Academic in the Wolfson School of Mechanical and Manufacturing Engineering. I am a senior member of the Additive Manufacturing Research Group (AMRG), one of the largest research groups in the University. The Wolfson School of Mechanical and Manufacturing Engineering is one of the largest and most successful engineering departments in the UK and boasts an established reputation for excellence in teaching and research, as well as strong links with industry. The work performed by the Additive Manufacturing Research Group is based around a family of processes comprising of adding layers of material and either bonding or fusing them together. These techniques are used to create 3D geometries directly from 3D CAD models with no need for tooling. These technologies are commonly being referred to as 3D Printing. The focus of the group is firmly placed on researching the use of these manufacturing technologies to directly produce end-use products. Products produced by Additive Manufacturing have advantages of greater freedom in product design and less reliance on high production numbers required for economic production. Furthermore, as is an increasingly major theme of our activities, our research also focuses on enabling greater potential value and application by integrating additional engineering or systems functionality within a single component.

Research associate working on the Innovative electronics Manufacturing Research Centre (IeMRC) flagship ‘Smart Microsystems’ project which focuses on the development of integrative manufacturing techniques and the employment of novel materials to create a portfolio of innovative multifunctional microsystems. Roles included supervision of MSc students, presenting project results to academic partners at monthly project meetings and dissemination of results in high impact factor journals.

Chief Technical Officer, founding director and shareholder of MicroStencil Limited. MicroStencil was a start-up company spun out of Heriot-Watt University. The company developed a novel process for the manufacture of precision electroformed components which has several applications in the microelectronics industry with the main one being for the production of stencils used in the deposition of materials for electronic packaging.Timeline as CTO at MicroStencil:• August 07 – October 2010: Implementation of a technology licensing partnership with DEK International. This involved relocating to Singapore from Livingston, UK. Within this role I trained the technical and sales teams in South East Asia, completed a full cleanroom based production process transfer from UK to Singapore, and successfully transferred large format precision optical mirror manufacture to Nanjing, China which resulted in revenue of £300K to the company.• June 2005 – August 2007: Post equity and government grant investment. Secured £1.2million venture capital investment, £340K of government grant funding and £250K of business loans into an operational business. • November 2003 – June 2005: Formation of MicroStencil Limited prior to equity investment. Scale-up of original lab-scale concept to pre-production prototypes, generate a business plan, secure company finance and investment, generate early market traction.

Two-year contract working full time as a research associate on a project entitled “MicroSystems Assembly Technology for the 21st Century (MAT21)”. This multidisciplinary project worked on developing a low temperature, low cost flip chip assembly process. The MAT21 project was a collaborative effort between three academic partners and seven industrial companies covering the full electronics manufacturing supply chain.During this project I was the named inventor on two internationally granted patents and directly formed the spin-out Company, MicroStencil Limited to commercialise the work. Several aspects were published through world-class journals and International conferences. This research and commercial development provided a stand-alone Impact Case study for Heriot-Watt University in REF 2014.