Raguraman S Email and Phone Number

 Responsible for Board assembly (SMT) line Setup and New Process Implementation. Responsible for New technology and global project deployment. Responsible for optimization of Board assembly process i.e., Printing, SPI, Placement & Reflow. Receives assignments in the form of objectives and establishes goals to meet objectives. Acts as advisor to subordinate(s) to meet schedules and/or resolve technical problems. Manages the schedule of deliverables agreed to for the engineering units overall. Helps to define requirements, plans, schedules resources effectively, monitors achievements and costs, and removes barriers to the team success. Work is reviewed and measured based on meeting objectives and schedules. Lead New Product & Technology transfer from R & D to manufacturing. Identify the critical spare parts and ensure the availability. Resource planning for the production line support and maintenance. Technical skills/Competency/Multi skilling & MTTR improvement. Corrective measures for the major breakdowns and effectiveness of the measures. PM adherence & Predictive maintenance. Continuous improvement based on the machine failure and lessons learned. Co-ordinate with CFT for the unresolved problems. Compliance on Customer audit, internal, external audits, EHS and ISO audits.

 Responsible for Board assembly (SMT) line Setup and New Process Implementation. Responsible for New technology and global project deployment. Responsible for optimization of Board assembly process i.e., Printing, SPI, Placement & Reflow. Lead New Product & Technology transfer from R & D to manufacturing. Responsible for the product metrics, On time launch, Ramp up, Yield, Scrap, Repair Cost, Quality and Reliability.  Handled new product builds Proto / NPI / Ramp up / Mass production / EOL Return of investment (ROI), Make Vs Buy and risk analysis. Early factory involvement for R&D from product Concept, Development builds, Verification. Design risk assessment and FMEA. Define corrective actions related to design, material, test, and process for yield improvement Develop debug/repair instructions for scrap cost avoidance. Co-ordinate with design team for new part validation, conduction trails and failures analysis. Reduce the Manufacturing Failure Rate, Cost, Scrap in manufacturing. Root cause analysis and Problem solving support to Production & Quality.

 Responsible for Board assembly (SMT) line Setup and New Process Implementation. Responsible for New technology and global project deployment. Responsible for optimization of Board assembly process i.e., Printing, SPI, Placement & Reflow. Lead New Product & Technology transfer from R & D to manufacturing. Responsible for the product metrics, On time launch, Ramp up, Yield, Scrap, Repair Cost, Quality and Reliability.  Handled new product builds Proto / NPI / Ramp up / Mass production / EOL Return of investment (ROI), Make Vs Buy and risk analysis. Early factory involvement for R&D from product Concept, Development builds, Verification. Design risk assessment and FMEA. Define corrective actions related to design, material, test, and process for yield improvement Develop debug/repair instructions for scrap cost avoidance. Co-ordinate with design team for new part validation, conduction trails and failures analysis. Reduce the Manufacturing Failure Rate, Cost, Scrap in manufacturing. Root cause analysis and Problem solving support to Production & Quality.

 Responsible for new technology and process implementation in Board Assembly area in house and Global project deployment. Responsible and coordination for the forecast of new investment in Board Assembly Technology area. Responsible for the design of new process according to the new product needs. Ramp-up process planning of required additional Board Assembly equipment’s based on the process requirement. NPI related activities, preparation and sustaining NPI-BA Processes. Continuous development of program efficiency to improve the productivity through the program optimization. To introduce the development on machine systems to improve productivity and quality way of work; and at the same time safeguarding product pre and post processing. Process yield improvement through failure analysis and implementation of corrective / preventive action. Board Assembly area standardization of MIS/SOP, and Machine controlled parameters standardization for documentation. Follow-up of Board Assembly Process audit criteria implemented by Global as per process standard protocol. Continuous planning on strategic and effective machine maintenance system to improve and control reliability and accuracy of placement machineries (Fuji-NXT). To provide the continuous enhancement of technical capability for Board Assembly Online Support with respect to Placement Machine. Responsible for Board Assembly Process/Quality Control. Coordinating with BA Maintenance team to achieve performance index on capacity, MFR, quality and cost.

 Customer support for any technical issues related to Panasonic Placement Machines & Screen Printers. Servicing support for any breakdown issues at customer end. Leading a team of 5 Service Engineers in Chennai. Installation & Technical Training for customers. Support for Spares management to Flextronics & Foxconn. Process improvement support for customers to improve their process. Supporting for Programming and optimizing the products in Panasonic CM402 & 602 using PT-200 programming software for customers. Evaluation of new Machines for customer’s needs. Training for in house engineers for developing their knowledge on equipment’s. New Part Data creation support for Panasonic CM402 & 602 machines for their new products  Supporting the customers for reducing their component rejection trend. Training the customers for Machine Preventive maintenance as specified by Panasonic.

 Set up of SMT machines for production from Printing Machines, FUJI, PANASONIC, Universal Placement Machine’s, Reflow Oven & AOI machine and validation. Preventive & Break down maintenance for SMT Machines & Feeders. Programming of Fuji, Panasonic and GSM machines. Optimization of wave soldering machine parameters in order to meet the quality. Productivity improvement initiative without any additional investment. KAIZEN Projects applied in SMT Line for the improvement of Equipment bay.

 Programming & SMD machines set up: Fuji series CP6, GL-V, SMT oven Preventive Maintenance of SMD machines: Fuji series CP6, GL-V, SMT oven & Feeders. Setting up of parameters for Wave soldering machine (Ecnopak Gold)

 Programming & Preventive Maintenance of SMD machines: FUJI series machines (CPIV2, GL II, IP-2, MPM-UP2000 automatic and semi-automatic screen printer) Designing of IC Jigs and Fixtures in IC placer machines Programming and maintenance of Reflow & Wave soldering machine.

 Maintenance of Reciprocating and centrifugal Compressor (Khosla, Ingersoll-Rand, Centac) Maintenance of various types of Diesel engines (Cummins, Kirloskar, Skoda, Caterpillar) Maintenance of Vacuum pumps, speed variators, Mono-block pumps. Preparing of Maintenance schedule for various machines