Responsible for driving Proliant Core Server DL5xx series products through NPI pilot validation and manufacturing deployment, which includes working with cross-functional HPE teams and world-wide factories to enable production readiness prior to ramp.

- Responsible for the development of NPI schedules and prototype allocation budgets on HP 3PAR StoreServ and StoreVirtual storage products. - Interface with cross-functional teams in design, procurement, QA, product engineering and test, along with world wide supply chain contract manufacturers and HP regional factory sites, on the build of prototypes for engineering development, production deployment, and manufacturing verification prior to production ramp.

- Responsible for the test, characterization and reliability development of multiple ASIC semiconductor products for customer Cisco Systems.- Interfaced across multiple organizations including design, operations, quality assurance and planning teams.- Initial development and debug of test programs for multi-probe and packaged devices, which included silicon and test pattern verification, to deliver scheduled protoype samples to customer.- Yield improvement, test time reduction and cost reduction efforts to meet business model goals for ramping devices into production.- Characterization of device performance across multiple temperatures, voltages and process spreads to verify test margins.- Burn-in program development for multiple products.- Test and analysis of product reliability studies for HTOL, ESD, Latch-up and package qualifications.

- Responsible for the test, characterization and reliability development of multiple RISC semiconductor products for customer Sun Microsystems.- Interfaced across multiple organizations including design, operations, quality assurance, packaging, planning and external vendors.- Initial development and debug of test programs for multi-probe and packaged devices, which included silicon and test pattern verification, to deliver scheduled protoype samples to customer.- Yield improvement, test time reduction and cost reduction efforts to meet business model goals for ramping devices into production.- Characterization of device performance across multiple temperatures, voltages and process spreads to verify test margins.- Test and analysis of product reliability studies for HTOL, ESD, Latch-up and package qualifications.- Lead engineer on the initial bring-up and execution of companies first high-power burn-in ovens, which included development, debug and specification creations for BIB HW and BI programs. Also developed numerous Perl scripts for production/reliability teams to provide real-time oven monitoring and summary reporting cababilities and for product engineers to perform pattern translations to new MCC oven platform.- Wrote and presented 3 technical papers on burn-in: "An Alternative Test for Verifying Connectivity On High Pin Count Devices During Burn-in" (BiTS Conference - 2006); "Taming the Beast - Enhancing UltraSPARC Burn-in" (TI Symposium on Test - 2003); "Advanced Burn-in on UltraSPARC III" (TI Symposium on Test - 2000)

- Responsible for the test, characterization and reliability development of numerous military DSP products.- Interfaced across multiple organizations including business development, operations, quality assurance, packaging, planning and external vendors.- Yield improvement, test time reduction and cost reduction efforts for ramping devices into production at off-shore and subcontractor facilities.- Characterization of device performance across military temperatures and voltage conditions to set device data sheet specifications and verify test margins.- Test and analysis of reliability studies for silicon and package to meet military standard qualification specifications.- Led efforts on releasing first TAB (Tape Automated Bonding) packaged device into production.