Leading a team of three design engineers in an effort to streamline and drive platform commonality across multiple product development activities.

Responsible for design and development of advanced packaging of Photonic Integrated Circuits (PIC).

Led mechanical design of multiple air-cooled and water-cooled production and test & validation high-performance computing (HPC) interconnect modules from initial concept to final design release.• Completed static stress and burst pressure analyses via Creo Simulate FEA software to ensure feasibility of designs.• Worked with contract manufacturer (CM) to troubleshoot build issues and evaluate prototypes upon fabrication, providing feedback to CM. This ensured that deficiencies were identified and resolved prior to production release.

Supported inbound ecology collateral collection and outbound declaration creation, including restructuring bill of materials, training of suppliers, uploading supplier documentation to environmental compliance database and fielding specific customer requests.• Provided design for ecology advice to mechanical and electrical engineering teams in order to eliminate design mistakes that would require rework in order to be ecologically compliant.• Tracked new and updated worldwide ecology regulations and assessed impact to business unit. Coordinated efforts with product regulatory engineer to implement changes to product line to minimize exposure due to regulation changes.

Led mechanical design of electronics modules containing RF, power regulation, and digital circuitry. Created and maintained 3D models, drawings, and parts lists at all levels of assemblies using PTC software (EPDM).• Verified designs through prototype builds and testing, documenting results in test reports for review by management.• Controlled the mechanical design of breakout PCB for bench testing of CCAs with fine-pitch connectors, allowing test engineers to probe various parts of the interconnect.

Completed rotational leadership program with positions in mechanical design, systems engineering, and software programming.• Studied flatness of antenna array using a FARO Laser Tracker and MATLAB 3D plotting. Presented results to engineering and manufacturing interdisciplinary team.• Designed and tested 3D-printed titanium bracket coupons to establish flight design allowables. • Performed Aegis Combat System-level verification testing in order to satisfy overall design baseline objectives, including conducting requirements verification testing for regression and new/modified functionality.• Created technical presentations for Missile Defense Agency and U.S. Navy customers to clearly communicate design concepts and program status.• Gained proficiency with the VB.NET programming language and Microsoft Visual Studio 2010 IDE to add new functionality to the Test Execution Manager program for the engineers in the field.

Fabricated tooling and fixturing for top-level system integration and subassembly construction. Reviewed technical data packages and updated drawings for manufacturability. Created build instructions for manufacturing operators.• Determined the build flow of production, including build area layout and sequence of installation. • Implemented producibility improvements, including converting individual fasteners to SEMs hardware, saving over $5000 per antenna ($150,000+ for program).

• Aided in the design and implementation of the engineering drawings database. • Created, modified, and distributed engineering drawings using AutoCAD 2005.• Operated the service area for the Quality Control labs.• Assisted in validating the new distilled water system.