Robert Haney Email & Phone Number

• Transfer of diverse process tool-set for CVD, Etch, PVD processes from previous fab to new fab location in Singapore.• Daily challenges consisted of determining equipment condition from the decontamination/ packaging/shipping process from previous Israel install. This lead to the strategy of how best to recover and set-up the tool for a timely re-qualification, matching of tool parameters to historic baseline and timely qualification procedure.

Santa Clara, Ca

Collection of technical details, coordinating experimental activities and process transfers.

Sunnyvale -Ca

• Core Engineering supporting RTP and Epitaxi products. Evaluation of new materials for use with optical coating or mechanical properties advanced chamber design. • Account Technologist for Japan Region. Additionally supported High-k and Nitridation process development efforts for the Japan customer base, IMEC and IBM Alliance.• Responsible for process validation of newly installed chambers. Worked with customer on-site to carry out additional process tuning or development activities.• Successfully executed customer demos that lead to product sales. This included negotiating scope of demo request, site to site metrology matching, routing of requested analytical work and logistics of the demo material.• Worked with chemical to produce a Lutetium precursor and successfully developed an ALD Lutetium Aluminate process to support a customer’s R&D efforts• Part of High-k equipment engineering team tasked with process performance enhancements and hardware modifications to add new process capabilities. An example of this effort was a 7x improvement of kit life for an MOCVD process compared to the previous product specification which greatly lowered cost of ownership to our customers.

Sunnyvale Ca

• Owner of HiK ALD and MOCVD equipment penetration into Asian accounts and IMEC.• Built relationship with account teams in Japan, Singapore, Taiwan and France. This rapport greatly aided in contract negotiation, technology transfer, training and problem solving.• Extensive analysis of ALD/MOCVD process and hardware interactions for improved process results and chamber life.• Successfully extending MOCVD process kit life by seven times the normal life cycle.• Owner of Japan Region for xGen (poly-Si, Nitride, HTO), RTP, DPN and Hi-k for process development/ product improvement. Also supported Chartered, IMEC and IBM Alliance.• Collaborated with IMEC and local process team to successfully develop ALD Lutetium Aluminate film.

Us And International Locations

• Skilled at communicating with local account team and customer to deliver quality results and convey information clearly.• Selected as member of install team to deliver equipment and qualify to production status in Singapore, Taiwan, France and Germany.• Successfully installed and process qualified eleven 200 and 300mm systems for PVD Al Stack, Cu Barrier Seed, RTO, RTA, High-K, Poly Si, HTO, SiN, Super-E etch.• Met and exceeded allotted qualification time schedule. Negotiated and solved hardware issues arising from non-conformance from new and refurbished equipment.

• New facility start-up. Was key contributor to facilities layout/planning and capital equipment acquisition. • Primary role as Application Engineer. Defined technical requirements for customer evaluations of chamber component cleaning and refurbishment. Involved in all phases of interaction with customer from purchasing department to engineering groups. • Developed chamber component improvements that enhanced process performance and improved overall part lifetimes. • Secondary role as QA/QC Manager. Set up of new QC lab and training of company personnel.• Initiated and tracked NC and FA activities through facility. Performed correlation studies and failure analysis of process kit parts. Determined failure root cause and either corrected the procedural non-conformance or devised engineering solutions if warranted.

• Core team member developing process kit improvements for PVD products.• Traveled globally to support sales with product penetration. I owned the process performance aspect and was often on-site at the customer's fab to install, integrate and monitor the evaluations.• Completed a 1 year assignment in Singapore to focus on product penetration throughout Asia. Additionally had oversight of the partner/vendor's operations that provided our OEM parts and process kit recycling for this product. This included set up and qualification of AMAT proprietary processes used in preparation of the parts and QC monitoring.• My role expanded to include applications support for a DPS etch chamber enhancement as well.

• Intel Account support for Endura platform based processes and Centura RTP. Supported the installation, integration of over 50 systems throughout Intel’s global sites including the green field F18 site in Israel. Endura processes included (Al, IMP Ti, TiN, Cu, SIP Ta/TaN, Co, Ni, TxZ) and RTP (Silicide, Implant Anneal, Oxidation). Heavily involved with process improvement and defect reduction programs. Successfully project managed a Beta chamber at PTD Oregon assisting customer with process development, hardware/ process troubleshooting and metrology development. Trained Intel and AMAT staff on processes and issues relating to tool setup, process integration and metrology usage.• Applications Engineer for PVD, CVD and SEM-Vision defect review system for ST Microelectronics account. Managed installs and process qualifications for North American sites. Several of the products were "First in Fab" and required extensive process development support with customer to make the product successful. Engaged with customer for monthly program meetings, CIPs, application support and troubleshooting.

• Part of design team tasked with chamber design scale up from 200mm to 300mm wafer processing. Spent extensive time involved in the thermal modeling of the impact of wafer support mechanism’s impact on slip generation. Inventor and Co-inventor of several design features that reduced bulk defect generation during thermal processing. Tasked with defining beta tool process performance requirements along with hardware/ software features for customer site placement. Successfully shipped AMAT's first 300mm system to a customer site.• Managed RTP Division’s 300mm metrology acquisitions. Worked with Core Technology group on resource sharing to establish the 300mm metrology lab. Became interim lab owner. Investigated new technologies early in vendor development stages and developed procurement plan. Worked with corporate resources to negotiate purchases of systems. • Characterization of 300mm process chamber for conventional RTP processes and developed C&F hardware to investigate in-situ steam generation and CVD.• Member of small team that adapted hardware through modeling and experimentation for next generation epitaxi deposition for 300mm wafers. • Performed demonstrations and generated reports of tool capabilities for customers. Supported process development needs for the first AMAT 300mm beta system shipped to our customers.

• Primarily tasked with installation and qualification of PVD systems for use on new pilot line.• Worked with tool owner on process as transferred from R&D group. Extensively "fingerprinted" each system's hardware parameters. This project had the goals of (1) to understand what constitutes a match being driven by the new "Copy Exactly" methodology being implemented (2) tracking these parameters through PMs and SW upgrades (3) Create a list of deliverables to drive the equipment vendor on a path of continued improvement. Additionally, performed further characterization of process by analysis of electrical test, reliability and defectivity data.• Other duties involved implementation of factory automation, improved data collection schemes, technician certification, SPC monitoring of process and metrology tool set (e.g. thin film measurement, defectivity etc.)

• Worked for Lab Manager to supply process support for the demo lab. Responsible for equipment evaluation/selection and set up of new NPI demo and development laboratory. Defined equipment set needed, negotiated purchases and acceptance specifications for this equipment.• Tool owner for analytical SEM and CD-SEM metrology used to support wafer stepper lens evaluations and photoresist characterization. Worked extensively with the photoresist vendors to keep appraised of their development efforts for performance enhancements and next generation products. Side benefit of these collaborations was free product which reduced lab operating costs greatly. • Worked with Intel Component Research Group on next generation stepper development along with new lens characterization scheme. Received award from Intel based on this work.• Co-authored paper for SPIE relating to thin film metrology. Contributor on three papers relating to process endpoint control, photoresist characterization and stepper lens performance.• Set and maintained operating budget for lab. Negotiated gas, chemical and consumable supplies used by laboratory.• Characterization of CD-SEM, Coater/developer tracks, thin film measurement equipment

Tempe Az

• Prior to ASML Apps lab stat-up was attached to Epitaxi group for development of Epsilon reactor. This included work with modeling group, creation of new hardware, generation of experimental results and readying chamber for demo activity.• Responsible for set up and maintaining new applications lab to support ASML products. Evaluated and performed source acceptances for the process support and metrology equipment (wafer track, RIE etcher, profilometer, optical CD metrology, surface particle monitors etc.).• Responsible for characterization and maintenance of dry etch system that was key tocustomer applications support and in-house processing capabilities.• Cross section SEM for analysis of stepper lens DOF studies and etch process performance.• Assisted in demonstrations of wafer stepper and worked with customers on process related issues.