Senior Mechanical Engineer
CurrentSenior Mechanical Engineer on next generation Datacenter hardware.
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Sam H. is listed as Senior Mechanical Engineer at NVIDIA, based in Sugar Land, Texas, United States. AeroLeads shows a matched LinkedIn profile for Sam H..
Sam H. previously worked as Mechanical Design Lead - xEMU Spacesuit (NASA) at Jacobs and Senior Mechanical Engineer - xEMU Spacesuit (NASA) at Jacobs. Sam H. holds Bsme, Mechancial Engineering from University Of Central Florida.
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New product development engineer with experience launching new products across multiple industries; consumer, IT and energy. A technically proficient mechanical engineer, specializing in program and project management, product development, design oversight, drawings and 3D modeling, redesigns and enhancements, process improvement, stakeholder relations, and research and investigations. My core technical skills are complex CAD assemblies, electronics packaging, injection, blow and compression molding, plastic materials, CNC machining, sheet metal, weldments, and FEA.
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Santa Clara, Ca, Us
Senior Mechanical Engineer on next generation Datacenter hardware.
Dallas, Tx, Us
Next Generation Display and Control Unit (xDCU) sub-system Design Lead for the xEMU Next Generation Spacesuit for NASA missions to space, the Moon and eventually Mars. The xEMU is essentially a spacecraft the astronaut enters to perform tasks in the realm of space outside the ISS space station or on the moon. The xDCU is a small electronic control box mounted in the chest area of the suit. The astronaut interfaces with the xDCU to control and/or monitor different subsystems on the suit. The Design Lead is the main point of contact for all design and development activities on the xDCU. This includes working with project team, stress analyst, drafters, designers and the NASA sub-system lead to provide timely, cost-effective design solutions that meet program requirements.• Responsible for DCU sub-system CAD model, drawings and overall quality, creativity and delivery of the DCU per NASA requirements• Coordinates with xEMU Design Integration Lead to ensure all work is consistent across program• Directs DCU team to accomplish the design plan as required by NASA• Provides bi-weekly update via Power Point presentation in live meeting format with NASA customer and cross functional team• Mentors younger engineers and new hires • Reviews and approves all drawings, tolerance analyses and CAD models prior to submitting to NASA• Serves as main point of contact for all development and design activities on the sub-system• Maintains Bill of Materials, meeting minutes, and all relevant documentation for project
Dallas, Tx, Us
Senior Design Engineer on the xDCU sub-system for the xEMU next generation spacesuit. Designed xDCU back cover plate with moon dust proof vent filter. Served as primary engineer for high pressure O2 recharge system from the xDCU to the suit oxygen tanks. Created concept for O2 recharge flex line clamp to restrain and route lines around the waistband of the suit. Found, evaluated and selected several quick disconnect connectors for use in the high pressure O2 recharge lines during design verification testing. Created a concept of the Service and Cooling connector inside the xDCU that yielded a 55% reduction in weight.• Participate in weekly design reviews and provide solutions to problems that arise• Provide concept CAD models for team review using PTC CREO• Maintain subassembly BOM files in PTC Windchill• Create Power Point presentations that concisely explain design challenges and pitch solutions to the customer and team• Create manufacturing drawings for release to production per NASA ASME Y14.5 standards.• Perform vector tolerance analyses to ensure parts will fit into assembly• Assist procurement to find vendors for sourced components that meet technical requirements• Provide general mechanical support to the team and mentor younger engineers
Lysaker, Oslo, No
Operated as lead mechanical engineer for the ZXPLR node cradle to grave design and development. The ZXPLR is 3500m rated subsea autonomous electronic seismic sensor package ROV deployed for offshore seismic surveys. Primary focus on delivering production ready CAD models, assemblies and drawings for the entire ZXPLR program in CREO/Windchill. Provided BOMs, assembly drawings/procedures, and part quotations to manufacturing and purchasing to implement NPI builds. Primary mechanical engineer for any production start up issues. Beyond new product development duties, provided mechanical hardware design support for operations, suppliers and manufacturing. Other projects included lithium ion charger/data recorders, various electronic packagesusing NEMA 4x boxes, external production tooling and internal manufacturing fixtures (3d printed and machined) for PCA wave soldering and battery assembly. • Lead design engineer for the ZXPLR node successful product launch in 2017, with node generating more than 50% of deep- water acquisition revenue for 2019-2020. 8000+ nodes have been built to date.• Patent pending component design for a field serviceable sub-sea 6,000-psi-rated connector system, U.S. Patent application 16/003226. Managed design from concept to production. Organized all design validation pressure testing and qualified new supply chain for production (molding and machinists).• Submitted pending patent for design of modular automated node charging system robot, fully automated charging system to reduce HSE personnel exposure offshore. U.S. Patent Application 16/597555.• Managed implementation of new material supply chain for ZXPLR housings. Sourced new suppliers for raw material and heat-treating. Created specifications and QC controls to ensure final material met design specifications. Coordinated with testing labs to validate material properties prior to production start.
Houston, Texas, Us
Design engineer on BL660 and BL460 Graphics expansion blades. Provided general mechanical design support for the blade group. Worked closely with electrical, thermal and tooling engineers to ensure robust and cost-effective designs that met development schedules. Coordinated with overseas supplier (Lotes/Foxconn/Inventec) to ensure final tooled product met design intent, cost and quality specifications (HALT/HASS testing). • Designed custom CPU processor clamp or ‘Integrated Loading Mechanism (ILM)’ for damage-free CPU processor installation on ISS servers in the factory and field, resulting in significant cost savings due to reduction in scrapped motherboards.• Re-designed plastic ‘ears’ for c7000 enclosure; updated style, form and function to include new locating sensor hardware and follow Gen 8 blade industrial design ethos. This sensor uniquely identified each enclosure location in the racks. • Provided general mechanical design support for G8 BL660 blade, including cable prototype layouts, heatsink design support and DIM baffle redesign.
Katy, Texas, Us
Researched new technologies, materials and manufacturing processes for new and existing products either to innovate the top line or reduce the bottom line.• Developed R&D relationships with existing and new suppliers, serving as a liaison between company and suppliers in the development and coordination of new product research.• Coordinated with product development stakeholders to implement new technology, including marketing, manufacturing, purchasing, quality and legal departments.• Organized polyurethane foam trials to validate new lower cost formulation with 10-15% reduction in material cost. Worked with the production lead to source latest metering equipment leading to significant scrap and downtime cost reductions. Provided production troubleshooting as needed. • Provided technical support to the development team regarding materials, feasibility analysis, design challenges, prototyping, costing and testing.• Technical lead to develop new electric solid-state semi-conductor Peltier cooling device or ‘thermo-electric’. Worked with chip supplier to create new high performance ‘engine’ by optimizing the hot-side heat sink/fan performance. Increased performance 20-30%. • Developed an in-house tool using basic heat transfer equations to model cooler thermal performance or ‘ice retention’. The cooler size and thickness of insulation could be entered into excel and the tool would provide an answer in ‘days’ with 90% accuracy.
Orlando, Fl, Us
Engineered and managed new products from inception to manufacturing for multiple global markets: US, Latin America, Asia and Europe. • 2005 received Presidents Award for high-speed development of electro-mechanical sales display device for critical new ‘Flat-Out’ bowl product launch.• Design patent holder for Latin America Pasta Dispenser product, D559,615.• 2006, 4 month extended stay overseas in Belgium and France. Managed several critical projects during stay including the ‘Slice N Dice’ chopper. Brought experience back to synergize the development process for global ISO 9001 implementation.• Oversaw and approved creation of CAD drawings. Provided detailed sketches and technical direction for CAD engineers.• Provided on-site problem solving during production pilot runs or ‘debugging’. • Sourced unique spin-welding machine technology for overseas supplier to resolve quality issues with an insulated food thermos product. Implemented necessary design changes for re-tooling and managed all validation and QC testing.• Extensive travel experience to manufacturing sites including; China, Mexico, Costa Rica, Belgium, France, and USA.
Orlando, Fl, Us
Worked as an intern while in school and was hired full time upon graduation. • Created and Modified CAD solid models and product drawings• Verified design specifications, worked with engineers and designers to ensure design intent was met and model details (parting lines, drafts, shutoffs) were built correctly. • Participated in project team meetings, providing design solutions for technical problems during the development process to achieve a balance of cost, quality and timeliness.
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Quick answers generated from the profile data available on this page.
Sam H. works for NVIDIA.
Sam H. is listed as Senior Mechanical Engineer at NVIDIA.
Sam H. is based in Sugar Land, Texas, United States while working with NVIDIA.
Sam H. has worked for Nvidia, Jacobs, Magseis Fairfield Asa, Hewlett-Packard, and Igloo Products Corp..
Sam H.'s colleagues at NVIDIA include ✨️Anat Rozen, Madhureshwar Tyagi, Shmuel Mauda, Julian De La Rosa, and Mark Watson.
You can use AeroLeads to view verified contact signals for Sam H. at NVIDIA, including work email, phone, and LinkedIn data when available.
Sam H. holds Bsme, Mechancial Engineering from University Of Central Florida.
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