- Technical Engineer on Intel Atom® based processor systems including smartphones, tablets, netbooks, mobile devices, converged mobility and server 5G base stations. - Assisted customers understand the differences between Core Architecture and Atom Architecture when working technical support issues. Debugged virtualization support issues on micro server.- Supported development of the first quad core Intel Architecture smartphones, which gave us improved modems and very low power processors supporting the full software stack.- Developed and maintained collateral to support product, including firmware and driver update packages and installation scripting.

- System Engineer for advanced servers and workstation products. - Triaged, debugged, reported product sightings in pre-production environment to support product release. - Collaborated with internal and external design team on design issues to ensure quality product standards. - Identified performance issues in OS related to ACPI table/DMAR table setups, interrupt routing using OS tools/commands to monitor processor performance, IO setup and memory.-Technologies: Data Center Persistent Memory Modules (DCPMM), Optane, FPGA, Virtualization VTd/VTx/IOMMU/IOSRV, RAS features, Baseboard Management Controller (BMC), advanced storage.- Developed and maintained collateral to support product, including firmware and driver update packages and installation scripting.

- Technical Engineer on Ultra-Mobile products including laptops, 2-in-1’s, convertible, benchtop prototypes and ODM form factor reference designs. - Assisted software enabling developers through technical issues ranging from baseboard issues, mechanical issues, peripherals, touch display issues. - Drove improvements on socketed BGA devices with the integrated silicon contactor socket and passive thermal heatsink mounting solutions. - Developed and maintained collateral to support product, including firmware and driver update packages and installation scripting.

- Supported lab of 50 people. Ensured test equipment calibration, ESD compliance, layout, equipment, tools, supplies, recycle procedures, IP protection. - Solder certification in 2017. (exp 2019) - Planned, managed supported spares and documented common failures to resolve issues cutting spares budget by over 50%. - Assisted with testing, layout and process definition on remote access SDP cloud solution which consolidates prototype development systems for software developers saving approximately 2M Dollars.

- Technical Engineer on Itanium servers supporting technical issues on software development platforms for IA-64 architecture. - Firmware on IA64 had to be invented for the system along with a ported operating system and drivers for Linux and Windows.- IA-64 was the first system to use the Unified Extensible Firmware Interface we use today on all platforms. - I also resolved technical issues on memory, processor tray and IO tray hot-plug technologies.- Developed and maintained collateral to support product, including firmware and driver update packages and installation scripting.

Responsible for providing component level debug and repair on Intel products for post-sales support. • Provided Component level debug and repair on all post-sales Intel products include server boards, desktop boards, systems, hubs/switches, etc. • Used Intel In-Target-Probe (ITP), Oscilloscope, Digital Multimeter (DMM) and schematics to debug faulty motherboards with failures after functional test (ASTF) and Automatic Test Equipment (ATE) tests. • Failures included corrupted ROMS, D2D power supply failures, Audio circuit failures, damaged/corrupt data lines through the north/south bridge, solder issues, etc.• Documented baseboard debug process and other lab processes in support of ISO 9002 Certification.Intel Quality Award - 1999 - Division award for obtaining ISO 9002 and turning into world class repair center.