Design, develop and test PCIe Gen3 and Gen4 host interface boards and expansion chassis using Broadcom chipsets. Specific implementation includes the use of Intel and Xilinx FPGAs and development of Verilog code. These chassis hold flash for mass storage and GPUs for high performance computing.Perform the complete range of project development including requirements determination, schematic capture using OrCAD CIS, oversee board layout, design review, product test and validation and transfer of product to Production departmentBoard development included utilizing high-speed circuit and PCB design (up to 16GHz), power supply analysis (up to 1000 watts), thermal abatement using heatsinks and component selection. Integration of other design standards including IIC, SPI and JTAGFamiliar with a variety of laboratory instruments including oscilloscopes, signal generators, power supplies and logic analyzers for the detailed validation of electronic assemblies. Created OrCAD CIS database from previously used Excel-base method. Maintained database using Component Information Portal.

• Utilize a broad scope of industry knowledge and dynamic engineering acumen toward design and development of validation and software development platforms for mobile 2G, 3G, and 4G baseband processors.• Design ASIC characterization boards for use in temperature testing and ASIC I/O characterization. • Perform system definition, architecture definition, and partitioning of requirements between PCB assemblies.• Collaborate cross-functionally with HW, SW, and Test groups for developing system and assembly requirements. • Serve as an integral technical specialist for camera and display products, including maintaining vendor lists, monitoring roadmaps, and assisting in product selection. Key Achievements• Mobile Platform Software/Bring-up Platforms o Developed a small-scale software development / bring-up board that significantly reduced product footprint. Fully utilized panelization but maintained flexibility by using daughter cards. o Spearheaded design of daughter cards to meet power, display, camera, audio, connectivity, and sensor requirements, along with participating in the bring-up of six highly-complex baseband devices and their revisions.• Mobile Processor Characterization Platforms. o Lead designer for 3 projects -- The board design teams composed of 3 to eight people depending on the phase of the design. Each design takes about six months to complete starting with determining requirements and ending with product test. • SI / PI Tools (Sigrity / Cadence, SIwave, HSPICE, Hyperlynx, ADS) were used to analyze and improve power and signal sections of PCB layouts. o Designed critical layouts for flash devices, high speed differential busses and LPDDR1, 2, and 3.

Senior Hardware Design Specialist • Designed, developed, and tested Cable Modem Reference Designs for three single-chip cable modem SOCs containing SDRAM, Flash, Ethernet, and RF Tuners. • Designed a production cable modem for Sony utilizing those reference designs.• Worked with RF design engineers to create a six channel receiver PCB board integrated with set-top box components. • Led targeted design of evaluation / turn-key set top box containing cable modem, audio and video interconnections. Used set-top box and NTSC/PAL video decoder/encoder reference designs.• Designed numerous evaluation boards for 12 different NTSC / PAL video encoder/decoder ASICs, and designed development platforms using Xilinx FPGAs, including creating a test platform emulating PCI-Express. Hardware Design Manager• Directed a results-focused team of three design engineers and four technicians designing, developing, and evaluating ASICs for demonstration and evaluation boards. • Contributed expertise with state-of-the-art satellite, video decoding, video encoding, and cable modem products design. • Maximized use of resources to achieve goals by developing and monitoring project planning schedules allowing resource balancing and coordination with ASIC, software, and management organizations and achieve key goals.

• Lead engineer for production inertial guidance and ice detector subassemblies for the Advanced Cruise Missile (ACM) program. • Created two high-throughput image processing modules for advanced cruise missile guidance system using laser-based sensors.• Utilized parallel / wavefront hardware architecture that provided the necessary throughput. • Performed design verification using Daisy / Mentor Graphics CAD and simulation tools.• Supervised technical progress and coordinated interfaces between assemblies.• Overviewed subassembly reliability and generated ECOs and corrective action reports as required.