Focused on NPI (New product development), Very experienced at identifying the perfect partners for developing products to exceed corporate expectations, Love to develop new products, work with diverse teams, travel and build successful long lasting partnerships, internally or anywhere in the world. Comfortable working with all engineering disciplines and all levels of manufacturing to build and guide to the proper relationships for rapid success.

Logic specialized in contracted product development. Personally responsible for project management and deliverables for cross-functional teams, Mechanical, Electrical, Software - through to production release of products to customers specifications. Focused on medical, defense and commercial industries.

Cambridge was purchased by Biamp

Hardware engineering: New product development, Schematic design, hardware debug, signal integrity, Reliability/component characterization, product sustaining engineering, Working in close partnership with hardware and software design groups to help accurately and efficiently deliver projects...areas of high experience include managing and driving outsourced product development (domestic or internationally) including; architectural concepts, rapid prototyping, production. Many years of expertise including; Negotiating, purchasing, partner sourcing, budget management, project management.

For a manufacturer of Integrated Chips (IC) for the communications industry, oversee new product development, product maintenance, customer support, silicon validation lab, operations, purchasing, and facilities management. Hands-on manage the development and deployment of six generations of design verification and validation systems to support custom silicon devices. Own capital and expense department budgets up to $2,000,000. Direct the design, procurement, assembly, and fabrication of all WAN PCB products and systems, building five to fifty prototype units of up to five to six different board products concurrently. Provide project management interfacing between electrical engineering, software engineering, mechanical engineering, external suppliers, and manufacturing. Directly manage outside services: PCB layout, mechanical engineering, assembly CM's, and PCB fabrication. Operations management for Alpha, Beta and RMA devices including testing, screening, custom marking, proper packaging, handling and shipping. Design and manage four R&D Application-Specific Integrated Circuit (ASIC) post validation labs.

Schematic design of complex digital and analog boards, including component engineering for DfM, AVL control, library and documentation control. Logical and physical design and debugging experience includes: NPU's, optical phy's, utopia, GigE, RGMII, DDR1&2, I2C, SRAM NOBL / QDR2, POTS, PCI, PCIe, POS / UTP, T1/E1, SPI, TDM, CPCI, PTMC, uTCA, and ATCA.; Supervise device characterization analysis and production level device testing processes and screening methodologies, including Cisco GSM approved screens. Subject matter expert in all areas of PCB rework for board and system level. Highly experienced with all aspects of BGA rework, removal, reballing, and sockets. Experience building quick-turn prototype PCB fabrications in China. Set up and manage an international PCB design center in Dubai, interviewing and hiring PCB designers and electrical designers.Implemented cost saving techniques resulting in current Fiscal Year savings of $200,000+.

Served as the Senior PCB Designer and Group Leader for a PCB design team of six, performing layout of high frequency PCB's (10Gb / s). Designs included matched DIFF pairs, ECL, RF, and controlled impedance. Reviewed and approved all PCB layouts for DfM prior to fabrication and assembly.