Projects• Backend process with 2D code (2017) : To estimate backend equipments with 2D code capability and process• Defect PCB analysis method (2016): Build quick analysis for internal short of PCB with rework method.• Assembly Checker(2014): To integrate Tester and packaging machine that any tested pass IC will be packaged right away to reduce cycle time between and maximize output. • Total burn-in solutions (2012): Provide device burn-in solution from new cradle to tomb with software and hardware.• Supplier qualification and management (2010): Qualify outsource suppliers to maintain in house board availability and manage supplier to improve quality.• Burn-in socket and board enhancement (2009): to design in robust structure and protection for socket and boards for enhance lifetime in production.• Burn-in legacy oven phase out(2008): To design adaptor for legacy oven board capable for new ovens with oven test program.• Device yield improvement (2007): Improve device production yield by test program optimization, hardware integration detection and process enhancement.