrical And Computer Engineering from Ucla.

Company email context

Email format at UCLA Henry Samueli School of Engineering and Applied Science

This section adds company-level context without repeating Ben Yang's masked contact details.

UCLA Henry Samueli School of Engineering and Applied Science

Review company-level records connected to Ben Yang before choosing the right outreach path.

Profile bio

About Ben Yang

- Enthusiastic, confident, and pro-active engineer- Experienced in R&D, Operations, and Project management- Currently diving into advanced packaging, chiplets, and vertical power delivery

Current workplace

Ben Yang's current company

Company context helps verify the profile and gives searchers a useful next step.

UCLA Henry Samueli School of Engineering and Applied Science
Ucla Henry Samueli School Of Engineering And Applied Science
Graduate Researcher
Los Angeles, CA, US
Employees
893
AeroLeads page
13 roles

Ben Yang work experience

A career timeline built from the work history available for this profile.

Hardware Engineer - Semiconductor Intern

Ibm

Los Angeles, Ca, Us

Hardware Engineer - Semiconductor Intern

Ibm

Albany, New York, United States

Chip Bond, Assembly, & Testing team - Developed a characterization method for measuring wafer to wafer interfacial fracture strength, IP submitted- Optimized laser dicing parameters by establishing random forest surrogate model, increased mean die strength by 20%

May 2024 - Aug 2024

Research Scholar (Texas Instruments)

Los Angeles, California, United States

Thermal management of Silicon Interconnect Fabric through two phase flash cooling of Methanol @ UCLA CHIPS

Sep 2023 - May 2024

Lead Undergraduate Researcher @ The Ferrobotic Group (I2Bl)

Los Angeles, California, United States

1. Potentiostat & Lyophilization PM: - pcb component choice, design, & testing for a mobile microfluidic potentiostat measuring various biomarkers w/ a focus on enzymatic sensors- PVA film research, design & test novel µ-fluidic chip for powder-phase assay integration2. Business Lead:- design, contact, & conduct market research through regional NSF I-Corps (ZAP & Boom)- following the lean startup methodology to craft a business model canvas through NSF I-Corps- design & adapt pitch decks for various technical/lay audiences & occasions through TDG Innovation Fellows- design & strategize hiring pipeline for Ferrobotic Group + manage quarterly recruitment, scaling to a 15 person team- craft grant, proposal, & paper figures for submission, extremely proficient in PowerPoint3. Operations Director: - manage a 5 person team streamlining operations by developing processes & systems that ensure timely delivery of µ-fluidic chips- improved cleaning yield from 30% to 95% by researching, developing, & implementing various novel approaches to the µ-fluidic chip fab pipeline- research & develop new microfluidic chips to fit adapting test & assay characterization procedures- high precision manufacturing of demo µ-fluidic chips for grants & Nature level publication figures- ensuring documentation database is up to date & maintained properly4. General Project Consulting:- developed new testing & connection method for Ferrobotic two-tiered PCB- implemented corresponding acrylic enclosure to protect wire bridge

Mar 2023 - Mar 2024

Researcher @ Interconnected & Integrated Bioelectronics Lab (I2Bl)

United States

- Leading a team of 7 in rapid prototyping and testing for a ferrobotic digital microfluidic system split across dry & wet labs- Used AutoCAD to iterate on microfluidic chip designs in order to optimize ferrofluid dispensing, disposing, and delivering of serum samples - Optimized chip fabrication by automating laser printer & tweaking 3M 300LSE layout for a 5 fold increase in throughput & 80% less waste - Crafted automation GUI using Processing - reducing manual labor 10 fold - Organized PCB control Arduino code and developed documentation - Redeveloped hydrophobic surface treatment procedure to reduce wasted material from 45% to 5% as well as increasing efficiency 2 fold- Designed 3d figures for publication & grants using Fusion360 and MS Powerpoint - Wrote extensive documentation for wet lab (assay workflow; Nano-drop, vortex, hot plate & ultrasonic cleaner operation), dry lab (Arduino control & PCB automation setup), and project maintenance (3M 300LSE assembly, microfluidic chip design, fabrication, cleaning, & hydrophobic treatment) - Designed DMF chip to validate ELISA assays on our platform, optimized assembly process & chip design to decrease measurement error 50 fold

Mar 2022 - Mar 2023

Lab Assistant

Los Angeles, California, United States

- Photomask layout & printing using AutoCAD- Daily operations for CNSI cleanroom (equipment upkeep & stocking, pulling chemical waste, resetting & fixing equipment alarms)

Jun 2023 - Mar 2024

Research Assistant @ Ren Group

Beijing, China

- Investigated economical mechanical exfoliation techniques turning tellurium into nm thick layers to use as a high performance thermoelectric - Operated Leica DCM8 digital microscope and AFM in an ISO 6 clean room - Drafted & edited comprehensive literature review of biocompatible sensors focusing on ingestible capsules (cams, sensors, & surgical pills)

Jul 2021 - Sep 2021

Engineering Intern @ Actenna Technology

Beijing, China

- Learning PCB prototyping & designing using Cadence- Practiced 3d modeling skills using Solidworks to design antenna casing - Assembled electromagnetic surface phased array antenna & casing - Worked under 3 senior engineers to calibrate antenna & demonstrate real-world outdoor transmissions in order to satisfy client specifications

Jul 2020 - Sep 2020

Research Assistant @ Terahertz Integrated Electronics Group

Boston, Massachusetts, United States

- Designed, coded, and carried out operational parameter tests for a Chip Scale Molecular Clock using Matlab scripts and RF lab equipment - Drafted easily parseable documentation - Published in IEEE Solid-State Circuits, doi: 10.1109/JSSC.2020.3021335

Jul 2019 - Aug 2019

Research Assistant @ Digital Microwave Lab

Los Angeles, Ca

- Designed and executed Q factor tests for a novel magnetic pendulum antenna using a power supply, signal generator, and an oscilloscope - Developed a novel reflective surface attachment using 3D printed support units on magnetic array elements for oscillation angle measurement - Presented research findings in end-of-term presentation & report

Jul 2018 - Aug 2018
2 education records

Ben Yang education

Master'S Degree, Electrical And Computer Engineering

FAQ

Frequently asked questions about Ben Yang

Quick answers generated from the profile data available on this page.

What company does Ben Yang work for?

Ben Yang works for UCLA Henry Samueli School of Engineering and Applied Science.

What is Ben Yang's role at UCLA Henry Samueli School of Engineering and Applied Science?

Ben Yang is listed as Graduate Researcher at UCLA Henry Samueli School of Engineering and Applied Science.

Where is Ben Yang based?

Ben Yang is based in Los Angeles, California, United States while working with UCLA Henry Samueli School of Engineering and Applied Science.

What companies has Ben Yang worked for?

Ben Yang has worked for Ucla Henry Samueli School Of Engineering And Applied Science, Ibm, Src Research Scholars Program, California Nanosystems Institute At Ucla, and Tsinghua University.

How can I contact Ben Yang?

You can use AeroLeads to view verified contact signals for Ben Yang at UCLA Henry Samueli School of Engineering and Applied Science, including work email, phone, and LinkedIn data when available.

What schools did Ben Yang attend?

Ben Yang holds Master'S Degree, Electrical And Computer Engineering from Ucla.

Find 750M verified contacts

Search by job title, company, industry, location, and seniority. Export verified B2B contact data when you need it.

People with similar names

Check these profiles if this is not the Ben Yang you were looking for.

View similar profiles