Remus Bernard Ajes
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Remus Bernard Ajes Email & Phone Number

Package Development and Assy Engineering at ESPROS Photonics AG
Location: Sargans, St Gallen, Switzerland 5 work roles 3 schools
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Current company
Role
Package Development and Assy Engineering
Location
Sargans, St Gallen, Switzerland
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Remus Bernard Ajes is listed as Package Development and Assy Engineering at ESPROS Photonics AG, a with 41 employees, based in Sargans, St Gallen, Switzerland. AeroLeads shows a matched LinkedIn profile for Remus Bernard Ajes.

Remus Bernard Ajes previously worked as Corporate NPI at Inari Group and IDCOREng -Business Unit at Nxp. Remus Bernard Ajes holds Master Of Science, Material Science And Engineering from University Of The Philippines.

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ESPROS Photonics AG

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About Remus Bernard Ajes

Over 20 years of successful semiconductor manufacturing management and leadership experience with a reputation for meeting the most challenging organizational goals and objectives. A pragmatic and focused individual recognized for “making seemingly impossible situations work.” A proven and verifiable record for:• RD /NPI , Package Development for Semiconductor Packages from standard leaded to advanced complex packages, discrete and optics, mass production released with robust design, cost effective and at earliest possible time to market with zero field failure occurrences on major semiconductor companies.• Developing and implementing highly successful strategic plans (short and long term). For semiconductor package and process development through continuous improvements and process simplifications, documenting robust designs and rules of assembly utilizing APQP and DFSS.• Gross Margin Improvements through manufacturing equipment utilization and material standardization as head of the GMI/CI , the improvement of effective resource utilization rate from 46% to 97.6% and material standardization in less than 12 months. This resulted in a cost savings of over US$ 15 million

Listed skills include Ic, Reliability, Engineers, Semiconductors, and 19 others.

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ESPROS Photonics AG
Espros Photonics Ag
Package Development and Assy Engineering
sargans, saint gallen, switzerland
Website
Employees
41
AeroLeads page
5 roles

Remus Bernard Ajes work experience

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Package Development And Assy Engineering

Current

Sargans, Kanton St. Gallen, Switzerland

Apr 2016 - Present

Corporate Npi

Malaysia

• Process owner for NPI process , and subject matter expert to NPI project teams for the entire Engineering group• Lead execution of multiple NPI (New Product Introduction) projects to ensure they are on time, within budget, and aligned with the component and product group strategies• Lead the NPI program execution to the defined process ensuring delivery of each of the program deliverables in the areas of design, process, quality, purchasing, order fulfillment, marketing, product support and financial• Provides input and assist with decisions that impact product cost, price, supplier selection, etc, and marketing strategies for assigned products and markets.• Responsible for identifying cost containment opportunities, analyzing trends and areas of focus for continuous improvement.• Lifetime Estimates (LTE) of the entire NPI program from each of the functional areas and Business Units involved. In the case where a program level cash flow is required

Sep 2012 - Mar 2016

Idcoreng -Business Unit

Nxp

• Overall management of Cost / Process Improvements on Assembly and Test Operations in Thailand Manufacturing plant• Identified, kick-off and run cost reduction and optimization activities on Assembly and Test operations.• Initiated improvement potential in terms of TPT reduction, yield increase, asset /equipment utilization, material usage etc (Implemented OEE ( Overall Equipment Efficiency) to control machine utilization, output/yield increase, reduced manpower and scrappage.)• Kick-off and drive Continuous Improvement activities in close cooperation with Manufacturing Director and BU Gross Margin Manager(Ably developed systems and procedures to maximize productivity and optimize process workflow)• Supported development and innovation activities, focusing on process improvements and cost reductions.

Aug 2010 - Aug 2012

Manager -Assembly And Package Engineering

o Development/Prototype Mfg ( Advanced Packages e.g . Flip Chip, CSP, 3D / Stacked)Collaborate with customer, product engineering/business planning/subcon planning for new product/engineering builds/qualification in order to achieve the quality, yield and cycle time targets to release new productLead assembly process characterization and manage data/information in order to fully release for manufacturing new products and create a database as reference for future buildsLead Research & Development Team on establishing new package technology (advanced packages) and processes. Responsible for driving the activities of IC package conceptual & detail design, tooling, material selection, reliability qualification and development of related assembly processes to achieve cost effective package with superior reliability.Lead the development team on establishing new process for volume manufacturing with proper QA at each phase till output.o Assembly process sustaining Provides timely disposition to subcontractor process issues and requires/reviews corrective actions for both short term and long term prevention/improvement in order to consistently meet yield target for all lotso Yield EngineeringCollate yield data from subcontractors with details to defect contribution in order to create actions to continuously improve yield Review RMAs and analyze with subcontractors process capability in order to prevent major/catastrophic quality incidences in in-house test and customers/field applicationsReview process stability in subcontractors and propose process simplification in order to improve cycle timeso AuditsSupport QSE on qualification and maintenance audits of assembly subcontractors

Nov 2005 - Aug 2010

Manager Product Development /Qual Engineering

• Lead Product Engineers in evaluating, qualifying and introducing new processes and technologies in compliance with design rules and standards.• “Project Leader” for all New Product Innovations, Product Qualifications, Process Development, Materials testing and New materials qualifications for SiP ( System In Package) /FC CSP (Chip Scale Package ).• Technical consultant /Failure Analysis “guru” for manufacturing problems that focuses on equipment, material and process.

Jun 1995 - Oct 2005
Team & coworkers

Colleagues at ESPROS Photonics AG

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3 education records

Remus Bernard Ajes education

Bachelor Of Science, Electrical Engineering

Technological Institute Of The Philippines
FAQ

Frequently asked questions about Remus Bernard Ajes

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What company does Remus Bernard Ajes work for?

Remus Bernard Ajes works for ESPROS Photonics AG.

What is Remus Bernard Ajes's role at ESPROS Photonics AG?

Remus Bernard Ajes is listed as Package Development and Assy Engineering at ESPROS Photonics AG.

Where is Remus Bernard Ajes based?

Remus Bernard Ajes is based in Sargans, St Gallen, Switzerland while working with ESPROS Photonics AG.

What companies has Remus Bernard Ajes worked for?

Remus Bernard Ajes has worked for Espros Photonics Ag, Inari Group, Nxp, Ami Semiconductor, and Amkor Technology.

Who are Remus Bernard Ajes's colleagues at ESPROS Photonics AG?

Remus Bernard Ajes's colleagues at ESPROS Photonics AG include Silvio Honegger, Dong Shangqing, Wei Wang, Marc Frick, and Niluka Piyasinghe.

How can I contact Remus Bernard Ajes?

You can use AeroLeads to view verified contact signals for Remus Bernard Ajes at ESPROS Photonics AG, including work email, phone, and LinkedIn data when available.

What schools did Remus Bernard Ajes attend?

Remus Bernard Ajes holds Master Of Science, Material Science And Engineering from University Of The Philippines.

What skills is Remus Bernard Ajes known for?

Remus Bernard Ajes is listed with skills including Ic, Reliability, Engineers, Semiconductors, Characterization, Manufacturing, Product Engineering, and Spc.

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