Experience in PCB Design for 5.5 years on High-speed interface boards, RF Boards, Commercial Boards, Package layouts, and penalization from Low-complex to High-complex designs in Cadence Allegro, Altium designer, Mentor Graphics PADS, and Expedition EDA Tools.Experience in Substrate level IC package layout for 2 years, Good design knowledge of Wire bond and Flipchip technology.Worked and have design exposure on Reliability (Temp cycle, Drop Test, Bend Board) Test Boards and Strip Board for array mounting of IC packages as Assembly side inputs.Having 1 years of experience in Circuit board servicing and troubleshooting in textile products and experience in product installation and commissioning in Textile equipment. Always looking forward to entering into an expertised electronics organization for further improvements.