Roger Ding Email & Phone Number

Focus on NPI, new project data confirm, especially for PCB Layout, structure and key components that can be processed and maintainability and give related countermeasures.

Shanghai City, China

Responsibilities：1.To optimize the organization of process and equipment engineering department , improve the whole team business and service level. 2.To establish and improve the engineering responsibility, process and equipment operation procedures, emergency response plan, etc. 3.To set up annual training plan for all of employees and implement, improve employees' comprehensive business operation ability. 4.To set up the equipment annual maintenance budget and cost control plan and strictly implemented. 5.To find new projects, improve and standardize them. 6.To be responsible for engineering and technical personnel regularly examine, evaluate and provide positive and promotion reference basis for personnel. 7.To be responsible for the equipments evaluation, material purchasing project examination and approval, engineering material and storage of inventory management. 8.To set up the equipments yearly, quarterly, monthly maintenance plan, and organize their implementation.Achievement：1. Optimize the organization of P&E Department. 2. Set up annual training for P&E Department and implement. 3. Phase in DFM for all of new projects. 4. For first article production, we use film process instead. And we can cancel the old process which need an extra PCB(the PCBs cann’t be used again) for this pilot run. 5. Re-use wave soldering, it saves 25% of manpower. 6. New turnover tools introduction and optimization. 7. Automatic soldering machine introduction. 8. Change interconnector pin process from box build to SMT area directly. 12 manpower has been saved.

Kunshan City, China

Responsibilities：1).Benchmark Study 2).To confirm the manufacturability of new project.To confirm the final design data of new project, especially for PCB Layout, structure and key components that can be processed and maintainability and give related countermeasures. 3).New project phase inNew project management(hold prepare meeting and readiness meeting,track the abnormal issues),and prepare the processes and SOP, track the production status on line and deal with the abnormal issues, prepare the pilot run reports, maintain the Debug system, etc.4).Productive maintenance To evaluate the production capacity, optimize the layout of plant, prepare work instructions, maintain ERP/SAP system and phase in design changes to production, etc.5).Site improvementTo handle with the abnormal issues from production lines, evaluate the cycle time of products, and keep them balance, etc.6).Quality improvementTo improve the quality about inside and outside, FA which contain factory quality problems and after-sales quality problems, etc.7).Supplier managementTo deal with the abnormal problems in processing of suppliers, to establish the key control points, regular audit, regular discussion with suppliers, and qualify related issues and track the result.8).SMT project managementAchievement：1.To set up Process Team in half a year.2.To build the whole process check system and the related standards which involves: benchmark study, digital prototype, physical prototype,the Mass Production (including small batch). At the same time, we have been tracking the abnormal issues from after sale, and update the standard if need.3. Yield improvement for assembly, such as FFC is replaced by FPC, the failure rate declined very quickly from 0.1% to around 0%.4.To release the key control points for supplier's process which improve the incoming quality greatly and realize the win-win situation between supply and demand.5.SMT project phase in.

Responsibilities：To manage SMT process and equipment,communicate with global famous customers(eg. Siemens Intel,NEC,Sharp etc.)Achievements：1.To manage the related facilities and improve the efficiency of the facilities.2.To lead TH(high temperature) process, and phase in.3.To lead FPC process,and phase in. 4.To lead SMT Non-GP process change to GP process. 5.To phase in 2nd source solder paste,which help to cost down. 6.To lead OSP PCB SMT process,and phase in. 7.To phase in other new process and new material. 8.To set up SMT DFX rule and update in time. 9.To improve the quality of SMT process continuously.