Leading a diverse team of engineers specializing in mechanical, electrical, and aeronautical disciplines, focused on Design for Reliability Analysis and testing at Joby. Spearheading the Design-FMEA efforts across functional teams and assisted in defining reliability requirements for aircraft components. Conducting Reliability Assessments using physics-based simulations and accelerated testing data, alongside NPRD/MIL 217 based failure rate estimations. Owner of equipment reliability predictions and ensured clarity on maintaining aircraft safety and reliability. Supporting the implementation of a centralized closed-loop FRACAS system and collaborated with stakeholders to develop maintenance plans aligning with safety requirements.

Led a multifunctional team focusing on Reliability Engineering, Factory Test organization and Lab EngineersCreated Reliability Test plans covering anticipated use and misuse of the product over anticipated lifespace, including accelerated life testing and key regulatory and certification requirementsManaged certification process with UL and related agencies.Analyzed test results and create field-use risk assessments.Performed first-pass Failure Analysis and drove corrective actions with robust documentation.Leveraged third parties and some internal testing to execute Reliability Test plans during development and during ongoing production.Drove Reliability testing throughout the supply chain including component production and final assemblyBuild internal lab capabilities for critical development test items.Enabled design quality into the products by establishing and managing Risk Analysis and FMEA techniques.Developed rigorous Reliability Test plans encompassing expected product usage scenarios, abuse cases, and product life expectancy, while also addressing accelerated life testing and crucial regulatory standards.Thoroughly analyzed test findings, crafting comprehensive field-use risk assessments that inform decision-making and product enhancements.Conducted in-depth initial Failure Analysis, guiding the implementation of corrective measures with meticulous documentation to fortify product integrity.Spearheaded Reliability testing across the entire supply chain, encompassing component production and final assembly stages to ensure product durability and consistency.Established and bolster internal laboratory capabilities to facilitate essential testing of critical developmental components.Fostered a culture of quality by instituting and managing Risk Analysis and Failure Mode and Effects Analysis (FMEA) techniques to embed excellence into product design and development processes.

Managed Multi-functional (Reliability, Field Quality, Failure Analysis and Testing) and Multi-regional (San Francisco, Montreal and Shanghai) Team by optimizing project testing schedules, establishing test protocols for varied new product development, dual sourcing and cost improvement projects. Quality and Reliability Technical Advisor for E-Bikes, E-Scooters and Station’s new product development and critical module component qualification like Battery, Motor Hub, Sidewalk Detection System, Regen Braking System, Display, Locking Modules etc.Collaborated with Design Engineering, Suppliers, Operations, QC, Field Technical Services & Marketing to launch robust products by addressing all failure modes identified on Design FMEA and targeting 95% reliability for 10 years. Promoted NUDD, Design for Reliability, Finite Element Analysis and Risk Analysis approach during development/sustaining stages.  Managed factory assembly line quality issues related to supplier products, engage suppliers in immediate containment activities to minimize production losses. Performed Reliability Weibull life cycle predictions, accelerated stress test design using Reliasoft Weibull++ software. Skilled at using statistical software JMP. Led Field Quality and failure analysis team to perform root cause analysis and drive corrective actions reducing operations cost.Communicated with senior management on any identified product reliability/quality risks, recommending solutions for mitigation and engaging cross functional teams for implementing corrective/preventive actions. Built state of the art Lyft Micro Mobility Reliability Lab for Thermal cycling, Environmental chambers, HALT, Corrosion testing, UV testing, Full Bike Testing, Tire/Tube testing, Freeze/Thaw Testing etc.FastCo. Published an article:  Inside the lab where Lyft freezes, twists, and slams its bikes.Actively participated in implementing Recycled Plastics into micro-mobility HW.

Served as a Manager from 2017 – 2019 and 2020 – 2022.Have extensive experience in building a team and test lab from ground zero working on ODM/OEM/JDM/CM Model. New product hardware development for Connected Home and AR/VR Products (Thermostat, Cameras etc.).Lead the “Evaluation of Sustainable (Recycled and Bio) Plastics” in Google Nest and AR.Successfully launched Multiple generations of Nest Thermostats, AR Glass Program as Reliability DRI.Subject Matter expert in NUDD, DFMEA, lifetime/MTBFprediction, Acceleration factor, activation energy calculation etc.Provided timely data throughout whole product development phases to drive RCA for CAPA.Come up with design solutions that help implement high quality products. Predict field failure using reliability modelling using Weibull++, ALTA, JMP etc. Developed and executed new test methodologies, fixtures and items to solve system level issues.Failure Analysis using cutting edge techniques such as SEM, FIB, CT, X-Ray Imaging, FTIR, Microscopy etc.Involved in Silicon development and successfully launched a custom silicon device for Nest SystemsPublished articles on Recycled PC - Waste Material Recycling in the Circular Economy - Challenges and Developments.Presented in Google Research Conference 2020, IEEE as invited speaker, MRS (spring meeting) and in ANTEC2022.

* Recipient of "Hardware Nesties Award" for Best Root Cause Analysis* Recipient of "Hardware Nesties Award" for Product Excellence * Recipient of Nest "Top Talent Award"* Inventor of 2 US patents.System level Reliability DRI for - Nest Thermostat E (UK/EU) - Oct, 2018 - Nest Learning Thermostat Premium Colors (Polished, Steel, Brass and Mirror Black) - Oct, 2018, - Nest Thermostat E (US/CAN) - Sept, 2017, - Nest Learning Thermostat 2.0 (EU/UK) - Nov, 2015, - Nest Learning Thermostat 3.0 (US/CAN) - Sept, 2015, - Nest Learning Thermostat 2.0 (US/CAN) B - Oct, 2014.Post Consumer Recycled (PCR) Plastics - Reliability LeadModule Reliability- Liquid Crystal Display Module Reliability- Speaker Module Reliability- Piezo Buzzer Reliability- MEMS/Condenser Microphone Reliability- CO sensor Reliability- Smoke chamber Reliability- USB cable/connector Reliability - Plastic parts/resin (including PCR) Reliability - Light Sensor for smoke chamber Reliability - PMMA/Glass Lens Reliability w or without Hard Coat - Battery Reliability - FPC Reliability - Button Reliability- Ink/Print Reliability cosmetic studySilicon Reliability- SoC - Wafer, Die and Package level Reliability- RF (WiFi, BT, thread) IC and Package level Reliability.- SSR (Solid State Relay) Die and Package level Reliability

DRI for Kindle Paperwhite 2013

Leading individual reliability/ failure analysis projects for Light Emitting Diode product development in Display, Illumination and Automotive application.FMEA (Design, Process, and system level), MTTF (failure rate) prediction (parts count, accelerated life test), qualification test plan, and allocate testing labs (in house or outsource). Generate Reliability analysis and qualification reports for customers.Design reliability test plan for DOE/Phase 1, 2, 3/Qualification stage for individual LED products etc. using FMEA/DFMEASet up Reliability Test plans for single chip LED, and Light module LED from engineering to manufacturing product life cycle. Set up reliability test Lab and work with offshore supplier on design and qualification of HTOL and WHTOL reliability testers.Develop Reliability Deliverables/Tasks for each phase of product life cycle for new products using build in Reliability (BIR) concept to reduce risk on product qualification tests. The process certifications in BIR include Wafer lever test, Environmental Stress Tests (ESS), HALT/HASS, Reliability Demonstration Test (RDT), ALT, and ORT (On-going Reliability Test). Experience on setting up Reliability Lab.Perform operational, non operational reliability test using LTOL, RTOL, HTOL, WHTOL, PTMCL, LTSL, HTSL, WHTSL, TMCL, TMSK tests.Perform Mechanical shock, variable vibration frequency, random vibration, drop test, impact test etc for the mechanical reliability of LED modules.Design and implementation of HALT and HASS test for Lumileds for accelerated testing.Hands-on experience in failure analysis using structural characterization tool such as FIB, TEM, SEM / EDS, XRD, X-ray imaging, IR imaging, Raman Spectroscopy, I-V characteristics, profilometry, OBIRCH, PEM, AFM etc.FA Methodology using Pareto, Ishikawa or Fish bond diagram, 5why etc. and write FA reports

Actively participated in the Product Development of the Eople Version of Micro Lead Frame Carrier.Reliability and failure analysis of microelectronic package system, dielectric antenna and energy harvester.Piezoelectric materials based energy harvester design, development and characterization in different application.Piezoelectric materials development having unique properties.

Development of bulk, thin film and nano magnetoelectric (ME) composite materials, synthesis, characterization and design of prototype devices such as tachometer, magnetic sensor, magnetic field generator, transformer etc. Development of high energy density materials (highest g33 constant PZT materials in the world) for piezoelectric energy harvesting etc. Synthesis of Magnetic (Ni ferrite) nano particles (20 - 30 nm) and use those nano particles for self assembled core shell nano composite structure.Using clean room process technology, such as spin coater, sputtering and other evaporation technique, development of thin film magnetoelectric layered structure for nano scale magnetic field sensing. Structural characterization using Transmission Electron Microscope, Scanning electron microscope (secondary and back scattered electron), Piezo Force Microscopy (PFM), Magnetic Force Microscopy (MFM), X-ray diffraction techniques etc. for strain, lattice mismatch, localized polarization/magnetization behavior of thin film magnetic sensor.

Development of Pb free solder alternative Sn – Zn, Sn – Ag – Cu based solder and anisotropic conductive film (ACF) for flip chip package. Study of electromigration of different lead free solder inside a BGA package.Introduced dual curing (microwave and thermal) method for ACF for low temperature, high speed, energy efficient flip chip on flex and flip chip on glass package. Structural characterization using of solder/conductive adhesive interconnect using TEM, SEM, FTIR, Ion Chromatography, XRD, DSC, TGA etc.Design of experiment for different types of mechanical testing for flip chip device such as dropt test, impact test solder fatigue, and tensile peel test of chip package.

Characterization of Sn – Zn based solder as a drop in replacement for Pb – Sn solder in different interconnect technology.Microstructural control of mechanical properties (hardness etc.) for Sn – Zn and Sn – Zn – Bi. Wetting behavior of different composition of (Sn – Zn) solder and their diffusion kinetic in various substrate (Cu, electrolytic Ni, electroless Ni etc.)

Conducted lectures on Ore Dressing, Extractive Metallurgy, Fuels and Combustion, Surface Engineering, Metallurgical Problems, Metallic Materials for Metallurgical and Naval Architecture undergraduate students.