- Spearheaded foundry project management, overseeing PMIC, AD-DC, DC-DC converter, and Lighting IC product lines, contributing to improvement in production yield over three years.- Enhanced collaboration with FAB engineering teams (TSMC, UMC, SMIC, SK Keyfoundry), driving yield stability and improvements through Continuous Improvement Programs (CIP) and Best Known Methods (BKM).- Led critical technology and product transfers during the COVID-19 crisis, ensuring uninterrupted wafer capacity by facilitating global and intra-fab transfers across TSMC and UMC to SMIC and SK Keyfoundry.

- Developed streamlined processes for FAB and offshore teams, improving mass production efficiency and yield improvement activities.- Cultivated strong supplier relationships, maximizing company benefits and securing priority support during critical production phases.- Navigated multicultural work environments with high EQ, effectively managing diverse teams and suppliers to achieve optimal outcomes through mutual respect and understanding.

- Directed the development and lifecycle management of diverse product lines including Mouse, PC Cam, object tracking, and sensors, fostering seamless integration between foundry operations and internal teams.Foundry Site Collaboration: - Led partnership with foundry allies to streamline the New Product Tape-Out (NTO) schedule, significantly enhancing yield improvements and conducting in-depth failure analyses for customer RMA cases. - Championed Continuous Improvement Programs (CIP) and Best Known Methods (BKM), significantly boosting product quality and reliability. - Orchestrated technology and process transfers among RD teams globally, ensuring effective communication and negotiation to secure critical resources.Internal Operations Leadership: - Collaborated with Project Leaders, IC Designers, and Project Managers to underpin chip characterization efforts, propelling performance and yield enhancements. - Ensured product alignment with customer specifications, internal cost-saving objectives, and mass production criteria, contributing to the company’s competitive advantage in the market.

- Spearheaded the comprehensive management of the color filter and micro-lens mass production processes, focusing on strategic defect reduction and yield optimization to enhance product quality and manufacturing efficiency. - Performed in-depth evaluations of color filter and micro-lens production processes to meet diverse customer specifications, ensuring adherence to stringent quality standards. - Led groundbreaking technology transfers from research and development (R&D) to production, integrating innovative advancements into VisEra’s manufacturing capabilities, thereby positioning the company at the forefront of industry innovation. - Maintained direct engagement with key clients, including OmniVision Technologies, Kodak, and Himax Imaging, aligning production processes with their specific requirements and expectations, which fostered strong client relationships and secured VisEra’s reputation for quality and reliability.

- Instrumental in advancing CIS (Charge-Coupled Image Sensor) technology, utilizing my deep expertise in photo/lithography engineering to enhance pixel photodiode layouts, significantly improving sensor performance and manufacturing efficiency.- Played a key role in the development and successful mass production launch of the 0.11 CIS project in 2008, demonstrating exceptional capability in transforming innovative concepts into market-ready solutions.- Led a team of process integration engineers as the PIE team leader, where I honed my leadership skills, effectively prioritizing and implementing strategic process improvements that maximized operational efficiency and customer value.- Received prestigious recognition and an award from OmniVision Technologies for our team’s outstanding contributions to CIS technology, underscoring our dedication to excellence and customer satisfaction.- The experience and challenges encountered at TSMC fueled my pursuit of deeper CIS process knowledge, leading to a strategic career move to VisEra, where I specialized further in color filter and micro-lens processing, marking a significant step towards specialized foundry processes.

- Managed the CMOS Image Sensor (CIS) product line, providing essential technology support and ensuring compliance with TSMC's stringent design rules, thereby upholding the company’s standards for excellence in manufacturing.- Conducted thorough reviews of customer New Tape-Out (NTO) products with a focus on pixel photodiode layouts, offering expert recommendations to ensure alignment with TSMC design standards, which bolstered product reliability and performance.- Fostered and maintained strategic relationships with major customers including Cypress, Agilent (now AVAGO), Thomson, DALSA, and OmniVision Technologies (OVT), delivering customized support and sharing deep technical expertise to meet their unique needs.- Spearheaded a groundbreaking stitching project with DALSA that integrated two masks into a single comprehensive chip design, showcasing innovation and adaptability in addressing complex engineering challenges.- Led a specialized team dedicated to OmniVision, TSMC’s largest CIS client, playing a critical role in customer service excellence and the development of cutting-edge products, which solidified the client's market leadership.- Oversaw the seamless transition of 0.13 CIS technology from R&D to mass production, exemplifying strong leadership and mastery in technology transfer processes, significantly enhancing operational efficiency and product quality.- Directed process optimizations that markedly improved CIS performance under my team's leadership, contributing significantly to OmniVision's dominant position in the sensor market during that period, highlighting a commitment to technological advancement and customer success.

- Directed a high-performing team to achieve significant operational improvements, focusing on rework reduction and productivity enhancement for I-line scanners, which led to a notable increase in Wafer per Hour (WPH) output.- Played a pivotal role in collaboration with the R&D OPC team to develop Optical Proximity Correction (OPC) for PO1 and ME1 models, contributing to key advancements in lithography technology.- Secured the lowest rework rate among all 8-inch fabs, establishing FAB8 as the benchmark for operational efficiency during my tenure.- Implemented diverse strategies to augment I-line scanner productivity, including optimizing high NA/Sigma settings, reducing reticle realignment and dummy images, and refining developer recipes. These initiatives elevated I-line scanner WPH from 62 to 78, positioning FAB8 as a leader in performance among 8-inch fabs.- Selected by senior management for a critical role in supporting the establishment of FAB10 in Shanghai, entailing the transfer of advanced logic processes, workforce training, equipment qualification, and troubleshooting. These efforts significantly accelerated FAB10’s ramp-up to full production capability.- Advocated for and achieved a departmental transfer to Lithography R&D to deepen my expertise in lithography technology, reflecting a proactive approach to professional development and specialization.- Transitioned to a Process Integration Engineer role in February 2005, marking a strategic move to broaden my industry knowledge and contribute further to semiconductor manufacturing innovation and efficiency.

- Completed extensive training in lithography technology, mastering equipment such as ASML scanner level 1, TET track, KLA Tencor-5300 Overlay (OVL) measurement tool, KLA Teocor-8100 CD-SEM, and Hitachi CD-SEM, which formed the foundation for my technical expertise in photolithography.- Assigned ownership of CD-SEM and OVL tools, where I led efforts in collaboration with electrical engineers and vendors to significantly improve tool repeatability and reproducibility (R&R), optimizing performance for advanced technology nodes (0.18/0.15/0.14 µm).- Developed and implemented company-wide standard rules for CD-SEM and OVL measurement locations, markedly improving the accuracy and efficiency of experimental data acquisition and analysis.- Served as the pilot run engineer for the 0.18 logic technology at Fab8, orchestrating comprehensive coordination across all process layers for critical window checks and photoresist strip (PRS) definition. This role involved close collaboration with the R&D Lithography department, STM, and Texas Instruments, enhancing my experience in effective technology transfer.- Contributed to the integration and qualification of the ASML 750 series scanner for the 0.15 logic technology at Fab8, further advancing my knowledge and expertise in cutting-edge scanner technologies.- Essential to the successful qualification of the ASML-750 lens, I facilitated the seamless transition of Fab8 to 0.15 logic production, underscoring my role in maintaining TSMC’s leadership in semiconductor manufacturing technology.