Ram Rajagopal

Ram Rajagopal Email and Phone Number

Technology leader focused on systems/customer solutions @ Microsoft
Redmond, WA
Ram Rajagopal's Location
Folsom, California, United States, United States
About Ram Rajagopal

As a director of engineering at Intel Corporation, I have 10+ years of experience in leading and managing data center solutions delivery and customer engineering teams. I have successfully launched custom solutions for key cloud partners, enabled new technologies like CXL, and built customer enabling capabilities from scratch. I have a strong technical background and domain expertise in silicon, board, firmware, software integration, and system development. I have worked across all stages of product life cycle covering exploration, scoping, execution, launch/ramp, and sustaining. I have also tackled multiple development issues with thermal management, high speed design and HW/SW/FW integration. I am passionate about solving difficult problems, working with a variety of stakeholders across multiple geographies, and taking products to market. My goal is to deliver innovative and impactful solutions that meet customer needs and drive business growth.

Ram Rajagopal's Current Company Details
Microsoft

Microsoft

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Technology leader focused on systems/customer solutions
Redmond, WA
Website:
microsoft.com
Employees:
10
Company phone:
0124 415 8000
Ram Rajagopal Work Experience Details
  • Microsoft
    Director, New Technology Engineering Platforms
    Microsoft Aug 2024 - Present
    Redmond, Washington, Us
  • Freelance
    Director Of Engineering
    Freelance Dec 2023 - Aug 2024
  • Intel Corporation
    Director Of Engineering
    Intel Corporation May 2022 - Dec 2023
    Santa Clara, California, Us
    Operated in a startup environment to build a customer engineering organization for custom ASIC Accelerator part. • Built customer enabling capabilities from scratch involving technical collateral and issue resolution that resulted in 6x customer growth. • Built team capabilities to work with ODM for system development, lab capabilities to verify boards/systems that led to 10+ customer demos and successful design wins. • Demo also includes Liquid Immersion Cooling prototype working with an external partner. • Tackled multiple development issues with Thermal management of the system and debugging of ASIC level performance issues. • Worked through silicon, post-silicon validation, backend manufacturing test teams to root cause challenging issues seen by customers in the field. • Managed system sampling & led taskforce for deployment issues customers ran into. Came up with a strategy to support SW driver for customer specific implementations.
  • Intel Corporation
    Senior Engineering Manager
    Intel Corporation Jan 2021 - Jan 2023
    Santa Clara, California, Us
    Manage Datacenter Hardware Solutions Engineering team - hired and expanded team members, integrated experienced team members into the team, launched custom HW solutions for key Cloud Partners to enable new technologies like CXL. Also managed new product development and carrying the product to launch with right quality.
  • Intel Corporation
    Sr. Engineering Manager
    Intel Corporation Jul 2018 - Dec 2020
    Santa Clara, California, Us
    Led the creation of customer solutions and Smart NIC solutions enabling pathfinding team in India. Worked on Business development with local cloud and telco customers like Reliance Jio, Airtel, Vodafone, Flipkart, Zoho and more. Set up a technology enablement center of excellence for Ethernet solutions enabling team. Understood customer deployment models for 5G/Telco, Timing synchronization requirements for networks and presented Intel's product portfolio that covered PTP/SyncE capabilities for customers.
  • Intel Corporation
    Engineering Manager
    Intel Corporation Jun 2013 - Jul 2018
    Santa Clara, California, Us
    Managed 20+ team members who worked across different Tier1 accounts for delivering custom Intel Ethernet soutions. Established communication processes and ironed out requirement collection, communication across several internal organizations, coordinated with engineering to deliver to the needs of the customer, handled customer escalations and represented customer needs in GM level forums. Also served as a key escalation point for customers and developed relationships with the customers and negotiated deliverables.
  • Intel Corporation
    Sr Program Manager
    Intel Corporation Jan 2009 - Jun 2013
    Santa Clara, California, Us
    As program manager for Tier1 accounts like Lenovo & HP (~$80M combined annual revenue), aligned SW/HW schedules, ran PDT with engineering & validation owners to deliver to OEM milestones/address issues. Chaired weekly meetings with multiple customers to track schedules & addressing issues. Supported development of >10 customized server Network Daughter Cards, Mezzanine & Stand-up adapters for OEM Romley launch by creating & maintaining a Statement of Work (SOW) in joint ownership with the customer. Responded to customer RFQ/RFIs for design wins and provided inputs into POP process for getting customer proposals accepted. Handled sustaining issues with shipping adapters/LOMs in parallel. Also, supported several generations of Client platform launches. Ran several taskforces to resolve launch gating issues & reported status to senior management.
  • Intel Corporation
    Sr. Technical Marketing Engineer
    Intel Corporation Jan 2006 - Dec 2010
    Santa Clara, California, Us
    Manage Tier 1 accounts like HP, Lenovo and help then design-in Intel Gigabit Ethernet PHY into their Mobile platforms. Enable designing innovative power saving features to meet Energy Star requirements in client platforms. Participate in trade shows, conduct training for customers and field to ensure a smooth design in cycle for customers.
  • Intel Corporation (Folsom, Ca)
    Sr. Design Engineer
    Intel Corporation (Folsom, Ca) Oct 1999 - Dec 2005
    Owned analog/logic design blocks for Intel StrataFlash memory series. Architected test features that saved millions of dollars, Led logic section for a some projects and ensured smooth progress of design cycle until tape out. Built bus function models, full chip models for validating memory.

Ram Rajagopal Education Details

  • University Of California, Davis - Graduate School Of Management
    University Of California, Davis - Graduate School Of Management
    Marketing
  • University Of California, Davis
    University Of California, Davis
    Marketing & General Management
  • Wright State University
    Wright State University
    Electrical Engineering
  • Annamalai University
    Annamalai University
    Electronics & Instrumentation

Frequently Asked Questions about Ram Rajagopal

What company does Ram Rajagopal work for?

Ram Rajagopal works for Microsoft

What is Ram Rajagopal's role at the current company?

Ram Rajagopal's current role is Technology leader focused on systems/customer solutions.

What schools did Ram Rajagopal attend?

Ram Rajagopal attended University Of California, Davis - Graduate School Of Management, University Of California, Davis, Wright State University, Annamalai University.

Who are Ram Rajagopal's colleagues?

Ram Rajagopal's colleagues are Nathanial Hayden, Ahmad Alomari, Aidan Temple, Tate James, Mike Desilver, Amy June Sousa, Phd, Taslim Bhati.

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