Sandeep Bharathi Email and Phone Number
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Innovative technology and strategic business leader with 25+ years of progressive experience in delivering cutting edge products in the semiconductor industry. Successful track record of leadership and management in the development, execution and new product introduction of end-to-end solutions that span CPUs, GPUs, ASICs, FPGAs, SOC/IP subsystem and software serving various end markets including servers, desktop, cloud computing, consumer electronics, wired and wireless telecom infrastructure and data centers. * Highly refined organizational design and transformation skills demonstrated by success in hiring, building for scale, motivating and leading global teams and organizations in start-up, mid and big sized companies across functions and geographies.* Collaborative leader connecting product strategy, technology roadmap, planning and execution with a keen understanding of finance, business and market dynamics that has led to the introduction of > 100 products generating in excess of $50B in lifetime revenue.* Extensive experience in negotiation and developing effective long term strategic relationships with customers, foundry partners, packaging, testing, design services and EDA vendors.* Deep experience on end to end product development across multiple process technology nodes in digital and analog VLSI design including architecture, RTL, verification, logic and circuit design, process technology, DFT, manufacturing test and system validation.
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President, Data Center GroupMarvell TechnologyCalifornia, United States -
Chief Development OfficerMarvell Technology Jun 2022 - PresentSanta Clara, Ca, UsOversees product development for various end markets in advanced process technologies. Leader in digital and mixed-signal design, IP and product development. -
Executive Vice President, Central Engineering System-On-Chip GroupMarvell Technology Apr 2021 - Jun 2022Santa Clara, Ca, Us -
Senior Vice President, Central EngineeringMarvell Technology Feb 2019 - Apr 2021Santa Clara, Ca, Us -
Vice President, Programmable Solutions GroupIntel Corporation Oct 2016 - Feb 2019Santa Clara, California, Us -
Vice PresidentXilinx Nov 2010 - Oct 2016San Jose, Ca, UsFPGA & MPSoC design and product development on Virtex, Kintex, Artix and Zynq product families. -
Director, EngineeringAmd Sep 2003 - Nov 2010Santa Clara, California, Us• Project leader responsible for productizing Clustered Multi-Thread “Bulldozer” 32nm server processor core and successfully enabling product launch of Opteron server SOC by managing a multi-function 200+ member team comprising design, verification, architecture, platform and system debug. • Successfully led a multi-site 130+ member team in the design and development of the 32nm “Bulldozer” server core and “Piledriver” client core CPUs culminating in Opteron server SOC booting Windows within 3 days of package arrival. “Piledriver” core was targeted at Trinity Fusion APU. - Orchestrated tactical and strategic product life cycle & roadmap planning, execution and day-to-day operational management of high performance CPU design methodology for high frequency & performance, low power and platform scalability. Managed technical tradeoffs in various domains that included CAD, circuit & process technology, design methodology and integration leading to core IP delivery on time.• Started a new initiative within AMD evangelizing and setting up the SOC center of excellence in the areas of process technology, package, test and verification across all of SOC Processor projects to enable rapid execution by sourcing IPs across various sites and divisions.• Served as the focal point for strategic roadmaps for 45nm, 32nm SOC chips, socket compatibility, process variance working with product planning, marketing, server and client architecture teams.PRODUCTS: Athlon64, Opteron, Turion line (90nm, 65nm):• Successfully managed the delivery of the first dual core & single core processor on 65nm from RTL to tapeout in record time of 9 months. Boot-strapped dual-site (Boston & Sunnyvale) design capability managed a high performing multi site team of 50 engineers/technical leads. Enabled product introduction within 9 months from first tapeout, has now sold over 60 million CPUs. -
Sr Staff EngineerMobilian Corporation (Acquired By Intel Corp) Mar 2001 - Sep 2003Design and Development of Bluetooth and 802.11 Chipsets• Architected and implemented SOC circuit design and CAD methodologies for the first TrueRadioTM combo 802.11b and Bluetooth digital baseband and MAC chip on TSMC 0.18u process resulting in functional silicon on first tapeout. Drove silicon characterization, debug of functional yields, FA process and design correlation for volume ramp.• Successfully drove design porting and tapeout for the first product to a new foundry (Silterra) 0.18u process in record time of 2 months. This cost reduction exercise saved 20% of manufacturing cost on the baseband chipset.• Managed methodology and technical specs with foundry (TSMC), packaging (ChipPAC) and testing (Credence) vendors.
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Staff Engineer,Intel Corporation Jul 1995 - Mar 2001Santa Clara, California, UsDesign and Development of Pentium Pro, Pentium II, Pentium 4PRODUCTS: Pentium 4 (0.13u -2.2 GHz, 0.18u -1.8Ghz), Pentium II & Pentium Pro (0.5, 0.35, 0.25u)• Led an 8 person team in the vertical design of integer fireball execution unit on Pentium 4 (0.13u) towards a successful tapeout and product introduction. This was a key component in the high frequency NetBurst Architecture since it operated at twice the core clock frequency at 4.4 GHz.• Chaired a project task force on Dual Vt replacement techniques for domino circuits, Hot E degradation mechanism for full chip and proliferated the implementation of best practices across project team.• Drove the speed debug of high frequency paths on first silicon rev of Pentium 4 (0.18u), root caused early Si speed paths and implemented fixes to meet frequency goals for production within one year of tapeout. Responsible for the timing/noise/layout convergence of the execution engine for Pentium 4 revisions to a target of 1600 MHz.• Pioneered & productized the design and development of double pumped domino (ping-pong) design for the X86 flag generation unit which was used to replace self-resetting dynamic logic and saved 6 months in design time for the same performance. This was later proliferated through out the Pentium 4 design staff.• Designed memory store array and control block on Pentium II that exceeded functional and performance goals.• Performed standard cell library characterization and ported IO designs to 0.35 micron that met or exceeded frequency and performance goals. Key to product ramp of 0.35u Pentium Pro.
Sandeep Bharathi Skills
Sandeep Bharathi Education Details
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Stanford University Graduate School Of BusinessGsb Stanford Executive Program -
New Jersey Institute Of TechnologyElectrical Engineering -
Bangalore UniversityElectronics -
National CollegePre University
Frequently Asked Questions about Sandeep Bharathi
What company does Sandeep Bharathi work for?
Sandeep Bharathi works for Marvell Technology
What is Sandeep Bharathi's role at the current company?
Sandeep Bharathi's current role is President, Data Center Group.
What is Sandeep Bharathi's email address?
Sandeep Bharathi's email address is sa****@****ail.com
What is Sandeep Bharathi's direct phone number?
Sandeep Bharathi's direct phone number is +140855*****
What schools did Sandeep Bharathi attend?
Sandeep Bharathi attended Stanford University Graduate School Of Business, New Jersey Institute Of Technology, Bangalore University, National College.
What are some of Sandeep Bharathi's interests?
Sandeep Bharathi has interest in Children, Civil Rights And Social Action, Education, Environment, Poverty Alleviation, Science And Technology.
What skills is Sandeep Bharathi known for?
Sandeep Bharathi has skills like Processors, Microprocessors, Semiconductors, Asic, Fpga, Soc, Eda, Engineering Management, Static Timing Analysis, Cross Functional Team Leadership, System On A Chip, Program Management.
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