Roman Staszewski Email & Phone Number

Us

Founded and manage Zenseio LLC, a startup specializing in the development of versatile Internet of Things (IoT) sensor devices for industrial applications, such as precision agriculture. Zenseio’s solutions are deployment-ready, secure, easy-to-use, and cost-effective, catering to various industries with a focus on reliability, low-power and long-range radios.Key contributions and achievements: • Developed robust IoT sensor devices designed for seamless integration into harsh industrial environments. • Ensured the products are secure, user-friendly, and optimized for rapid deployment and scalability. • Built cost-effective solutions to address diverse precision agriculture and smart-city IoT use cases, enhancing operational efficiencies for customers. • Lead the company’s strategic vision, product development, and customer engagement to ensure sustained growth and market relevance.This role involves end-to-end leadership across product design, business strategy, and customer engagement, driving innovative IoT solutions to meet industrial needs.

Dallas, Tx, Us

Developed advanced computer vision solutions for ADAS (Advanced Driver Assistance Systems) safety products, leveraging TI’s OMAP and Jacinto processors. Collaborated with customers, partners, internal development teams, and R&D labs to define software and hardware architectures for current and next-generation low-power embedded processors.Key contributions and expertise: • Designed systems for ADAS applications, including Front Camera, Surround View, Multi-Sensor Fusion, Smart HDR Rearview Cameras, Digital Video Recorders, and Radar integration. • Explored Autonomous Driving technology trends to align with TI’s ADAS product roadmap. • Led the strategy and development of TI ADAS reference software frameworks based on RTOS, hybrid (RTOS/HLOS), and hypervisor technologies. • Defined and initiated AutoSAR integration strategies with TI’s compute frameworks, collaborating with key industry partners for pre-integration into safety-critical products. • Provided guidance to influence OpenVX standards at the Khronos Working Group, ensuring optimization for automotive and safety-critical computer vision use cases.This role involved deep technical engagement, strategic planning, and cross-functional collaboration to advance TI’s capabilities in automotive vision and robotics systems.

Dallas, Tx, Us

Led cross-functional teams to design and implement innovative software frameworks and hardware platforms for Natural User Interaction (NUI) solutions, including touchless gesture UI, vision-based augmented reality, ultrasonic digital pens, robotics, and automotive computer vision systems.Key responsibilities and achievements: • Collaborated with R&D labs, customers, and ecosystem partners to develop efficient computer vision algorithms optimized for OMAP’s programmable hardware accelerators and TI C6x DSP. • Supported business development by delivering differentiated multimedia use cases through performance and power analysis, reference platform modifications, and prototype software implementations. Showcased solutions at global events such as Mobile World Congress and CES. • Spearheaded hardware innovation strategy for next-generation OMAP devices, focusing on custom hardware accelerators, ISA extensions, embedded Sensor Hub technology, and image and audio processing enhancements. • Conducted studies on innovative sensor technologies and evaluated computer vision algorithms from internal and external sources to guide OMAP strategy and strengthen partner ecosystem engagement. • Managed system integration of partner software into prototypes and final products, ensuring seamless execution and delivery. • Led a team of 20+ engineers across Dallas and Bulgaria, fostering collaboration and alignment toward product goals. • Served on TI’s Technical Ladder Council, developing strategies to promote technical innovation and leadership within the organization. • Cultivated partnerships with universities, driving research projects that aligned with TI’s vision and product roadmap.This role combined strategic planning, technical leadership, business development, and hands-on system integration to create future-forward NUI and embedded computing solutions.

Dallas, Tx, Us

Led the integration and digital architecture design of Digital Radio Processor (DRP) - a mixed-signal System on Chip (SoC) for UMTS transceivers, driving innovations in software reconfigurable digital radio technology and multi-standard wireless communications.Key contributions and achievements: • Managed the integration of mixed-signal SoC, ensuring seamless collaboration between digital and analog components. • Defined the digital system architecture, API interfaces with baseband modems, and a comprehensive digital power management system. • Invented and led the implementation of a software reconfigurable DRP data-path and control architecture, enabling future multi-standard DRP derivatives and Software Defined Radios (SDRs). • Developed an architecture based on Application Specific Instruction-set Processors (ASIPs) to leverage the strengths of deep-submicron CMOS technology for high-performance digital signal processing. • Re-engineered the RF All-Digital Phase Lock Loop (ADPLL) to perform loop calculations using ASIP, reducing spurs in sensitive RF regions and enabling flexible, software-defined configurations to meet the demands of diverse radio standards. • Established a platform that served as a foundation for Software Defined Radios, advancing the evolution of next-generation communication technologies.This role involved leading-edge innovations in digital signal processing, SoC integration, and software-defined radio, pushing the boundaries of multi-standard communication systems.

Dallas, Tx, Us

Architected and led the development of the DRP (Digital Radio Processor) core for single-chip GSM/EDGE phones, driving seamless integration with multiple baseband processors while maximizing legacy software reuse.Key contributions and achievements: • Designed the radio control architecture around a new ARM processor, enabling efficient integration of the single DRP core with multiple baseband processors. • Co-developed a robust firmware architecture to enhance the system’s reliability and performance. • Led a team to establish software development and debugging methodologies within a VHDL simulation environment. • Oversaw the creation of comprehensive documentation covering the DRP control system, architecture, and software to ensure clarity and maintainability. • Regularly facilitated lessons-learned reviews and promoted best practices across global DRP teams. • Fostered strong relationships with universities by hosting professors and students to share their research at TI and delivering guest lectures at academic institutions. • Co-authored numerous technical publications on DRP technology in leading journals and presented at conferences such as CICC, JSSC, VLSI, DCAS, and IWSOC. • Served as an invited panelist at IWSOC 2005, contributing insights on the topic of “SOC vs. SIP.”This role involved a blend of technical innovation, leadership, and collaboration with both academia and the industry, advancing DRP technology and contributing to TI’s leadership in mobile communication solutions.

Dallas, Tx, Us

Spearheaded the development and implementation of advanced digital circuits for the groundbreaking single-chip GSM phone, utilizing deep-submicron CMOS technology to set new industry standards in performance, power efficiency, and manufacturability.Key contributions and achievements: • Led the implementation of multi-GHz digital circuits, including phase generation for a switch-cap RF mixer, 1-bit 600MHz Sigma-Delta ADC, Sigma-Delta AM modulator, Time-to-Digital Converter, and Sigma-Delta dithering of the DCO. • Developed a methodology using Pyramid auto-place-and-route tools, incorporating custom placement and routing information for critical cells. This approach saved 20 man-months of manual layout effort and enabled rapid timing closure using static timing analysis tools. • Designed an ASIC library optimized for high precision and manufacturability, ensuring high-yield production of ultra-high-performance digital circuits. • Architected the control system for the RF radio subsystem, ensuring seamless operation and integration. • Led the global implementation of complex digital data paths and a custom microprocessor, achieving best-in-class results in both area efficiency and power consumption. • Developed and implemented a comprehensive validation methodology to ensure the reliability and accuracy of the mixed-signal system.This role required expertise in high-speed digital design, ASIC development, mixed-signal integration, and cross-functional collaboration, establishing TI’s leadership in single-chip mobile communication technology.

Dallas, Tx, Us

Led the development and implementation of TI’s first fully integrated wireless mixed-signal System-on-Chip (SoC) for Bluetooth, leveraging deep-submicron CMOS technology to deliver industry-leading performance, power efficiency, and area optimization.Key contributions and achievements: • Pioneered the design and implementation of critical multi-GHz circuits operating at ultra-low power, achieving first-pass silicon success with no functional, timing, or performance faults. • Developed a comprehensive methodology for building and verifying large mixed-signal/RF systems-on-chip within TI’s standard ASIC design flow. • Championed the integration of the radio system with the digital baseband processor, achieving the lowest area and power consumption in the industry for comparable solutions. • Led a global team to verify the Digital Radio Processor (DRP) implementation, resulting in the first-pass production of 10 million functional devices.This role combined technical leadership, innovation, and cross-functional collaboration to bring TI’s first Bluetooth SoC to market, setting new benchmarks for performance and efficiency in wireless communication systems.

Dallas, Tx, Us

Designed a variety of mixed-signal CMOS integrated circuits (ICs) for applications spanning video, wireless, graphics, and security, delivering high-performance solutions across multiple domains.Key contributions and achievements: • Developed advanced ICs, including video RAMDACs, wireless security devices, NTSC/PAL digital video decoders, and 3D graphics accelerators. • Designed and implemented complex circuits, including high-speed digital logic, ADCs, DACs, switching and linear power regulators, microcontrollers, and memory controllers. • Ensured seamless integration of analog and digital components, optimizing performance, power consumption, and reliability across diverse applications.This role required expertise in mixed-signal design, power management, and high-speed digital circuits, contributing to innovative solutions across a range of industries.

Msee, Telecommunications

Bsee, Telecomminications