I help people determine what broke, investigate why it broke, and recommend actions to keep it from breaking again. My experience is broadest for FIB precursors in vacuum chambers, and semiconductor packaging materials such as die attach, mold compounds, polymer overcoats, wire bond and flip chip connections, flip chip underfills, and package-to-PWB attach properties and reliability. My Bachelor's degree thesis was building a mass spectrometer; that's why I feel renewed in my latest use of my early knowledge in performing vacuum analysis of ion-beam and e-beam writing/etching precursors. To further assist others needing more knowledge of their equipment performance, I have assembled a portable residual gas analysis system for checking high vacuum chambers on-site.Specialties: Vacuum residual gas & FIB precursor analyses, wire bond and solder IMC, nanotechnology, failure analysis, reliability,testing, characterization, semiconductor packaging materials