As a Mechanical Design Engineer at Applied Materials, I work on the design and development of wafer handling vacuum robotics platforms for the semiconductor industry. I am deputed from HCL Technologies Ltd.,I have over four years of prior experience in designing and developing mechanical subsystems and assemblies for special purpose machines (SPMs), sheet metal brackets, machined parts, and weldments. I am skilled in 3D computer-aided design (3D CAD), design for manufacturing and assembly (DFMA), tolerance stack-up analysis, and MBD manufacturable drawings. I have a Bachelor of Engineering degree in Mechanical Engineering from Visvesvaraya Technological University.I am passionate about solving technical challenges and providing innovative solutions that optimize mechanical engineering layouts and schematics. I have successfully contributed to multiple projects involving robot reach study analysis, detailed clearance study analysis, part releases in Teamcenter, and BOM list generation. I have also collaborated with cross-functional teams to identify and record the difficulties faced and ensure smooth flow of processes. I am motivated by learning new skills and technologies, and I aspire to grow as a mechanical design engineer in the robotics and semiconductor domain.