Senior leader on the product and test team developing production and characterization content with a focus on power and performance for all three generations of AMD’s breakthrough Ryzen and Threadripper CPU desktop products, including the first chiplet design with separate CPU and I/O die in one package.

Technical lead for AMD worldwide electrical fault isolation teams. Oversaw all failure analysis activities for dozens of products, working with cross-functional teams of designers, product engineers, quality / reliability engineers, and customer support personnel in successfully launching new products. Led FA activities for introduction AMD’s most significant and challenging products, including 1st CPU/GPU hybrid, 1st 32nm SOI device, and 1st ARM64 server part.

I transitioned from working as an individual contributor to a much broader role as the electrical fault isolation lead for new products, which required a step back from hands-on work to spend more time working with our internal customers to define and drive the processes and procedures necessary to successfully deliver our newest products. I was the EFI lead on AMD's most challenging new product in 2010, which was our 1st GPU/CPU SOC in a single chip, our 1st product on 32nm, and our 1st product after AMD became a Fabless company. I took over responsibility for the EFI lab roadmap, which required long-term planning to ensure we had the right tools and skills for upcoming technologies. Our equipment is highly advanced, specialized, and focused on very specific functions; aligning our needs with our vendor's roadmaps requires technical expertise, a collaborative mindset, and business sense to buy the right tools for the right price. I defined tool requirements, evaluation and acceptance criteria, performed tool evaluations, worked with external vendors to define requirements and timelines, and generally made sure we were ready to support our upcoming products.

I was lucky enough to find my perfect job right out of grad school, and spent my first few years learning everything I could about semiconductor failure analysis while working on the most complicated devices ever designed on cutting edge technologies. I got to perform product engineering and failure analysis work on all AMD x86 CPU products, including server, desktop, and mobile parts on 130nm-65nm technology nodes, working on problems and challenges that had never before been encountered while working with incredibly smart, motivated engineers to develop new methods for finding and fixing those issues.