Direct and manage all operations for manufacturing facilities in Illinois and Wisconsin. Also responsible for Supply Chain for all North America and Canada Acoustics facilities. Primary functions include business review, budget planning, metrics, and goals deployment for multi-site operations. This includes continuous organizational improvements for Safety, Quality, Production, and profits.

Oversee and Manage all Materials, Purchasing, Production, Quality Assurance, Maintenance, Engineering, Environmental Management, Shipping and Receiving. Primary functions include business review/planning, all plant operations, material management (inventory and procurement) and continuous improvement throughout the organization. Main products include development of acoustical materials to meet noise, sound quality and thermal challenges on various applications.

Lead Metals BU with 55-person team including Production and Engineering supplying materials for the electronic assembly, components and microelectronic marketplaces. Products include array of traditional chemicals, wire, solder preforms and bar products. Develop optimum work schedules/workflow, coach, develop employees and monitor staff performance. Drive continuous improvements and promote a safe work environment by identifying and preventing incident measures and initiatives. Responsible for inventory management and supply chain for key customers.

• Took responsibility for entire Engineering Team with 7 direct reports and 9 indirect reports including maintenance. • Led strategic Global Footprint Project, resulting in 4 million annualized savings via global cross-functional team consistent of 30 members located in Singapore, Germany, China and USA to execute the Global Project. This included the closing of 2 facilities and the opening of a world class facility in China. Completed project in time and under budget by utilizing Gantt Charts and virtual-team management skills. Project also included specification and purchase of new equipment, hiring, training, managing global inventory during transition periods, startup of new plant, customer sample validations and production ramp up.

• Build and developed Chemical Engineering Team from zero for a total 5 direct reports. • Lead a team of 12 members to understand, analyze and implement a complete ERP system on an entire Division that included 3 product lines with more than 1200 BOMs. • By setting SMART goals and utilizing “Situational Leadership II” tools developed an effective team that that completed 95%+ of their goals and exceeded on 50%+ of them on an annual basis. • Lead transfer of chemical manufacturing plant from Mexico to USA, including installation, optimization and validation. Also took temporary responsibility for managing production while implementing world class process to improve quality and productivity.• Lead global Disaster Recovery Plans to assure products were “copy exact” between USA, Germany and Singapore to mitigate risks.

• By levering Six Sigma methodologies, troubleshoot and corrected multiple processes and products. Lead the transfer of all solder paste products from Mexico to the USA.• Applying In-lining principles lead and implemented the upgrade of the entire chemical flux manufacturing process with fully automatic SPC systems that would alert via email any process deviations. • Achieve maximum control and repeatable results by developing customized PID controls. Due to success of project implemented similar systems in Singapore. Trained peers on SQL programming, statistical analysis, database management, FMEA, Control Plans.

• Developed methods to create copper features with geometries of less than 25 microns at significant conductor thickness. This technology included photolithography, polymer and chemical processes that replaced the existing and high cost mechanical formation techniques. New technology improved the performance by 20%, completely freed the flexibility of new designs that could now use a variety of geometries. This was achieved for a fraction of the cost of the previous methods utilized, also improving the production efficiency.• Granted U.S. Patent 7952848 “Incorporation of ESD Protection to Miniature Connectors”. Lead project to build and design several iterations of prototypes and successfully presented them to customers.

• Responsible for the entire “Polymer ESD Protection Devices” line of products including: raw materials suppliers, manufacturing issues across all processes, quality requirements and customer satisfaction.• Accomplished the following actions that enabled company to increase sales from the forecasted $3 Million (due to production limitations) to $10 Million annually in the first year at an 80% profit margin: DOEs, SMED, VSM, SPC and optimized fluidized bed reactor.

• Responsible for improving the Clean Room Imaging department that had the highest scrap of the division. Improved yields from 65 to 98% and increased production efficiency by 250%. This resulted on an annual savings of $700k.• Lead Six Sigma team using the DMAIC model to “Reduce the Drilling Machine Downtime”. Project resulted on an annual savings of $110k/ year. Lead and trained a SMED or Quick Changeover team to improve productivity on department. Project resulted on an annual savings of $85k. This project was used as a foot print for SMED projects worldwide.• Key member of team responsible for the transfer of all manufacturing processes from USA to Asia, with the following responsibilities: CAPEX, purchasing, hiring, training overseas, startup, ramp up and customer approval.

• Managed manufacturing processes with staff of seven process engineers.• Led customer technical support, consulting on RF applications, finishes, high Tg materials, high power applications, heat management, impedance control, blind and buried-vias for Printed Circuits Boards.• Installed robotic Electroless Nickel/Immersion Gold line, ran studies to determined best operating parameters resulting on yields of 99.99% and saving of $200k/year

• Managed all manufacturing processes / Engineering as well as the test and analysis laboratory with 3 direct reports. After running multiple DOEs and SPC became well vested on all plating process including: Electrolytic, Cu, Sn, Au, Ni and Electroless Au, Cu and Ag.• Achieved 1-mil conductors and spaces using standard equipment & materials – published: CIRCUITREE 01, 2000.