Rex Dong Email & Phone Number

Responsibility: New suppliers’ development and audit. Key supplier yield improvement. EE/EM part issue solving externally and internally. Supplier quality continuous improvement and coach.Achievement: New project electronic and mechanical supplier on-site assessment for SDC, Airsanz and P&G. Lead the cross-functional team audit focusing on the quality, engineering, production capability and supply chain system etc. New approved supplier yield improvement: perform the regular training for OEM/subcon such as FMEA, control plan, process optimization and system.One of PCBA OEM yield was increased from 81% to 98% successfully within half of the year.  1st tier supplier management: lead electronic and mechanical team to on-site audit the key suppliers annually according to supplier process, material and manufacture site changes request. Fix the pump leakage and LED module no function issues for P&G project. Deal with motor function issue and battery low current for health care project. 2nd tier key supplier control: BOM review and key component identification. On-site monitor MCU, LED and Tilt switch engineering samples and trial run, audit the key parts major OSAT to address the findings and train supplier to close CAPA with solid and effective actions.

东莞市, 广东

Responsibility: Lead SQE department daily work including IQC and SQE team: New suppliers’ development and audit. Material issue solving externally and internally. New device approval. Supplier quality continuous improvement and coach.Achievement: Focused on the supplier evaluation for Honda Motor and Gogoro E-Motor project: According to the CSR, introduced quality competitive supplier with various improvements such as IQC control, APQP, PPAP, on-site audit and OBA optimization. Product quality improvement: In the second half of 2019, the SH series MCU were facing high test/customer failure rate (488 DPPM). Reviewed the related circuits with RD and proposed the TVS addition for key location; upgraded the ESD level with IE according to the ANSI ESD S20.20; developed and optimized the IQC test jig(the heavy loading test box) to screen the potential issue of wafer or process deviation. Finally, the MCU failure was decreased to 103 DPPM in 2020 Q1. Optimized and enhanced the supplier audit, assessed the non-conformity findings with IATF16949. Helped supplier build and refine the system and process with common key findings concerning equipment maintenance, tooling management, FAI, NG device control, outsourcing subcontractor qualification etc. New device approval both cosmetically and chemically: Lead the mechanical SQE to perform the part approval made by duplicating mold including dimension, appearance, salt spray test and stress test; Assisted the electronic parameter test for RD device verification; NPI and qualified the new brand solder paste, coached and advised the production line with critical application items: add auto warming machine, daily check the PWI and reflow profile.