> Through my career, interaction is a requirement where in I have delivered technical presentation to audiences.> Well familiar with process documents such as Failure analysis, Construction Analysis, Application Engineering, Assembly Process Engineering and Design of Experiments (DOE).> Able to work effectively under pressure, meet deadlines and interact responsibly at all times.> Team player with a positive attitude. Able to interact and perform successfully within a team environment. > Knowledgeable in semiconductor assembly equipments.Specialties: > Semiconductor Soldering Products Application> Soldering Material Process> Soldering Mechanics and Principles> WLCSP Ball Drop > Flip Chip Attach> Solder Die attach> SiP Application> Ballattach Process> Singulation Process> Process and Automation> Equipment Maintenance
Listed skills include Failure Analysis, Design Of Experiments, Semiconductors, Manufacturing, and 34 others.