Richard Tseng Email and Phone Number

1.Responsible for Server system (1U/2U/4U/8U) thermal design, including:2.Focused on server thermal design, including multi-node, GPU servers, and 5G edge servers.3.System issue shooting4.Optimizing system performance, particularly in thermal solution and fan control.5.Managing quality assurance to ensure stable product quality during development and mass production.6.Customer thermal peer communication, cross-functional collaboration, and supplier management for thermal parts.7.Leading team members to finalize thermal-related design.8.Continuously evaluated and shared latest thermal products and technologies.9.Projects: -1U edge server. -2U2N / 2U4N customize servers. -4U desktop server. -8U GPU server

1.Mainly responsible for server thermal development, multi-node, edge servers, and 5G products.2.Evaluated the feasibility of system thermal design and developed corresponding thermal solutions.3.Collaborated with suppliers to develop high-performance customized fans and heatsinks.4.Optimized system performance, particularly in thermal solution and fan control.5.Managed quality assurance to ensure products met standards and client requirements.6.Continuously evaluated and shared new thermal products and technologies.7.Projects: -1U/2U edge server. -5G switch. -2U4N computing server.

1.Responsible for thermal design for server 1U & 2U system products, including:2.Thermal simulation, design, and risk assessment for server products.3.Thermal kits design (heatsink / airduct / system fan design and select) and optimization.4.System verification review.5.Managed quality assurance to ensure products met standards and client requirements.

1.Responsible for thermal design for desktop system products, including:2.Thermal simulation, design for desktop products.3.Thermal kits design (heatsink / airduct design).4.System verification.