Ryan Lynes Email & Phone Number

Verona, Wisconsin, United States

I manage a highly technical and diverse team of electrical engineers, software engineers, and electronic technicians. Our team is responsible for designing, testing, and improving all point-of-load power supplies on our single-board computers (SBCs).

Verona, Wisconsin, United States

I led a team that launched X-ES's XPm power module product line and grew it into a multi-million-dollar revenue stream for our company. • Partnered with stakeholders and customers to drive XPm product specifications• Designed and tested transient suppression, input protection, EMI filtering, power conversion, output current and voltage protection, onboard telemetry, and IPMI (Intelligent Platform Management Interface).• Drove the PCB layout, part purchasing, and assembly of the initial prototype hardware• Performed system-level electrical and environmental testing including MIL-STD-704 transient testing, MIL-STD-461 EMI testing, and MIL-STD-810 environmental testing• Supported and fostered all aspects of our customer relationships including scheduling, answering technical questions, and providing system-level guidance • Created production-level manufacturing test procedures

Verona, Wisconsin, United States

I led X-ES’s Signal Integrity department and was responsible for designing high speed interfaces on X-ES’s complex single board computer (SBC) products. I ensured our high speed interfaces met stringent signal quality and timing requirements while developing new processes and infrastructure.• Simulated DDR2, DDR3, PCIe, and other high speed serial and parallel interfaces• Performed crosstalk analysis on every X-ES printed circuit board layout• Collaborated with X-ES's PCB team to define the "best practice" layout rules for high speed signals• Created X-ES's signal integrity process and high speed interface layout rules• Improved vendor-provided IBIS and HSPICE models to more accurately simulate IC package and PCB parasitics

Verona, Wisconsin, United States