Track record of successfully developing and delivering MEMS and microsensors technology solutions at research laboratories, startups and large corporations. Experienced in-• MEMS device design; FEA simulation and modeling; process development and fabrication; packaging; experimental characterization and test; high volume manufacturing transition and support; failure analyses and troubleshooting; materials analyses techniques.• silicon and non-silicon microfabrication processing techniques and tools• diverse sensing (piezoresistive, capacitive, thermal) and actuation (electrostatic, thermal, piezoelectric) principles• user/customer interaction; project coordination; overseeing engineers and technicians
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Director, Mems Transducer DevelopmentMaui Imaging Sep 2019 - PresentSan Jose, Ca, UsDeveloping MEMS and conventional piezoelectric ultrasound transducers and imaging probes for a novel medical ultrasound imaging technology. Responsible for all probe-related development activities- including transducer and probe design, material selection, transducer design and characterization, system integration, managing contracted engineers, local and overseas vendors and development partners, biocompatibility and safety testing. PI for NSF SBIR phase I grant for developing optimized MEMS ultrasound transducers for the system- demonstrated MEMS ultrasound transducers with significant SNR improvement over initial prototypes.Devised schemes/algorithms for the implementation of Doppler/flow measurements in the ultrasound imaging system and illumination/beamforming improvements for improved image quality. -
Utilities EngineerCalifornia Public Utilities Commision 2018 - 2019Analyzed and represented public interests in telecom broadband deployment, operation subsidies for regulated carriers, tariffs for NG911 services; water utility acquisitions; provided testimony in court as an expert witness.
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Consultant, Mems And Microsensor Development__ 2017 - 2019
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Co-FounderTactiliuum 2017 - 2018Developing a tactile sensor technology for multiple medical applications- research, IP development, preparing grant applications.
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Senior Principal EngineerWestern Digital 2008 - 2016San Jose, Ca, Us• Developed head-integrated metal and semiconductor thermistor-based “touchdown sensor” for head-media contact and media defect detection. Took sensor from concept to product and the sensor is currently used in all hard disk drives. Designed modeled and experimentally characterized sensor performance; coordinated wafer builds and transitioned sensor to and supported high volume manufacturing. Worked with cross functional teams to facilitate and optimize use and implementation of sensor into hard disk products.• Addressed head-disk tribology related drive failure issues using with a wide range of diagnostic tools/techniques and improve fundamental understanding of head-media interface; incorporated slider-biasing feature into heads for improving head-media interface robustness.• Developed and demonstrated prototypes of capacitance-based sensors for head-media contact, spacing, fly height and dynamic head orientation measurements. -
Senior Systems EngineerNasa-Gsfc -Mei/Qss 2004 - 2008• Lead engineer for developing micro shear stress (skin friction) sensor arrays for the detection of turbulence onset in airflow. Conceived designed and delivered prototypes of new sensor design for measuring true biaxial shear stress. http://www.techbriefs.com/component/content/article/9543• Designed, modeled, fabricated and delivered sensors for testing based on the ‘fence-type’ sensor concept. • Provided FEA analyses and MEMS design support for the James Webb Space Telescope- microshutters project and superconducting transition edge IR imaging sensors.
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Senior Mems Design EngineerXros / Nortel Networks 2000 - 2003Ca• Designed the next generation optical cross-connect switch- a piezoelectrically-actuated beam-steering collimator, for functional and cost requirements, built prototypes to prove key design issues. • Analyzed and simulated electromechanical and piezoresistive sensor characteristics of a silicon micro mirror device for a large photonic cross connect application.• Designed and set up electromechanical wafer and die characterization test systems. • Helped transition the device into manufacturing, did reliability and failure analyses and testing. -
Research ScientistEg&G / Perkin Elmer Ic Sensors 1997 - 2000• Managed the fabrication of custom microstructures for several customers: interfaced with customers, undertook cost calculations and prepared quotes, scheduled projects to meet shipment targets. • Developed two new wafer-bonding processes and transitioned one into production for silicon accelerometers resulting in a jump in yield from 40% to 65%. • Supported manufacturing operations and improved yields for photolithography manufacturing operations 60% to 95 % through improved processes and operating practices. • Developed microfluidic devices for DNA sequencing: high-voltage (2kV) silicon capillary electrophoresis devices, PCR well chips; modeled piezoelectric micropipettes; analyzed and remedied materials/process-biocompatibility issues.
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Post Doctoral ScientistArgonne National Laboratory 1996 - 1997Lemont, Il, Us• Developed Hard X-ray based LIGA MEMS technology for microwave cavity based particle accelerator applications. -
Research AssistantUniversity Of Wisconsin- Madison 1989 - 1996Doctoral research in atom probe development and silicon field emitter arrays,
Sateesh Bajikar Education Details
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University Of Wisconsin-MadisonMaterials Science
Frequently Asked Questions about Sateesh Bajikar
What company does Sateesh Bajikar work for?
Sateesh Bajikar works for Maui Imaging
What is Sateesh Bajikar's role at the current company?
Sateesh Bajikar's current role is MEMS and Microsensor Development.
What schools did Sateesh Bajikar attend?
Sateesh Bajikar attended University Of Wisconsin-Madison.
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