• Process owner for NPI process , and subject matter expert to NPI project teams for the entire Engineering group• Lead execution of multiple NPI (New Product Introduction) projects to ensure they are on time, within budget, and aligned with the component and product group strategies• Lead the NPI program execution to the defined process ensuring delivery of each of the program deliverables in the areas of design, process, quality, purchasing, order fulfillment, marketing, product support and financial• Provides input and assist with decisions that impact product cost, price, supplier selection, etc, and marketing strategies for assigned products and markets.• Responsible for identifying cost containment opportunities, analyzing trends and areas of focus for continuous improvement.• Lifetime Estimates (LTE) of the entire NPI program from each of the functional areas and Business Units involved. In the case where a program level cash flow is required

• Overall management of Cost / Process Improvements on Assembly and Test Operations in Thailand Manufacturing plant• Identified, kick-off and run cost reduction and optimization activities on Assembly and Test operations.• Initiated improvement potential in terms of TPT reduction, yield increase, asset /equipment utilization, material usage etc (Implemented OEE ( Overall Equipment Efficiency) to control machine utilization, output/yield increase, reduced manpower and scrappage.)• Kick-off and drive Continuous Improvement activities in close cooperation with Manufacturing Director and BU Gross Margin Manager(Ably developed systems and procedures to maximize productivity and optimize process workflow)• Supported development and innovation activities, focusing on process improvements and cost reductions.

o Development/Prototype Mfg ( Advanced Packages e.g . Flip Chip, CSP, 3D / Stacked)Collaborate with customer, product engineering/business planning/subcon planning for new product/engineering builds/qualification in order to achieve the quality, yield and cycle time targets to release new productLead assembly process characterization and manage data/information in order to fully release for manufacturing new products and create a database as reference for future buildsLead Research & Development Team on establishing new package technology (advanced packages) and processes. Responsible for driving the activities of IC package conceptual & detail design, tooling, material selection, reliability qualification and development of related assembly processes to achieve cost effective package with superior reliability.Lead the development team on establishing new process for volume manufacturing with proper QA at each phase till output.o Assembly process sustaining Provides timely disposition to subcontractor process issues and requires/reviews corrective actions for both short term and long term prevention/improvement in order to consistently meet yield target for all lotso Yield EngineeringCollate yield data from subcontractors with details to defect contribution in order to create actions to continuously improve yield Review RMAs and analyze with subcontractors process capability in order to prevent major/catastrophic quality incidences in in-house test and customers/field applicationsReview process stability in subcontractors and propose process simplification in order to improve cycle timeso AuditsSupport QSE on qualification and maintenance audits of assembly subcontractors

• Lead Product Engineers in evaluating, qualifying and introducing new processes and technologies in compliance with design rules and standards.• “Project Leader” for all New Product Innovations, Product Qualifications, Process Development, Materials testing and New materials qualifications for SiP ( System In Package) /FC CSP (Chip Scale Package ).• Technical consultant /Failure Analysis “guru” for manufacturing problems that focuses on equipment, material and process.