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Robert Berlin Email & Phone Number

Principal Engineer at Seperation Technologies Inc
Location: Sanford, Florida, United States 8 work roles 2 schools
1 work email found @controllaser.com 2 phones found area 407 LinkedIn matched
✓ Verified August 2026 4 data sources Profile completeness 100%

Contact Signals · 1 work email · 2 phones

Work email r****@controllaser.com
Direct phone (407) ***-****
LinkedIn Profile matched
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Current company
Role
Principal Engineer
Location
Sanford, Florida, United States

Who is Robert Berlin? Overview

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Quick answer

Robert Berlin is listed as Principal Engineer at Seperation Technologies Inc, based in Sanford, Florida, United States. AeroLeads shows a work email signal at controllaser.com, phone signal with area code 407, and a matched LinkedIn profile for Robert Berlin.

Robert Berlin previously worked as Electrical Hardware Manager at Control Laser Corporation/Control Systemation Inc and Senior Technical Staff Engineer at Camgian Microsystems. Robert Berlin holds B.S.E.E, Rf, Microwave, And Antenna Design from Florida Atlantic University Boca Raton, Fl.

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Email format at Seperation Technologies Inc

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{first}.{last}@controllaser.com
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AeroLeads found 1 current-domain work email signal for Robert Berlin. Compare company email patterns before reaching out.

Profile bio

About Robert Berlin

Robert Berlin is a Principal Engineer at Seperation Technologies Inc. He possess expertise in semiconductors, embedded systems, pcb design, manufacturing, product development and 5 more skills.

Listed skills include Semiconductors, Embedded Systems, Pcb Design, Manufacturing, and 6 others.

Current workplace

Robert Berlin's current company

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Seperation Technologies Inc
Seperation Technologies Inc
Principal Engineer
Sanford, FL, US
AeroLeads page
8 roles

Robert Berlin work experience

A career timeline built from the work history available for this profile.

Principal Engineer

Current

• Embedded hardware analog, digital, mixed signal designs related to Medical Lab Centrifuges and Blood Donor Screening Products.• Converted customer/product requirements into embedded hardware designs. Created all required system, interface, analysis, prototype, QA, and production documentation, Debugged, modified, validated all prototype PCB and system performance requirements, and generated test reports. Provided production and customer service support. • PCB Design- Determined PCB fabrication requirements, implemented hardware and layout EMI/EMC and DFM/DFA design techniques, component selection, generated industry standard component symbols and 2D/3D footprints, schematic capture, constraint driven PCB layout, and generated all post-layout PCB output files. PCB Layers- 6,4. • CAD Tools- Altium Designer version 15.1, PIC MPLAB-X IDE, Visio and AutoCad.• Component Engineer- Created and managed al component related data. Accessed product risk relating to component obsolescence, life-cycle, RoHS or Pb-free compliance issues. Performed new component verification and life-cycle testing. • Documentation ECO Control- Ensured new medical product development or design odifications to existing products were compliant with FDA design control requirements. Created, reviewed, or revised engineering, production, and quality assurance drawings, SOP's, assembly and test procedures, and product design files. Corrective Action and Preventative Action plans (CAPA). • Product Compliance- Established and managed companies Conflict Minerals, RoHS, and Pb-free programs.• Product Verification/Validation Testing- Supported third party FCC, UL, and EMI/EMC compliance testing.• Some C++/C programming.

Sep 2014 - Present

Electrical Hardware Manager

Orlando, Florida, Us

Digital, analog, and mixed signal designs, PCB designs, and Components Engineering for both fiber laser and CO2 laser legacy and new custom laser marking systems. Research required modifications for legacy designs.• Designs- Embedded hardware mixed signal laser controllers, motor control interface, system hardware interfaces, and cable design. • Design Cycle- customer requirements driven system architecture/interface design, breadboard design and validation testing, prototype/production PCB design, PCB validation testing, analyze test data, complete design drawings/ documentation package, and system level integration.• Design components- Cyclone II FPGA, Xilinx CPLD, PIC18F uC family, relays, OPAmps, USB, RS323/485, Opamps, comparators, MOSFETS, NPN/PNP transistors , relays, Opto-isolators, DC-DC regulators, and Schneider motors.• PCB design- Power decoupling/timing/crosstalk/EMI/DFC analysis, component selection, symbol/footprint generation, schematic capture, constraint driven routing rules for differential/clock match length signals and standard vias, multiple power rails, 2D/ 3D modeling, PCB fab/assembly. • PCB Stack-up - 6/4 layer analog, digital, and mixed signal boards.• Packages- SMT/through-hole, SOT, TSSOP, QFP, and DIP.• PCB Library Management - Developed and maintained standardized PCB schematic symbols/layout footprints repository. Verified all new symbols/footprints prior to incorporating into repository.• Design Review- Presented to the review committee for both preliminary and post design reviews. • DFM/DFA - Worked closely with PCB fab/assembly houses and production to ensure DFM.• Document Control- Developed and maintained all master project folder documentation.• Component Management- Obsolescence, risk, and life cycle analysis, availability for all company designed products.• Design tools- Altium and PADS PCB design, Microchip PIC MPLAB IDE, Altera’s Quartus II IDE, Xilinx ISE design suite and AutoCad.

Jun 2012 - Mar 2014

Senior Technical Staff Engineer

Starkville, Ms, Us

Embedded hardware design, PCB design, and Components engineering for radar, low power wireless, sonar, and accelerometer sensor based products.• Designs- High speed DSP board for radar sensors, wireless/sonar/accelerometer/multi-sensor system design.• Design Cycle- Customer requirements driven system architecture/interface design, breadboard design and validation testing, prototype/production PCB design, PCB validation testing, analyze test data, complete design drawings/ documentation package, and system level integration.• Design Components- Cyclone III/Actel/ Xilinx FPGAs, ARM9, DDR SDRAM, SRAM, NAND/NOR Flash, high speed serial interfaces. USB OTG, ZigBee transceiver, PIC18F uC, R232/48, Opamps, comparators, • FPGA Design- VHDL, synthesis, place and route, simulation, timing analysis.• PCB design- power decoupling/timing/crosstalk/EMI/DFC analysis, component selection, symbol/footprint generation, schematic capture, constraint driven routing rules for differential/clock match length signals and standard/blind vias, multiple power rails, 2D/ 3D modeling, PCB fab/assembly. • PCB Stack-up- 18/14/6/4/2 layer boards.• PCB Library Management- Developed and maintained standardized PCB schematic symbols/layout footprints repository. Verified all new symbols/footprints prior to incorporating into repository.• Packages- SMT/through-hole, high density FBGA's, TSOP, TSSOP, QFN, DFN and DIP. • Component Management- obsolescence, risk and life cycle analysis for all company designed products. • Component Management- obsolescence, risk and life cycle analysis for all company designed products. • Design tools- Altium/Protel, Altera’s Quartus II IDE, SOPC/DSP builder, and NIOS II IDE, and Cadence signal integrity analysis tool.• Test Equipment- Oscilloscopes, Spectrum Analyzers, Logic Analyzers, Network Analyzers, and other electronic test equipment.

Jun 2008 - Jan 2012

Senior Design Engineer

L3 Communications, Orlando, Fl

Embedded hardware design, PCB design, and Components Engineering for low power smart battery applications utilized in ground penetrating radar products. • Designs- Low power battery controller for various battery chemistries.• Design Cycle- Customer requirements driven system architecture/interface design, breadboard design and validation testing, prototype/production PCB design, PCB validation testing, analyze test data, complete design drawings/ documentation package, and system level integration.• PCB design- Power decoupling/timing/crosstalk/EMI/DFC analysis, component selection, symbol/footprint generation, schematic capture, constraint driven routing rules for differential/clock match length signals and standard vias, multiple power rails, PCB fab/assembly. •.PCB Stack-up- 6/4 layer boards.• Packages- SMT- SOP, TSOP, TSSOP, QFN. • PCB Library Management - Developed and maintained standardized PCB schematic symbols/layout footprints repository. Verified all new symbols/footprints prior to incorporating into repository.• Design Review- Presented to the review committee, for both preliminary and post design reviews.• Compliance Testing - Mil-Std 810, developed test procedures to meet or exceed First Article Test, shock, vibration, temperature, EMI/EMC requirements. • Component Management - obsolescence, risk and life cycle analysis for all company designed products. • Document Control- Developed and maintained all master project folder documentation.• Design Tools- ORCAD, TI MSP430 IDE.• Firmware- C++.• Test Equipment- Oscilloscopes, Spectrum Analyzers, Logic Analyzers, Network Analyzers, and other electronic test equipment.

Oct 2007 - Aug 2008

Senior Design Engineer

Comtech Systems

Hardware and systems design, and lead technical proposal engineer for Tropo-scatter, UHF, VHF and satellite communication systems.• Designs- Embedded control boards, digital control boards, and bit error rate test board.• Design Components- Cyclone II FPGA, Actel ProASIC FPGAs, RS232, RS485, USB, and DC-DC regulators. • Systems Design- Rack and stack VHF/UHF/Satellite/Tropo-scatter communications systems. • Documentation- architecture/interface/division/protocol definition, WRL, interface cable design drawings, mechanical drawings, and ECN control.• Customer Proposal- Conducted ROM analysis, trade studies for main system components, and technical system design documentation.• Firmware- VHDL.

Mar 2006 - Oct 2007

Dedicated Field Applications Engineer

Centennial, Colorado, Us

Provided customer’s technical support for all design cycle phases, product presentations, Instructor for manufacture’s design tools for the Southeast region of the United States. Factory trained on all product linesSupported Lines- Twenty five active components manufacturer’s product lines with emphasis on Altera and Actel FPGAs. • Components Engineering support- component selections, obsolescence, risk and life cycle analysis and manufacture failure analysis. • Design tools- Factory trained on Altera’s Quartus II IDE, SOPC/DSP builder, NIOS II IDE, Modelsim, and Simplify, and Xilinx ISE design suite.

Nov 1996 - Nov 2005

Hardware Design, Systems Design, And Test Engineer

Bethesda, Md, Us

Radar department R&D design engineer for radar test system and missile projects and antenna testing. Product Engineering Manager for the Pershing Missile Program.• Designs- digital interface control, analog antenna gimbals closed loop servo controls, mixed signal digital/RF, and system integration and test.• Mil-Std 810 design verification.

Mar 1986 - Nov 1996
2 education records

Robert Berlin education

B.S.E.E, Rf, Microwave, And Antenna Design

Florida Atlantic University Boca Raton, Fl

Associate Of Science (A.S.), Pre-Electrical Engineering

University Of Florida Gainesville, Fl
FAQ

Frequently asked questions about Robert Berlin

Quick answers generated from the profile data available on this page.

What company does Robert Berlin work for?

Robert Berlin works for Seperation Technologies Inc.

What is Robert Berlin's role at Seperation Technologies Inc?

Robert Berlin is listed as Principal Engineer at Seperation Technologies Inc.

What is Robert Berlin's email address?

AeroLeads has found 1 work email signal at @controllaser.com for Robert Berlin at Seperation Technologies Inc.

What is Robert Berlin's phone number?

AeroLeads has found 2 phone signal(s) with area code 407 for Robert Berlin at Seperation Technologies Inc.

Where is Robert Berlin based?

Robert Berlin is based in Sanford, Florida, United States while working with Seperation Technologies Inc.

What companies has Robert Berlin worked for?

Robert Berlin has worked for Seperation Technologies Inc, Control Laser Corporation/Control Systemation Inc, Camgian Microsystems, L3 Communications, Orlando, Fl, and Comtech Systems.

Who are Robert Berlin's colleagues at Seperation Technologies Inc?

Robert Berlin's colleagues at Seperation Technologies Inc include John Jayapaul.

How can I contact Robert Berlin?

You can use AeroLeads to view verified contact signals for Robert Berlin at Seperation Technologies Inc, including work email, phone, and LinkedIn data when available.

What schools did Robert Berlin attend?

Robert Berlin holds B.S.E.E, Rf, Microwave, And Antenna Design from Florida Atlantic University Boca Raton, Fl.

What skills is Robert Berlin known for?

Robert Berlin is listed with skills including Semiconductors, Embedded Systems, Pcb Design, Manufacturing, Product Development, Sensors, Component Engineering, and Documentation Control.

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