S. Mark Borowicz

S. Mark Borowicz Email and Phone Number

CEO & President at Pure Wafer Inc (Private Equity) @ Pure Wafer
S. Mark Borowicz's Location
San Jose, California, United States, United States
S. Mark Borowicz's Contact Details

S. Mark Borowicz personal email

S. Mark Borowicz phone numbers

About S. Mark Borowicz

S. Mark Borowicz is a CEO & President at Pure Wafer Inc (Private Equity) at Pure Wafer. He possess expertise in product marketing, semiconductor industry, semiconductors, r&d, metrology and 20 more skills.

S. Mark Borowicz's Current Company Details
Pure Wafer

Pure Wafer

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CEO & President at Pure Wafer Inc (Private Equity)
S. Mark Borowicz Work Experience Details
  • Pure Wafer
    President & Ceo
    Pure Wafer Nov 2018 - Present
    San Jose, California, Us
    Edgewater Capital Partners - Private Equity
  • Auburn University, Samuel Ginn College Of Engineering
    Advisory Board Member
    Auburn University, Samuel Ginn College Of Engineering Apr 2022 - Present
    Auburn, Al, Us
    Advisory Board for Mechanical & Materials Engineering Department at Auburn University
  • Nanometrics
    Executive Vice President (Eng, R&D, Mfg, Service, Supply Chain, Procurement & Rev)
    Nanometrics Aug 2016 - Mar 2018
    Milpitas, Us
    • Corporate Officer (Sec. 16) reporting to the CEO with P&L responsibility over ~400 people & >$260M Rev; quarterly reviews to the Board of Directors & Extensive Presentations to top Executives in the Industry.• Responsible for Engineering, R&D, Supply Chain, Procurement, Manufacturing, Service world-wide, Sales Operations, New Product Development and Introduction.• Created a dedicated R&D group specific for forward looking technology endeavors in applications & product enhancements that resulted in a strengthened multi-year roadmap of the core business & new organic applications spaces for future growth. Reduced time-to-market for new product introductions through rigorous PLC process.• Instituted new operational processes & disciplines in supply chain to focus on vendor management, cycle time reductions >25%, quality improvements, second sourcing and cost reductions (>3% GM increase). • Created a master scheduling & planning organization that can function at new record level revenues in 2017 & 2018 (>25% revenue increase over previous peak with 3x the product portfolio & 2x the customer base)• Revamped Service group that now contributes Gross Margins of ~50% (>10% increase) & is growing revenue at >10% YoY; Decreased I&W costs by >50% by focusing on training, defined metrics & new sub-component service strategy.• Planned, created & hired individuals for a New Product Group spun out of R&D that is focused on a new growth opportunity outside the company core with a TAM Expansion of >$1 Billion for the company.
  • Nanometrics
    Sr. Vice President -Commercial & Revenue (Product/Field Marketing, Sales, Service, Field Operations)
    Nanometrics Mar 2013 - Aug 2016
    Milpitas, Us
    • Corporate Officer (Sec. 16) reporting to the CEO - responsible for all Product & Field Marketing, World-wide Sales, Sales Operations, Service & Program Management; Direct reports include VP of Sales & Sales Operations, VP of Service, 4x Country Presidents & 3x Business Unit VP’s responsible for Product/Field Marketing and Program Management. (>150 people); quarterly reviews to the Board of Directors• Spearheaded new businesses in semiconductor foundries that increased contributive company revenue from <1% to >25% in this sector which greatly decreased the company’s dependence on memory spending cycles.• Transformed Product Life Cycle within company & galvanized two generations of roadmaps for all products lines while creating strategic partnerships within the industry. New Atlas III product was strongest & fastest ramp in company history contributing >50% to total product sales in 1st year; increases in Average Sales Prices >18%; improved Gross Margins and expanded Market Share.• Drove revenue from ~$144M in 2013 to >$260M in 2017 within a near zero growth industry (WFE) by penetration of new accounts, marketing value messaging and strategic product development. Increased Gross margins by ~$6% via Average Sales Prices growth (>25%) during this period. • Drove significant increases in market share to capture >50% of SAM with the 6 largest device manufactures in the world. Taiwan Semiconductor Manufacturing Corporation (TSMC), Samsung, Hynix, Toshiba, Micron, UMC, Intel Memory, Global-Foundries and Others• Planned, created & hired individuals for a New Product Software Group that focused on value marketing & external partnerships of current & future products in data analytics to leverage positions in the fab. Increased revenue 20x over 3 years.• Reached >50% Market Share in overall OCD market; >80% Market Share in 3D-NAND OCD & >40% in Foundry OCD; all for both Stand-Alone (Atlas Platform) & Integrated Metrology (Impulse Platform) markets.
  • Kla-Tencor
    Sr. Director And Head Of Narrowband (Puma) Marketing (Wafer Inspection Division)
    Kla-Tencor Aug 2010 - Mar 2013
    Milpitas, California, Us
  • Kla-Tencor
    Sr. Director And Head Of Marketing For Films And Scatterometry Technologies (Fast) Division
    Kla-Tencor Apr 2009 - Aug 2010
    Milpitas, California, Us
  • Kla-Tencor
    Director Of Sales & Business Development Ww For Wafer Inspection (Win) Division
    Kla-Tencor May 2007 - Apr 2009
    Milpitas, California, Us
  • Kla-Tencor
    Director Of Business Development Us & Europe For The Wafer Inspection Group (Wig)
    Kla-Tencor Nov 2005 - Nov 2008
    Milpitas, California, Us
  • Formfactor Inc.
    Director Of Field Marketing
    Formfactor Inc. May 2005 - Nov 2005
    Livermore, Ca, Us
  • Kla-Tencor
    Project Manager & Scientist K-T Labs (R&D)
    Kla-Tencor May 2003 - May 2005
    Milpitas, California, Us
  • Kla-Tencor
    Ww Sales & Product Marketing Manager - E-Beam Review Division
    Kla-Tencor Oct 2001 - May 2003
    Milpitas, California, Us
  • Kla-Tencor
    Senior Applications Engineer (Electron Beam)
    Kla-Tencor May 2000 - Oct 2001
    Milpitas, California, Us

S. Mark Borowicz Skills

Product Marketing Semiconductor Industry Semiconductors R&d Metrology Cross Functional Team Leadership Product Lifecycle Management Product Management Engineering Management Product Development Design Of Experiments Thin Films Business Development Product Launch Pricing Manufacturing Ic Failure Analysis Electronics Forecasting Roadmap Field Marketing Strategic Negotiations Strategic Selling Skills Miller Heiman

S. Mark Borowicz Education Details

  • Auburn University, Samuel Ginn College Of Engineering
    Auburn University, Samuel Ginn College Of Engineering
    Materials Engineering
  • University Of Pennsylvania
    University Of Pennsylvania
    Finance & Accounting For The Non-Financial Manager
  • Stanford University Graduate School Of Business
    Stanford University Graduate School Of Business
    Stanford Executive Institute Class
  • West Virginia University
    West Virginia University
    Mechanical Engineering
  • Calvert Hall College High School
    Calvert Hall College High School

Frequently Asked Questions about S. Mark Borowicz

What company does S. Mark Borowicz work for?

S. Mark Borowicz works for Pure Wafer

What is S. Mark Borowicz's role at the current company?

S. Mark Borowicz's current role is CEO & President at Pure Wafer Inc (Private Equity).

What is S. Mark Borowicz's email address?

S. Mark Borowicz's email address is sm****@****hoo.com

What is S. Mark Borowicz's direct phone number?

S. Mark Borowicz's direct phone number is (408) 875*****

What schools did S. Mark Borowicz attend?

S. Mark Borowicz attended Auburn University, Samuel Ginn College Of Engineering, University Of Pennsylvania, Stanford University Graduate School Of Business, West Virginia University, Calvert Hall College High School.

What skills is S. Mark Borowicz known for?

S. Mark Borowicz has skills like Product Marketing, Semiconductor Industry, Semiconductors, R&d, Metrology, Cross Functional Team Leadership, Product Lifecycle Management, Product Management, Engineering Management, Product Development, Design Of Experiments, Thin Films.

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