Sam Thompson Email & Phone Number

Greater Los Angeles Area

Chicago

• Senior NPI Manager for Advanced Technologies Team, responsible for planning and coordinating between Supply Chain, Development Engineering, and Suppliers to bring new and advanced technologies into Motorola Products

Chicago

• Global Category Manager for Electro-Mechanical Components, including Speakers, Earpieces, Microphones, Vibrators, and LDS Antenna Subassemblies, for all Motorola Mobility Products• Managed over $150M Annual Spend, with Full Ownership of Supplier Relationships• Maintained Technical Roadmap and Preferred Supplier List for Electro-Mechanical Categories, to align with Strategic Sourcing Strategies including Cost, Quality, Capacity, and Technical Capabilities• Held Quarterly Business Reviews and Managed Supplier Scorecards to Monitor and Drive Cost, Quality, Delivery, and Innovation• Used Data-Driven Cost Modeling to Negotiate Best Cost at Launch, and drive Quarterly Cost Reductions, to exceed business targets• Ensured supplier capacity was committed to meet forecast quantities, and drove suppliers to resolve all component shortages without affecting production• Worked with Legal Team to Negotiate and Enforce Corporate Supplier Agreements, to ensure Favorable Business Terms and Commitments from Suppliers• Additional role and responsibility as Senior Procurement Manager and Mechanical Product Cost Manager, for all Mechanical components on Droid Turbo Smartphone• Drove supplier selection, performed supplier capacity analysis, and owned mechanical product BOM cost • Drove design changes with engineering team, to proactively achieve cost reductions• Beat target cost goal by 7% on assigned components• Joined NPI Team for 3 months, to successfully manage and recover from a 3 week schedule slip due to late design changes

Plantation, Fl

• Electrical Engineering Lead for iDEN projects developed by HiP Singapore ODM Team, responsible for product definition, design, development, cost, and product launch.• Participated in RFQ Process and Price Negotiations with HiP for BOM, Headcount, and Value Added costs, to ensure product cost met business case requirements.• Held regular design reviews to drive engineering teams to debug issues and meet performance, cost, and schedule requirements.• Interfaced with Mechanical, SW, Manufacturing, Marketing, Sales, Industrial Design, Quality, and Senior Management Teams to successfully coordinate and resolve issues to complete projects.• Responsible for interfacing with multiple customers to define product features and requirements, as well as resolve issues during development and in the field.

Penang, Malaysia And Singapore

• Expatriate Assignment in Singapore 2009-2011• Expatriate Assignment in Penang, Malaysia 2006-2009• Project Lead and Technical Lead for multiple iDEN projects developed by Motorola Penang Design Center, Motorola Singapore Design Center, and Foxconn ODM Design Team in Shenzhen China • Successfully trained and expanded the Penang Electrical Engineering Team from 20 engineers to over 50 engineers, capable of running up to 4 simultaneous projects.• Successfully led and developed products with Foxconn ODM Design Team in Shenzhen China• Successfully transferred iDEN Product Development from Penang, Malaysia to Singapore during company reorganization, without disrupting product schedules• Responsible for product definition, cost, design, development, and product launch. Interfaced with Mechanical, SW, Manufacturing, Marketing, Sales, Industrial Design, Quality Team, and Senior Management to successfully complete projects.• Drove resolution of high priority cross-discipline development issues by working closely with product team, suppliers, and factory.• Resolved critical supply constraint with graphics accelerator IC by working with a new supplier to design an alternate, cost reduced, replacement IC into next generation iDEN products. Solution required working closely with supplier and software team, to qualify part in time for product launch. • Developed Low-Cost 2-sided Display module, to reduce product cost and thickness, by working closely with suppliers, mechanical, and SW teams• Developed and implemented a Platforming Strategy of Re-Use, to support 3 different products using common electrical architecture requiring minimal component changes. Strategy achieved significant cost savings across the product family.

Plantation, Fl

• Digital Electrical Engineer in charge of Displays, Processors, Memories, Cameras, and Backlighting on multiple iDEN Products.• Responsible for Introduction of First iDEN Color Display Product, and First iDEN Camera Phone• Worked closely with SW Team, Mechanical Team, and Factory to drive and resolve all critical issues during product development.• Electrical Interface to Taiwanese JDM Team, to develop a dual-mode iDEN/GSM Phone. Responsibilities included product cost and architecture definition, design reviews, driving resolution of all issues during development, and reporting status to senior management.• Electrical Lead and Interface to Penang Malaysia electrical engineering team, to develop and launch of their first Class-A project.• Performed Audits and Run-Rate Certifications at Display Module Suppliers, Flex Suppliers, and JDM Manufacturing Supplier. Supported Manufacturing Builds at Motorola and External factories.• Developed and Qualified a Cost-Reduced Display Module, for cost savings of over $2 per unit on a high volume low-tier handset.

Bachelor Of Science (Bs), Electrical Engineering, Highest Honors

Bachelor Of Science (Bs), Computer Engineering, High Honors