Sateesh Bajikar Email & Phone Number

San Jose, CA, US

Developing MEMS and conventional piezoelectric ultrasound transducers and imaging probes for a novel medical ultrasound imaging technology. Responsible for all probe-related development activities- including transducer and probe design, material selection, transducer design and characterization, system integration, managing contracted engineers, local and.

Analyzed and represented public interests in telecom broadband deployment, operation subsidies for regulated carriers, tariffs for NG911 services; water utility acquisitions; provided testimony in court as an expert witness.

Developing a tactile sensor technology for multiple medical applications- research, IP development, preparing grant applications.

San Jose, CA, US

• Developed head-integrated metal and semiconductor thermistor-based “touchdown sensor” for head-media contact and media defect detection. Took sensor from concept to product and the sensor is currently used in all hard.
• Addressed head-disk tribology related drive failure issues using with a wide range of diagnostic tools/techniques and improve fundamental understanding of head-media interface; incorporated slider-biasing feature into.
• Developed and demonstrated prototypes of capacitance-based sensors for head-media contact, spacing, fly height and dynamic head orientation measurements.

• Lead engineer for developing micro shear stress (skin friction) sensor arrays for the detection of turbulence onset in airflow. Conceived designed and delivered prototypes of new sensor design for measuring true.
• Designed, modeled, fabricated and delivered sensors for testing based on the ‘fence-type’ sensor concept.
• Provided FEA analyses and MEMS design support for the James Webb Space Telescope- microshutters project and superconducting transition edge IR imaging sensors.

CA

• Designed the next generation optical cross-connect switch- a piezoelectrically-actuated beam-steering collimator, for functional and cost requirements, built prototypes to prove key design issues.
• Analyzed and simulated electromechanical and piezoresistive sensor characteristics of a silicon micro mirror device for a large photonic cross connect application.
• Designed and set up electromechanical wafer and die characterization test systems.
• Helped transition the device into manufacturing, did reliability and failure analyses and testing.

• Managed the fabrication of custom microstructures for several customers: interfaced with customers, undertook cost calculations and prepared quotes, scheduled projects to meet shipment targets.
• Developed two new wafer-bonding processes and transitioned one into production for silicon accelerometers resulting in a jump in yield from 40% to 65%.
• Supported manufacturing operations and improved yields for photolithography manufacturing operations 60% to 95 % through improved processes and operating practices.
• Developed microfluidic devices for DNA sequencing: high-voltage (2kV) silicon capillary electrophoresis devices, PCR well chips; modeled piezoelectric micropipettes; analyzed and remedied.

Lemont, IL, US

• Developed Hard X-ray based LIGA MEMS technology for microwave cavity based particle accelerator applications.

Doctoral research in atom probe development and silicon field emitter arrays,