• Responsible for managing and developing a team of automotive CIS FAEs (both hiring-in new talent as well as managing existing personnel). • Work directly with Automotive OEMs (Ford, GM, Stellantis) as well as Tier1s (Magna, ZF, Aptiv, Gentex, Bosch, Valeo) in order to market and provide engineering support for our portfolio of automotive image sensors through the entire design in and DV/PV schedule for production. ◦ Facillitate customer discussions ranging from Engineering Support and Evaluation, Cybersecurity, Functional Safety, DFMEA/ FMEDA, Process Reliability, etc. • Manage engineering resources with international teams in both Europe and Japan. • Technical marketing of new products and features - Gather feedback from customer engineering to influence design and support of product road-map.

Work with 70+ Bay Area customers by providing technical support for their camera designs, including automotive/ autonomous, consumer, and industrial applications. Typical engagements range from sensor evaluation and bring up by providing the hardware and software tools and training necessary to evaluate ON’s image sensors to debugging advanced image quality/ MTF issues. In working very closely with the local image sensor designers and applications teams I’ve been able to provide deep technical assistance to some of the Bay’s most demanding customers.

Responsible for supporting and growing revenue for TI analog portfolio products at Tesla Motors primarily for ADAS and Infotainment solutions. Including but not limited to monotonic Radar sensing solutions, 3D Time of Flight, FPD-Link Serdes for cameras, power, audio, and numerous other solutions offered by Texas Instruments. Support customers with schematic capture, schematic and layout review, circuit simulation, board bring-up and debug, failure analysis, testing/evaluation, and electrical system design. Leverage relationships and work with international teams to identify new opportunities at customers early, maximizing revenue. Also responsible for identifying portfolio gaps and providing feedback/specifications to TI Product Lines for future product development, including presenting regional needs to product line management teams.

 Core Responsibility of running multi lot product qualification which included:• HTOL, Temp Cycle, BHAST, UHAST, Therm. Path Integrity, HTSL, ESD and LU. Utilized Data Mining and Analysis software such as Spotfire DS/ DXP, dataWare, dataPower, Excel, JMP, and MBayse in order to correlate part failures, check wafer yields, and generate customer reports. Performed functional and parametric IC testing for qualification on Teradyne’s IFLEX system. Developed cost effective PCB HTOL IC Heater solution utilizing TI parts and IP in response to customer desire for test improvement. Designed a MSP430 test ware solution to allow register R/W to ICs onsite at the test hardware in order to optimize failure debug response times. Developed dynamic failure analysis database utilizing HTML, PHP, Javascript, and SQL. Ran bench level tests and experiments utilizing oscilloscopes, PS, DMM, Curve Tracers, and custom evaluation hardware for the purpose of determining modes of failure on ICs. Optimized report workflow with the use of Python and R scripts.