Sam Wu

Sam Wu Email and Phone Number

Advanced package development Manager /Bumping business unit @ SPIL 矽品
Sam Wu's Location
Taichung City, Taichung City, Taiwan, Taiwan, Province of China
About Sam Wu

~19 years packaging experience and focus on leading cross function department operations for product Management and development.Specialties:-Advanced package development for bumping related field specialist,BKM build up (Micro bump/C4/Front side RDLµ pad on Glass)and project management(WLCSP ,CuP,)-Process Integration : Semiconductor process ( Release layer ,Photo ,Dry film ,Descum ,Photo RDL µ pad ,plating,C4 ,AOI ,Bond.Grinding,Silicon wet-etching,CVD,CMP.BSM.-Product: Mold wafer BSM,CoWoS-S ,Micro Bump ,Fan out WLCSP ，Fan out embedded bridge(FO-EB),Fan out POP,Fan out MD.CoWoS-L.-Design DRC and TRA -Operations Management,Yield monitor,CIP trigger-Quality CIP ,Reliability monitor,Failure Analysis,Simulation of warpage ,thermal

Sam Wu's Current Company Details
SPIL 矽品

Spil 矽品

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Advanced package development Manager /Bumping business unit
Sam Wu Work Experience Details
  • Spil 矽品
    Advanced Package Development Manager
    Spil 矽品 Jan 2006 - Present
    Taichung City, Taichung City, Taiwan
    2020 Feb ~ Recent-Process development for bumping related field (Micro bump/C4/Front side RDLµ pad on Glass)and project management-Process Integration : Release layer ,Photo ,Dry film ,Descum ,Plating ,Bond AOI .) Product: WLCSP ,Micro Bump ,Fan out WLCSP (POP, FO-EB,) -Yield reviewed ,CIP ,DPA analysis-RFI/RFQ Quotation -Design Rule Review/Check,DRC and TRA-Porject management by Gannt Chart Monitor for tooling,Fab out time slot monitor -FAI.CZ.Corner study… Show more 2020 Feb ~ Recent-Process development for bumping related field (Micro bump/C4/Front side RDLµ pad on Glass)and project management-Process Integration : Release layer ,Photo ,Dry film ,Descum ,Plating ,Bond AOI .) Product: WLCSP ,Micro Bump ,Fan out WLCSP (POP, FO-EB,) -Yield reviewed ,CIP ,DPA analysis-RFI/RFQ Quotation -Design Rule Review/Check,DRC and TRA-Porject management by Gannt Chart Monitor for tooling,Fab out time slot monitor -FAI.CZ.Corner study -Reliability Monitor ,PRU ,Audit -FMEA,control plan ,flow chart ,routing ,recipe define2015 – 2020Position: ManagerBumping product integrated department/ Technical support for WLCSP Product2010 – 2015 SPIL, Taichung, TaiwanPosition: Customer service Account managerTechnical support for North America/Europe customer service2006-2009 SPIL, Taichung, Taiwan Position: Senior Engineer of product developmentFlip chip product development /WLCSP product project management Show less
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Sam Wu Skills

Product Management Project Management Product Development Semiconductors Cross Functional Team Leadership Operations Management Manufacturing Product Engineering Product Marketing Reliability Scrum Engineering Management Electronics Semiconductor Industry Six Sigma Ic Asic Analog Soc

Sam Wu Education Details

Frequently Asked Questions about Sam Wu

What company does Sam Wu work for?

Sam Wu works for Spil 矽品

What is Sam Wu's role at the current company?

Sam Wu's current role is Advanced package development Manager /Bumping business unit.

What schools did Sam Wu attend?

Sam Wu attended National Formosa University.

What skills is Sam Wu known for?

Sam Wu has skills like Product Management, Project Management, Product Development, Semiconductors, Cross Functional Team Leadership, Operations Management, Manufacturing, Product Engineering, Product Marketing, Reliability, Scrum, Engineering Management.

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