Ryan Lynes Email & Phone Number

Verona, Wisconsin, United States

I manage a highly technical and diverse team of electrical engineers, software engineers, and electronic technicians. Our team is responsible for designing, testing, and improving all point-of-load power supplies on our single-board computers (SBCs).

Verona, Wisconsin, United States

• I led a team that launched X-ES's XPm power module product line and grew it into a multi-million-dollar revenue stream for our company.
• Partnered with stakeholders and customers to drive XPm product specifications
• Designed and tested transient suppression, input protection, EMI filtering, power conversion, output current and voltage protection, onboard telemetry, and IPMI (Intelligent Platform Management Interface).
• Drove the PCB layout, part purchasing, and assembly of the initial prototype hardware
• Performed system-level electrical and environmental testing including MIL-STD-704 transient testing, MIL-STD-461 EMI testing, and MIL-STD-810 environmental testing
• Supported and fostered all aspects of our customer relationships including scheduling, answering technical questions, and providing system-level guidance

Verona, Wisconsin, United States

• I led X-ES’s Signal Integrity department and was responsible for designing high speed interfaces on X-ES’s complex single board computer (SBC) products. I ensured our high speed interfaces met stringent signal quality.
• Simulated DDR2, DDR3, PCIe, and other high speed serial and parallel interfaces
• Performed crosstalk analysis on every X-ES printed circuit board layout
• Collaborated with X-ES's PCB team to define the "best practice" layout rules for high speed signals
• Created X-ES's signal integrity process and high speed interface layout rules
• Improved vendor-provided IBIS and HSPICE models to more accurately simulate IC package and PCB parasitics

Verona, Wisconsin, United States