Rick Fitzpatrick Email & Phone Number

Loveland, Co, Us

X2F has developed a new transformative molding technology that enables manufacturing of parts and materials that were previously impossible. X2F’s technology leverages a patented pulse-packing process that’s 70+% lower pressure than conventional techniques to create complex geometries, stronger & more durable parts, and enhanced material properties. X2F is currently deployed at production scale with excellent customer results across a range of end-markets. Initial target application areas for X2F include: (1) Battery and electronics packaging with 10-20X improved thermal properties – X2F technology can process highly filled polymers leading to extreme thermal conductivity that provides up to 200% improved battery performance. (2) Heat sinks that are 49% lighter weight – Polymeric heat sinks are significantly lighter than aluminum and more affordable. X2F is able to dramatically simplify the manufacturing process. (3) Ultra High Molecular Weight Polyethylene – X2F offers the world’s first net shape molding technology which is lower cost and more efficient. (4) Filled polymers with 30% more strength – X2F technology can process a wide range of polymers like PEEK, PPS, PP, and Nylon filled with carbon fiber & glass that are 30% stronger & stiffer. X2F has partnered with early adopter organizations in each of these focus areas and is deploying the technology in the consumer electronics, automotive, industrial, and medical industries. The company is backed by Atlas Innovate with senior advisors that include the former CEO's of General Motors and Dow Chemical. More details can be found at www.X2F.com

Design and manufacturing services, providing unique injection molding solutions for traditional thermoplastics, bioresins, metal injection molding and other hybrid processes.

Developed custom systems for the molding of small parts.

Austin, Texas, Us

Upon acquisition of DTM Products by Flextronics, continued on as engineering manager of Colorado Plastics Division. Expanded capabilities to provide sales, design, tooling and project management support to international operations under the direction of Flex CEO and VP Engineering. Functioned as troubleshooter and product specific technology evaluator for a wide variety of consumer electronics and medical devices produced in facilities in China, Mexico and the US.

Recruited to build engineering department and company sales in consumer electronics and medical device industries. Responsible for all aspects of engineering plastic injection molded parts and the product design and industrial engineering of the assemblies and systems they were provided for. In 1996, simultaneously held VP Engineering and VP Business Development positions. Contributed to sales growth from $6 million in 1995 to over $20 million in 1998, resulting in sale of company to Flextronics.

Elgin, Il, Us

Began as mold and product designer and was named Design Manager after 4 months. Responsible for all product and tool designs for a wide variety of insert molded components and the assemblies built around them. Was promoted to National Sales Manager in 1991 as our unique product design offering was central to our marketing efforts. Success brought promotion to VP Sales and Marketing in 1992.

Designed cap and closure molds and molds for medical disposable products. All molds were for high volume production, unscrewing, stack and conventional molds, all using hot runner systems we designed. Molds ranged in size from 4 to 192 cavity molds.

Accounting

Education record