Vu Bui Email & Phone Number

Mississauga, Ontario, Canada

Ontario, Canada

Suwon, South Korea

• Implemented Rotational Stage Hole in Dispensing, the solution was deployed in a pilot line of LG Electronics• Stabilized process of micro-dot printing for Dual iEHD printers, attaining dot size of 10um and printing speed of 7600 dot/hr• Developed the process of 100um line dispensing on 3D surface for Hyundai Heating Logo• Invented bended Capillary Glass Nozzle Fabrication in tandem with 2 engineers, achieving 30 degree bended nozzle while keeping tip size of 1um, 2um, 3um, 5um… Show more • Implemented Rotational Stage Hole in Dispensing, the solution was deployed in a pilot line of LG Electronics• Stabilized process of micro-dot printing for Dual iEHD printers, attaining dot size of 10um and printing speed of 7600 dot/hr• Developed the process of 100um line dispensing on 3D surface for Hyundai Heating Logo• Invented bended Capillary Glass Nozzle Fabrication in tandem with 2 engineers, achieving 30 degree bended nozzle while keeping tip size of 1um, 2um, 3um, 5um, 7um and 10 um for induced Electrohidrodynamics printing• Led Electromagnetic interference coating process team, delivering uniform side/top spray coating layer of 8um on RAM• Transferred operation/maintenance process for Samsung Electronics haze coaters, achieving production yield of 95% in 5 lines• Delivered operating/maintenance process for flux spray of Samsung Electronics micro-LED production line, accomplishing production yield of 98%• Identified root causes and troubleshot technical issues, ensuring client satisfaction (clients include Samsung Electronics, LG Electronics, Play Nitride, NUS) Show less

Thai Nguyen, Viet Nam

• Led 150 Techs/Ops, assuring reliability in camera module manufacturing and delivering process training, 5S training• Managed production process, lens-actuator-camera module storages, and packaging storages• Operated cleanroom of production lines including 1000 class, 100 class, and 10 class• Served Task-Force, increasing the production yield to 98%

Suwon, South Korea

• Researched Friction Stir Welding and conductive paste screen printing on flexible substrate• Evaluateed microstructure and mechanical reliability of electronic micro ball grid array joining

Suwon, South Korea

• Developed Ce containing lead-free solder, conductive paste with functionalized carbon nanotubes• Processed the materials/samples, analyzed with scanning electron microscope, optical scope, 3D profile scope• Evaluated microstructure, electrochemical, mechanical properties for lead-free solders/surface finishes (Sn-Ag, Sn-Ag-Cu, Sn-Ag-Ce…) in electronic packaging • Researched Micro-electronic Packaging Technologies: flip-chip, ball-grid-array, ultrasonic bonding, wire-bonding…

Doctor Of Philosophy (Ph.D.), Advanced Materials Science And Engineering

• BK21 Scholarship, GPA: 3.68/4.5, 11 SCI publications (first author: 7), 10 international presentation (first author: 9) • Specialization.

Bachelor Of Engineering (B.E.), Mechatronics, Robotics, And Automation Engineering

• Excellent Engineer Training Program – PFIEV in Vietnam, four semesters scholarships for students with good achievements