Robert Towne Email and Phone Number

Lead Application Engineer experienced in high-frequency electromagnetic simulation with a focus on PCB and package level signal integrity, power integrity, and electromagnetic compatibility. Extensive knowledge of quasi-static (2D and 3D) and full-wave (2.5D Hybrid and 3D FEM) field solvers, as well as circuit analysis.Wide skill-set gained by tackling tough EM design challenges (SI/PI/EMI) across various industries (automotive, industrial, and consumer hardware): - Signal Integrity: SERDES and DDR simulation. Experience with SPICE modeling and circuit-level analysis, including IBIS and IBIS-AMI models, as well as time-domain (transient and convolutional) and statistical analysis. Familiar with equalization techniques (FFE, CTLE, DFE). - Power Integrity: DCIR (voltage drop) and AC power analysis, including decoupling capacitor optimization. - EMI/EMC: Both PCB-level and System-level EMI analysis. Includes DRC, induced voltage, near-field and far-field analysis. System-level EMI analysis with PCB and mechanical models (cables, connectors, housing, etc.).

SI engineer supporting multiple high-speed hardware projects within Microsoft from both a signal integrity and power integrity perspective.Experience evaluating SERDES (DP, USB, PCIe, MIPI) and DDR (DDR3/LPDDR3) interfaces. Significant work with correlating simulation and measurement results (TDR, Eye Diagrams, S-parameters, etc.).Proficient with a variety of simulation tools, including Ansys SIWave/Designer/Q3D/HFSS, SiSoft QSI/QCD, Cadence/Sigrity PowerDC/OptimizePI, Mentor Graphics Hyperlynx, Synopsis HSPICE, and CST Microwave Studio.