• Lead technologist responsible for assessing and evaluating process, equipment and device layout changes of a MEMS accelerometer foundry supplier.• Identified and successfully implemented several process and tooling changes that contributed to an overall 30% wafer level electrical yield increase and improved foundry wafer manufacturability.• Performed wafer level electrical probe, in-line process, material property, and defectivity analysis and generated technical reports of findings, conclusions, and recommendations.• Provided technical guidance to both NXP and foundry partner engineering team members.

• Worked on process development of MEMS microphones with overseas foundry partners.• Supported development and quality activities at a foundry in Dresden, Germany.• Reduced wafer yield loss by 20% due to an incorrect inspection tool setup at an overseas packaging facility.• Averted a fab process line shutdown by quickly evaluating and qualifying alternate photoresist chemistry.• Evaluated data to justify new equipment and processes to support increased foundry wafer fab starts.

Motorola, Freescale, NXP - (3 companies listed due to company acquisitions) 1995 - 2016 MEMS R&D Process Engineer, NXP Oakhill Fab |Austin, TX | 2007-2016• Evaluated and implemented fixes to resolve dielectric and polysilicon film, MEMS device release, and metal attack issues that led to increased yield and reliability performance.• Developed and qualified a CVD based SiGe layer for MEMS cap wafer sealing.• Evaluated and developed novel anti-stiction, wafer bonding, and polysilicon stress relaxation techniques.• Filed patents to protect intellectual property.Technical Staff Engineer/Scientist, Freescale MOS-11 | Austin, TX | 2004 - 2007• Started up Freescale’s first 8” wafer fab product line of accelerometers, gyroscopes, and diaphragm-based sensor devices for consumer and automotive customers. • Wrote process/operations procedures and defined in-line monitoring of key manufacturing steps.• Served as Process Engineer individual contributor in Metals/Dielectric Thin Films, Diffusion, CMP, and Epi.Principal Staff Engineer/Scientist, Motorola MOS-17 | Tianjin, China | 2001 - 2004 • Part of the Process Engineer start-up team of the MOS17 CMOS and BiCMOS manufacturing facility in China. • Served as a technical advisor and resource to help resolve process and device engineering related issues.• Trained and mentored local engineering hires. Thin Films/Implant Process Engineering Section Manager, Motorola MOS-13 | Austin, TX | 1995 - 2000Managed and directed a team of process engineers and technicians responsible for the following 8” wafer processes: RTP, Tungsten Deposition, Ion Implant, CVD Oxide Dep, Titanium, Cobalt, Aluminum, Ta, TiN, Copper PVD and Copper Plating.

Engineer responsible for the following 6” equipment tool set: Tungsten Silicide Dep, Tungsten Dep, SOG (Spin-on Glass), and Silicon Nitride Dep processes.

Managed a team of process engineers and technicians at a 2” and 3” Bipolar Fab wafer fab in Corpus Christi, TX. Initially began career at this site as a Process Engineer responsible for Epitaxy, Diffusion, CVD, and PVD.