Samuel H. Kim, Phd Email and Phone Number
Samuel H. Kim, Phd work email
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Samuel H. Kim, Phd personal email
Highly motivated Thermal Electronics Design Engineer with experience in development of novel electronics cooling solutions, thermo-electrical packaging design, and reliability analysis through 8+ years of graduate study. Expertise in performing multi-physics based simulation to link semiconductor device physics with thermo-electrical phenomena. Simulations are performed both at the device and chip levels. Self-motivated in determining design challenges, opportunities, and direction.
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Senior Staff Mechanical EngineerLockheed Martin Sep 2022 - PresentBethesda, Md, Us -
Electronics Thermal EngineerGeorgia Institute Of Technology Aug 2017 - Aug 2022Atlanta, Georgia , Us* Research Interests- Thermally aware design for high power density ultra-wide bandgap power electronics- Thermal methodologies to characterize ultra-wide bandgap power electronics- Design of thermally-efficient and durable power electronics modules- Micro/nano scale heat transport phenomena* Projects- Field Emitter Robust Vacuum Integrated Nanoelectronics [Funded by Air Force Office of Scientific Research (AFOSR)]- Gallium Oxide Materials Science and Engineering (Funded by AFOSR)- Research of Novel Device Development of New and Emerging Semiconductor Technologies (Funded by Air Force Research Laboratory through KBR Wyle)- Gallium Oxide Packaging and Thermal Management Challenges and Opportunities [Funded by the National Renewable Energy Laboratory for the U.S. Department of Energy (DOE)] -
Techincal Research PersonnelKorea Institute Of Industrial Technology Jul 2014 - Jul 2017Worked in Micro/Nano Scale Manufacturing R&BD Group* Research Area- Printed electronics & 3D bioprinting* Projects- Development of non-vacuum and non-lithography based Cu interconnect technology for TFT backplane- Drop-on-demand printing of thermally responsive polymer for 3D functional microstructure- Development of solution-based micro/nano processed electronic bandage for active drug delivery for smart electronic bandage- Development of combination of roll-to-roll and electrohydrodynamic jet (EHD-jet) printing for real-time continuous manufacturing system with pattern inspection & repair- Development of fabrication process by utilizing inkjet printing using masking ink for patterning smart thin film device- Development of printed separator for 3D nano-structured super capacitor -
Graduate Research AssistantGeorgia Institute Of Technology May 2012 - May 2014Atlanta, Georgia , Us* Thesis: Addressing thermal and environmental reliability in GaN based high electron mobility transistors (HEMTs)- Characterization of GaN HEMTs using micro-Ramana spectroscopy regarding their reliability- Thermal/Structural analysis of HEMTs with finite element method- Barrier film effect study on HEMTs using atomic layer deposition (ALD) coating* Project: Conduction Cooling Limits for Power Semiconductor Nanostructures (Funded by DARPA Near Junction Thermal Transport (NJTT) Program)
Samuel H. Kim, Phd Skills
Samuel H. Kim, Phd Education Details
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Georgia Institute Of TechnologyMechanical Engineering -
Georgia Institute Of TechnologyMechanical Engineering -
Yonsei UniversityMechanical Engineering -
University Of MinnesotaMechanical
Frequently Asked Questions about Samuel H. Kim, Phd
What company does Samuel H. Kim, Phd work for?
Samuel H. Kim, Phd works for Lockheed Martin
What is Samuel H. Kim, Phd's role at the current company?
Samuel H. Kim, Phd's current role is Senior Member of Engineering Staff at Lockheed Martin.
What is Samuel H. Kim, Phd's email address?
Samuel H. Kim, Phd's email address is sa****@****ech.edu
What schools did Samuel H. Kim, Phd attend?
Samuel H. Kim, Phd attended Georgia Institute Of Technology, Georgia Institute Of Technology, Yonsei University, University Of Minnesota.
What are some of Samuel H. Kim, Phd's interests?
Samuel H. Kim, Phd has interest in Volleyball, Soccer, Golf.
What skills is Samuel H. Kim, Phd known for?
Samuel H. Kim, Phd has skills like Reliability Test, Heat Transfer, Raman Microscopy, Transistors, Atomic Layer Deposition, Thin Film Coating, Characterization, Semiconductors, Materials Science, Finite Element Analysis, Statistics, Comsol.
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