Retired

In 2015, as an outcome of ON Semiconductor's revitalization of its Technical Ladder, Roger was assigned the job title "Senior Member of the Technical Staff."

As part of Motorola SCG, Roger and his staff made the transition to the new company, ON Semiconductor, with Roger maintaining his title as a Senior Member of the Technical Staff. As the new company reorganized to better fit a new business model, Roger was given additional supervisory responsibility (along with thermal) to include mechanical package characterization for the Technology Development Division. As an individual technical contributor, he continued his explorations of Laplace-transform based analytical models of thermal transients in solids, and writing thermal simulation computer tools in G (LabVIEW®). Over time, ON modified its job grading systems and job titles several times, giving Roger the various titles of Senior Research Scientist, Research Scientist, and Scientist (in that order, curiously enough), with no changes in responsibilities. Job duties continued to include team leadership for both thermal and mechanical package characterization and simulation for the Packaging Technology arm of Corporate R&D. Among other miscellaneous responsibilities, he coordinated the technical program for ON Semiconductor's "Final Manufacturing Technology Symposium" held in Langkawi, Malaysia, March 2004. Along with adding two additional patents to his resume, relating to thermal improvements in chip design, he also recently developed an interactive, continuous feedback thermal solver for visualizing the thermal interactions between heat sources both at the board level and at the chip level. Since 2007 he has taken on Sharepoint webmaster responsibilities for Corporate R&D. He has also provided valuable national and international "public technical relations" contributions for ON through publication of six articles in Power Electronics Technology magazine, and teaching full-day and part-day thermal characterization.

In the Technology and New Product Development Division of the Semiconductor Components Group of Motorola, Roger had responsibility for the Thermal Characterization Laboratory. This included thermal modeling of new package designs (FEM simulations, thermal RC-network models), standard physical characterization of packages (for instance, wind tunnel testing), and developing new characterization methods. He continued to provide ad hoc technical consultation services to the Sector.

In this role, Roger had widely ranging responsibilities to provide individual technical contributions to many areas of the internal equipment development process, from structural and thermal design and analysis, to writing system and process control software for microprocessor-based automation systems. His responsibilities also specifically included communicating his knowledge and experience to others, which has included teaching internal courses related to Motorola's work; Roger was also a guest lecturer at an ASU Engineering Analysis course in the Fall of 1991. Roger’s 2nd-4th patents were issued during this time period, the outcome of work initiated in the early ‘80’s. In 1989, Roger was awarded a Motorola-internal Eureka Fund research grant to attempt to reproduce Pons' and Fleishmann's "cold fusion" experimental results, aimed at possible semiconductor applications - a fascinating, exciting, but ultimately fruitless six-month adventure.

Roger developed a theoretical/empirical injection mold design analysis system, and was intimately involved in the early phases of Motorola's automatic semiconductor-packaging factory control system design. Roger's first patent was issued during this period, based on work done

In these former positions, Roger was the responsible Mechanical Engineer for a high-speed automatic transistor assembly line, and designed several high-speed die-bond heads utilizing various technologies, including the die pick mechanism and voice coil motor, for which he holds patents.

In these former positions, Roger was the responsible Mechanical Engineer for a high-speed automatic transistor assembly line, and designed several high-speed die-bond heads utilizing various technologies, including the die pick mechanism and voice coil motor, for which he holds patents.

Roger's first position with Motorola was to support the TO-220 assembly line expansion program. He was responsible for design, fabrication, or modification of in-house designed equipment, and much vendor interfacing for purchase of outside equipment. He also carried out special analytical projects for other in-house equipment programs as needs arose for thermodynamic and fluid mechanical expertise.

While a Hughes Fellow working toward his MSME at Caltech, Roger spent one year in the Mechanical Stabilized Systems Department assisting in the mechanical and fluid-mechanical design and analysis of high performance tracking systems. His second year at Hughes was in the Thermal and Structural Analysis Department, where under the supervision of Dr. J. M. Kallis he performed the research and analysis that was published in Circuit World in Jan. 1986.