Sam Wu Email & Phone Number

~19 years packaging experience and focus on leading cross function department operations for product Management and development.Specialties:-Advanced package development for bumping related field specialist,BKM build up (Micro bump/C4/Front side RDLµ pad on Glass)and project management(WLCSP ,CuP,)-Process Integration : Semiconductor process ( Release layer ,Photo ,Dry film ,Descum ,Photo RDL µ pad ,plating,C4 ,AOI ,Bond.Grinding,Silicon wet-etching,CVD,CMP.BSM.-Product: Mold wafer BSM,CoWoS-S ,Micro Bump ,Fan out WLCSP ，Fan out embedded bridge(FO-EB),Fan out POP,Fan out MD.CoWoS-L.-Design DRC and TRA -Operations Management,Yield monitor,CIP trigger-Quality CIP ,Reliability monitor,Failure Analysis,Simulation of warpage ,thermal

Listed skills include Product Management, Project Management, Product Development, Semiconductors, and 15 others.

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  Advanced Package Development Manager

  Spil 矽品

  Jan 2006 - Present - Taichung City, Taichung City, Taiwan

  2020 Feb ~ Recent-Process development for bumping related field (Micro bump/C4/Front side RDLµ pad on Glass)and project management-Process Integration : Release layer ,Photo ,Dry film ,Descum ,Plating ,Bond AOI .) Product: WLCSP ,Micro Bump ,Fan out WLCSP (POP, FO-EB,) -Yield reviewed ,CIP ,DPA analysis-RFI/RFQ Quotation -Design Rule Review/Check,DRC and TRA-Porject management by Gannt Chart Monitor for tooling,Fab out time slot monitor -FAI.CZ.Corner study… Show more 2020 Feb ~ Recent-Process development for bumping related field (Micro bump/C4/Front side RDLµ pad on Glass)and project management-Process Integration : Release layer ,Photo ,Dry film ,Descum ,Plating ,Bond AOI .) Product: WLCSP ,Micro Bump ,Fan out WLCSP (POP, FO-EB,) -Yield reviewed ,CIP ,DPA analysis-RFI/RFQ Quotation -Design Rule Review/Check,DRC and TRA-Porject management by Gannt Chart Monitor for tooling,Fab out time slot monitor -FAI.CZ.Corner study -Reliability Monitor ,PRU ,Audit -FMEA,control plan ,flow chart ,routing ,recipe define2015 – 2020Position: ManagerBumping product integrated department/ Technical support for WLCSP Product2010 – 2015 SPIL, Taichung, TaiwanPosition: Customer service Account managerTechnical support for North America/Europe customer service2006-2009 SPIL, Taichung, Taiwan Position: Senior Engineer of product developmentFlip chip product development /WLCSP product project management Show less

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  National Formosa University

  Aeronautical Engineering