Operation Manager for Apple

Managed the team responsible for the operation and optimization of the Burn-In, Offline Binning and Offline Fusing modules. Led the development of new process/tools to improve tool productivity by ~10%. Additional role as the Technical Assistant and meeting chair to provide technical support and advice to the joint Test Engineering Management Team which reports to the Intel ATM steel council directly.

Expat assignment to Intel US development site (Chandler AZ) for 3 years, represented Intel Assembly Test Manufacturing sites in Technology Development forums by providing consultative inputs to ensure HVM needs and assumptions are taken into consideration for early manufacturing technology selection and development (Design For Manufacturing). Responsible for leading the development and transfer of the new products which involved new technologies from the US development center to multiple Assembly Test Manufacturing (ATM) sites across the globe.

Formed and managed the team of advanced degree engineers who are responsible for the installation, qualification, and optimization of the Class Test module as designed first limiter. Led the team to support Chengdu CPU factory start-up and ramp up by being responsible for all aspects of equipment performance to ensure the highest quality standards were met, which including but not limited to Process Control (PCS), Preventative Maintenance, Quick Conversions (SMED), Availability, Reduced IQ Time, and cost reduction. Leader of the Versatile-8 project team to introduce and implement the first Intel high parallelism test module (valued at ~$100M). Established the on-site Installation and Qualification process and drove the IQ lead time down from 6 weeks to 1.5 weeks with the ROI of >$10M; led the optimization of the equipment to improve the equipment utilization goal (GU) from 83% to 90%.

In charge of the test module start-up for new Intel CPU factory in Shanghai Pudong. Led the joint development team and introduced 3 new products with new test toolings and process to Pudong factory successfully. First class test module development owner of new product by relocating to Intel Development site in Malaysia and Philippines for 7 months and successfully completed the new equipment and product qualification and start-up (code name Yonah).

Responsible for tester module maintenance and yield improvement. Owner of the test equipment line (HP 3070 ICT tester) transfer from Shanghai to Beijing in 2002.