Program Manager, C4 Bump Technology
CurrentJDP Program Manager onsite @ IBM At IBM East Fishkill, NY: * Project manager, process engineer, customer service engineer * 3 Joint Development Projects (JDPs) - IBM's C4 Bump Technology * JDP1: Physical Vapor Deposition (PVD) of metals -- Ti, TaN, Cu * JDP2: Electroplating of metals -- Sn, Ni, SnAg, Cu, Au * JDP3: Resist strip of thick dry film.