Roger Stout Email & Phone Number

Mesa, Arizona, United States

Retired

Phoenix, Arizona, United States

In 2015, as an outcome of ON Semiconductor's revitalization of its Technical Ladder, Roger was assigned the job title "Senior Member of the Technical Staff."

As part of Motorola SCG, Roger and his staff made the transition to the new company, ON Semiconductor, with Roger maintaining his title as a Senior Member of the Technical Staff. As the new company reorganized to better fit a new business model, Roger was given additional supervisory responsibility (along with thermal) to include mechanical package.

In the Technology and New Product Development Division of the Semiconductor Components Group of Motorola, Roger had responsibility for the Thermal Characterization Laboratory. This included thermal modeling of new package designs (FEM simulations, thermal RC-network models), standard physical characterization of packages (for instance, wind tunnel.

In this role, Roger had widely ranging responsibilities to provide individual technical contributions to many areas of the internal equipment development process, from structural and thermal design and analysis, to writing system and process control software for microprocessor-based automation systems. His responsibilities also specifically included.

Roger developed a theoretical/empirical injection mold design analysis system, and was intimately involved in the early phases of Motorola's automatic semiconductor-packaging factory control system design. Roger's first patent was issued during this period, based on work done

In these former positions, Roger was the responsible Mechanical Engineer for a high-speed automatic transistor assembly line, and designed several high-speed die-bond heads utilizing various technologies, including the die pick mechanism and voice coil motor, for which he holds patents.

In these former positions, Roger was the responsible Mechanical Engineer for a high-speed automatic transistor assembly line, and designed several high-speed die-bond heads utilizing various technologies, including the die pick mechanism and voice coil motor, for which he holds patents.

Roger's first position with Motorola was to support the TO-220 assembly line expansion program. He was responsible for design, fabrication, or modification of in-house designed equipment, and much vendor interfacing for purchase of outside equipment. He also carried out special analytical projects for other in-house equipment programs as needs arose for.

While a Hughes Fellow working toward his MSME at Caltech, Roger spent one year in the Mechanical Stabilized Systems Department assisting in the mechanical and fluid-mechanical design and analysis of high performance tracking systems. His second year at Hughes was in the Thermal and Structural Analysis Department, where under the supervision of Dr. J. M..

Msms, Mechanical Engineering, Energy Option

Hughes Fellow

Bse Summa Cum Laude, Mechanical Engineering, Esp. Thermodynamics, Fluids, Heat Transfer

Activities and Societies: Inducted into honor societies: Tau Beta Pi (Engineering) Phi Kappa Phi (general academic) Phi Eta Sigma.

High School Diploma, Math And Science

Activities and Societies: Warrior Marching Band