Dr. Duffy's activities involve Emerging Materials and Devices for future nanoelectronic, ICT, sensing, and quantum applications, including fabrication, characterisation and modelling of nanowire and thin-film devices. He has been a Symposium Organiser or Technical Program Committee for several international conference spanning areas of modelling, process technology, and novel electron devices.He was European Material Research Society (E-MRS) Symposium Organiser Spring 2019 “Advances in silicon-nanoelectronics, -nanostructures and high-efficiency Si-photovoltaics”, E-MRS Fall 2017 Symposium “Integration, metrology and Technology CAD co-development for sub-10nm technology nodes”, E-MRS Spring 2015 “Nanomaterials and Processes for Advanced Semiconductor CMOS Devices”. He was on the Technical Program Committee for the Ion Implantation Technology conference 2012, 2014, 2016, 2018, 2020 (process technology); SISPAD 2018 (modelling), and IEEENANO 2018 (novel electron devices). Over the past 20 years he has been a technical reviewer for peer-reviewed journals including IEEE Transactions on Electron Devices, IEEE Electron Device Letters, Applied Physics Letters, and Journal of Applied Physics, Langmuir, Journal of Materials Chemistry C, Vacuum, among others. In this role he has had collaborative research projects or technical engagements with international industrial multinationals and SMEs, including Intel, Applied Materials, Synopsys, Excico, and Lam Research. He has been PhD viva voce examiner for 11 PhD defences spanning 2010-2021. He teaches to 4th year undergraduates (BE) and postgraduates (M.Eng.Sc, ME) “Processing of Integrated Circuits” (EE4024/EE4067), and supervises part-time Masters students in the School of Engineering at UCC.The position also includes - project management, - budget management and purchasing, - PhD student supervision and mentoring,- dissemination of results in peer-reviewed articles.

The missions for this position were as follows :- Deliver results, ideas, and support to the customer. In this case to PHILIPS/NXP Semiconductors and TSMC. - Integrate CMOS process modules, with expertise in doping architectures for planar and thin film silicon devices.- Employ material science to aid device optimisation. Moreover linking fundamental research with transistor electrical performance is a key goal.- Use TCAD (process and device modelling) to generate insight and understanding.- Create and sustain network with universities and experts in the field.- Actively participate in European Commission projects, which stimulate cross-collaboration between industrial semiconductor companies, research institutes, and universities. - Mentor intern students (Ph.D and undergraduate), including project definition and supervision.- Publish results in peer-reviewed international journals and conferences, and contribute to company patent portfolio.