• Developed structural & thermal design and CAE simulation for flexible printed circuits(FPC) bonding process development and direct the improvement of pad mismatch, heating and curing of anisotropic conductive film(ACF) for new Apple products from prototype to production. • Created the FEA model in identifying the direct bonding, soft to hard lamination and OCA peeling simulation for state-of-the-art curvature cover glass products. • Directed and worked closely with teams of technical… Show more • Developed structural & thermal design and CAE simulation for flexible printed circuits(FPC) bonding process development and direct the improvement of pad mismatch, heating and curing of anisotropic conductive film(ACF) for new Apple products from prototype to production. • Created the FEA model in identifying the direct bonding, soft to hard lamination and OCA peeling simulation for state-of-the-art curvature cover glass products. • Directed and worked closely with teams of technical professionals to solve issues and meet client's request and provided CAE skills to mechanical engineering processes achieving improvement in quality and finding root causes. • Established numerical thermo-mechanical material database using both experimental measurement and finite element analysis(FEA) for product design and studies. • Currently working on FPC bonding, wafer laser dicing, optical film forming, optical and structural adhesive film performance and evaluating product designs, mechanical, fracture and thermal properties of materials and process integration by CAE simulation. Show less

• Led non-matching mesh algorithm in all structural analysis module for Moldex3D R14 and future versions.• Improved the predication of mechanical properties of fiber filled composite by introducing orientation average scheme for all filler type composite in Moldex3D.• Formulated the calculation of Coefficients of Thermal Expansion of Mori-Tanaka model for fiber filled composite in Moldex3D.• Introduced more analytical solutions of Eshelby inclusions for Mori-Tanaka model to fit… Show more • Led non-matching mesh algorithm in all structural analysis module for Moldex3D R14 and future versions.• Improved the predication of mechanical properties of fiber filled composite by introducing orientation average scheme for all filler type composite in Moldex3D.• Formulated the calculation of Coefficients of Thermal Expansion of Mori-Tanaka model for fiber filled composite in Moldex3D.• Introduced more analytical solutions of Eshelby inclusions for Mori-Tanaka model to fit various shapes of fillers in Moldex3D.• Resolved permanent issue of warpage tendency predication by introducing above improvements with 90% up accuracy improved and verified more than 20+ plastic parts from clients for Moldex3D.• Collaborated with MSC software Co. to develop interface program between Digimat and Moldex3D with ABAQUS, ANSYS and others commercial structural FEA software integrating the molding and structural simulation for fiber-filled reinforced composite material. Show less

• Numerical Analysis for Physical Therapy in National Cheng Kuang University.

• Conducted hex head cap screws machine’s fracture mode and stress reducing for San Shing Fastech Co..

• Completed consultant project of evaluating vibration characteristics of floating slab track of Taipei MRT Luzhou line.• Fulfilled consultant project of floating slab track on rail slab track system with pier, viaduct, rock layer and various kind of RC decks for Taichung MRT.• Collaborated with railway engineering and architect group and researched optimized floating slab design for vibration reduction.